JPS61134039U - - Google Patents

Info

Publication number
JPS61134039U
JPS61134039U JP1986004131U JP413186U JPS61134039U JP S61134039 U JPS61134039 U JP S61134039U JP 1986004131 U JP1986004131 U JP 1986004131U JP 413186 U JP413186 U JP 413186U JP S61134039 U JPS61134039 U JP S61134039U
Authority
JP
Japan
Prior art keywords
substrate
protrusion
solder
hole
reference numeral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986004131U
Other languages
English (en)
Other versions
JPS6211014Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986004131U priority Critical patent/JPS6211014Y2/ja
Publication of JPS61134039U publication Critical patent/JPS61134039U/ja
Application granted granted Critical
Publication of JPS6211014Y2 publication Critical patent/JPS6211014Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】
第１図は本考案の１実施例を示す図である。第
１図において参照数字１はプリント基板、参照数
字２はスルーホール、参照数字３はヒートシンク
、参照数字４は突起部分、参照数字５はハンダ、
参照数字６は外層回路、参照数字７はＩＣチツプ
、参照数字８は熱伝導性接着剤、参照数字９はリ
ード、参照数字１０はＩＣの端子部、参照数字１
１はプリント基板パツドをそれぞれ示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 スルーホールを有する基板と、 この基板の前記スルーホールに挿入できる突起
    部を有する冷却板と、 前記突起部が挿入された状態で前記基板と前記
    突起物との間の空隙を充填するハンダと、 このハンダに密着して前記基板にとりつけられ
    たチツプとを含むことを特徴とする高密度回路パ
    ツケージ。
JP1986004131U 1986-01-16 1986-01-16 Expired JPS6211014Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986004131U JPS6211014Y2 (ja) 1986-01-16 1986-01-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986004131U JPS6211014Y2 (ja) 1986-01-16 1986-01-16

Publications (2)

Publication Number Publication Date
JPS61134039U true JPS61134039U (ja) 1986-08-21
JPS6211014Y2 JPS6211014Y2 (ja) 1987-03-16

Family

ID=30479408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986004131U Expired JPS6211014Y2 (ja) 1986-01-16 1986-01-16

Country Status (1)

Country Link
JP (1) JPS6211014Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021059914A1 (ja) * 2019-09-25 2021-04-01 日立Astemo株式会社 電子回路装置
WO2024142542A1 (ja) * 2022-12-27 2024-07-04 日立Astemo株式会社 電気回路体および電力変換装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4896447U (ja) * 1972-02-17 1973-11-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4896447U (ja) * 1972-02-17 1973-11-16

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021059914A1 (ja) * 2019-09-25 2021-04-01 日立Astemo株式会社 電子回路装置
JPWO2021059914A1 (ja) * 2019-09-25 2021-04-01
WO2024142542A1 (ja) * 2022-12-27 2024-07-04 日立Astemo株式会社 電気回路体および電力変換装置

Also Published As

Publication number Publication date
JPS6211014Y2 (ja) 1987-03-16

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