JPS6142846U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6142846U
JPS6142846U JP1985101139U JP10113985U JPS6142846U JP S6142846 U JPS6142846 U JP S6142846U JP 1985101139 U JP1985101139 U JP 1985101139U JP 10113985 U JP10113985 U JP 10113985U JP S6142846 U JPS6142846 U JP S6142846U
Authority
JP
Japan
Prior art keywords
stage
lead
base body
aluminum layer
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985101139U
Other languages
English (en)
Inventor
禎一 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1985101139U priority Critical patent/JPS6142846U/ja
Publication of JPS6142846U publication Critical patent/JPS6142846U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ１第１図ｂは連接リードフレームの成形工程を
示すためのリードフレームの平面図、第２図ａ乃至第２
図Ｃは本考案による製造工程及び本考案一実施例の半導
体装置を示す説明図、第３図は最終工程前のリードフレ
ームの斜視図、第４図は本考案に係る半導体装置の斜視
図である。 １・・・リードフレーム用板、１ ａ， １ ｂ，
”・，ｎ・・・リードフレーム、２・・・鉄一ニッケル
合金板、３・・・アルミニウム層、４・・・グイステー
ジ、５・・・ボンデイングフィンガー、６・・・半導体
チップ、７，１１・・・低融点ガラス、８・・・アルミ
ニウム線、９・・・ベース、１０−・・キャップ、１５
ａ，１５ｂ， ・・・，１５ｎ・・・半導体装置。

Claims (1)

  1. 【実用新案登録請求の範囲】 セラミックからなる基体及び蓋と、 該基体上に設けられたグイステージと、 該基体上であって該ダイステージの周縁に設けられたリ
    ードとを有し、 前記グイステージ表面及び前記リードのボンデイング領
    域表面にアルミニウム層が被着されており、 前記グイステージ表面のアルミニウム層上に半導体チッ
    プが第１の低融点ガラスによって固着され、 該半導体チップと前記リードのボンデイング領域がアル
    ミニウムのボンデイングワイヤで電気的に接続され、 前記リードが前記基体と蓋によって挾まれ、且つ前記基
    板と蓋が第２の低融点ガラスによつそ接着されてなるこ
    とを特徴とする半導体装置。
JP1985101139U 1985-07-04 1985-07-04 半導体装置 Pending JPS6142846U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985101139U JPS6142846U (ja) 1985-07-04 1985-07-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985101139U JPS6142846U (ja) 1985-07-04 1985-07-04 半導体装置

Publications (1)

Publication Number Publication Date
JPS6142846U true JPS6142846U (ja) 1986-03-19

Family

ID=30660580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985101139U Pending JPS6142846U (ja) 1985-07-04 1985-07-04 半導体装置

Country Status (1)

Country Link
JP (1) JPS6142846U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235451U (ja) * 1988-08-29 1990-03-07

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4936776A (ja) * 1972-08-10 1974-04-05
JPS502232A (ja) * 1973-04-30 1975-01-10
JPS503090U (ja) * 1973-05-09 1975-01-13

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4936776A (ja) * 1972-08-10 1974-04-05
JPS502232A (ja) * 1973-04-30 1975-01-10
JPS503090U (ja) * 1973-05-09 1975-01-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235451U (ja) * 1988-08-29 1990-03-07

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