JPS62149190A - Manufacture of ceramic circuit board - Google Patents
Manufacture of ceramic circuit boardInfo
- Publication number
- JPS62149190A JPS62149190A JP29014985A JP29014985A JPS62149190A JP S62149190 A JPS62149190 A JP S62149190A JP 29014985 A JP29014985 A JP 29014985A JP 29014985 A JP29014985 A JP 29014985A JP S62149190 A JPS62149190 A JP S62149190A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- ceramic
- ceramic circuit
- pattern
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、セラミック回路基板の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of manufacturing a ceramic circuit board.
第３図は従来からのセラミック回路基板を示す本ので一
図において、１は平板状のセラミック基板、２はこの基
板１上に印刷等によシ形成した導体パターンである。FIG. 3 is a book showing a conventional ceramic circuit board. In the figure, 1 is a flat ceramic substrate, and 2 is a conductor pattern formed on this substrate 1 by printing or the like.
一般に曲面状のセラミック基板表面に回路ノＲターンを
印刷法によって形成することは困難であるため、従来で
は拳Ｎまたはフォトエツチングによって形成するか、あ
るいは平板状の回路基板を印刷法によシ形成していた。In general, it is difficult to form a circuit R-turn on the surface of a curved ceramic substrate by printing, so conventionally it has been formed by punch N or photo etching, or by printing on a flat circuit board. Was.
上記平板状の同勢基板の製作の一例としては、セラミッ
ク未焼成グリーンシートを平板に焼成し、このシート上
に導体パターンを印刷して焼成し回路パターンを形成し
てセラミック回路基板を作っていた。また曲面状のセラ
ミック基板の場合は蒸着若しくはフォトエツチングによ
って回路パターンを形成した。An example of manufacturing the above-mentioned flat homogeneous board is to create a ceramic circuit board by firing an unfired ceramic green sheet into a flat board, printing a conductor pattern on this sheet, and firing it to form a circuit pattern. . In the case of a curved ceramic substrate, a circuit pattern was formed by vapor deposition or photoetching.
従来のセラミック回路基板は以上のように構成されてい
るので、回路基板は平板状のものしか存在せず、回路基
板が曲面状の場合は回路パターンの形成は印刷法は不可
能であシ、たとえ蒸着やフォトエツチングで形成できた
としてもこの場合では製造コストが高価となる等の問題
点があった。Since conventional ceramic circuit boards are constructed as described above, only flat circuit boards exist, and if the circuit board is curved, it is impossible to form a circuit pattern using the printing method. Even if it could be formed by vapor deposition or photoetching, there would be problems such as high manufacturing costs in this case.
この発明は上記のような問題点を解消するためになされ
たもので、曲面状の回路基板に印刷法による回路ノミタ
ーンを形成することのできるセラミック回路基板の製造
方法を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method for manufacturing a ceramic circuit board in which a circuit pattern can be formed on a curved circuit board by a printing method.
この発明に係るセラミック回路基板の製造方法は、セラ
ミック未焼成グリーンシート上に導体パターンを印刷し
、グリーンシートを屈曲させ焼成したものである。The method for manufacturing a ceramic circuit board according to the present invention includes printing a conductor pattern on an unfired ceramic green sheet, bending the green sheet, and firing the green sheet.
この発明におけるセラミック回路基板の製造方法は、導
体パターンを印刷したセラミック未焼成グリーンシート
を屈曲させて焼成したことで、曲面に成形された回路基
板と共に曲面を有する回路パターンが得られる。In the method for manufacturing a ceramic circuit board according to the present invention, a ceramic unfired green sheet printed with a conductor pattern is bent and fired, thereby obtaining a circuit board formed into a curved surface and a circuit pattern having a curved surface.
以下この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図において、１はＬ形に屈曲されたセラミック基板
で、２はこの基板ｌの表面に印刷法によって形成された
導体・ξターンである。第２図は上記セラミック基板１
の他の屈曲形状例で、円弧形に屈曲したものである。In FIG. 1, 1 is a ceramic substrate bent into an L shape, and 2 is a conductor/ξ turn formed on the surface of this substrate l by a printing method. Figure 2 shows the above ceramic substrate 1.
This is another example of a bent shape, which is bent into an arc shape.
上記のように構成したセラミック回路基板の農作は、ま
ず、ドクターブレード法によって成形されたセラミック
未焼成グリーンシート（厚さ帆ｌ動以下）の表面にスク
リーン印刷法によりタングステンペースト等の導体回路
パターンを印刷する。To farm the ceramic circuit board configured as described above, first, a conductor circuit pattern such as tungsten paste is applied by screen printing on the surface of an unfired ceramic green sheet (thickness less than 1 inch) formed by the doctor blade method. Print.
その後、上記のシートを所定の成形型に挿入して上記回
路、ｏターンと共に焼成して第１図や第２図に示すよう
な屈曲したセラミック基板１および曲面を有する導体回
路パターン２をもつセラミック回路基板が製作できる。Thereafter, the above-mentioned sheet is inserted into a predetermined mold and fired together with the above-mentioned circuit and an O-turn, resulting in a ceramic having a bent ceramic substrate 1 and a curved conductor circuit pattern 2 as shown in FIGS. 1 and 2. Circuit boards can be manufactured.
なお、このように製作された回路基板は回路ノミターン
２に導体メッキを行なうと共に端子付けを行ない部品が
実装される。Incidentally, in the circuit board manufactured in this manner, the circuit board 2 is plated with a conductor, terminals are attached, and components are mounted.
なお、セラミック回路基板の屈曲形状は実施例ではＬ形
や円弧形のものについて示したが、Ｕ字形やその他の屈
曲形状のものであってよい。Although the bent shape of the ceramic circuit board is L-shaped or arc-shaped in the embodiments, it may be U-shaped or other bent shapes.
以上説明したようにこの発明によれば、セラミック未焼
成グリーンシート上に導体ノミターンを印刷し、このシ
ートを屈曲状態にして焼成させたことによシ、曲面に回
路パターンを有する屈曲したセラミック回路基板が安価
に得られる。また、この回路基板は小型化が図れ、機器
コーナ一部の曲面部分に収納可能となシ、かつスペース
の有効利用が図れると共例、機器の小型化が可能となる
。As explained above, according to the present invention, conductor chisels are printed on an unfired ceramic green sheet, and this sheet is bent and fired, thereby creating a bent ceramic circuit board having a circuit pattern on the curved surface. can be obtained at low cost. Furthermore, this circuit board can be made smaller and can be stored in a curved part of a corner of the equipment, and space can be used more effectively, thereby making it possible to downsize the equipment.
第１崗および第２図はこの発明の一実施例によるセラミ
ック回路基板の各々の斜視図、第３図は従来のセラミッ
ク回路基板の斜視図である。
１・・・セラミック基板、２中溝体パターン。
なお、図中同一符号は同−又は相当部分を示す。1 and 2 are perspective views of a ceramic circuit board according to an embodiment of the present invention, and FIG. 3 is a perspective view of a conventional ceramic circuit board. 1...Ceramic substrate, 2 medium groove pattern. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (2)
ーンシート上にタングステン等によつて導体パターンを
印刷し、このグリーンシートを屈曲させて焼成すること
によつて曲面に回路パターンを有する基板を製作するこ
とを特徴とするセラミック回路基板の製造方法。(1) By printing a conductor pattern using tungsten or the like on an unfired ceramic green sheet using the doctor blade method, and then bending and firing the green sheet, a board with a circuit pattern on a curved surface is manufactured. A method for manufacturing a featured ceramic circuit board.
の曲面を有することを特徴とする特許請求の範囲第１項
記載のセラミック回路基板の製造方法。(2) The method for manufacturing a ceramic circuit board according to claim 1, wherein the ceramic circuit board has an L-shaped, arc-shaped, or U-shaped curved surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29014985A JPS62149190A (en) | 1985-12-23 | 1985-12-23 | Manufacture of ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29014985A JPS62149190A (en) | 1985-12-23 | 1985-12-23 | Manufacture of ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62149190A true JPS62149190A (en) | 1987-07-03 |
Family
ID=17752408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29014985A Pending JPS62149190A (en) | 1985-12-23 | 1985-12-23 | Manufacture of ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62149190A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01115265U (en) * | 1988-01-27 | 1989-08-03 | ||
| JPH02271980A (en) * | 1989-04-12 | 1990-11-06 | Inax Corp | Curved pottery with photograph and production thereof |
| JPH04502238A (en) * | 1989-10-02 | 1992-04-16 | ヒューズ・エアクラフト・カンパニー | Three-dimensional microcircuit structure and its manufacturing method from ceramic tape |
| CN105514097A (en) * | 2015-04-10 | 2016-04-20 | 郭垣成 | Bendable-ceramic COB LED light source sheet |
-
1985
- 1985-12-23 JP JP29014985A patent/JPS62149190A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01115265U (en) * | 1988-01-27 | 1989-08-03 | ||
| JPH02271980A (en) * | 1989-04-12 | 1990-11-06 | Inax Corp | Curved pottery with photograph and production thereof |
| JPH04502238A (en) * | 1989-10-02 | 1992-04-16 | ヒューズ・エアクラフト・カンパニー | Three-dimensional microcircuit structure and its manufacturing method from ceramic tape |
| CN105514097A (en) * | 2015-04-10 | 2016-04-20 | 郭垣成 | Bendable-ceramic COB LED light source sheet |
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