JPS62152148A - マイクロヒ−トパイプの注液方法 - Google Patents

マイクロヒ−トパイプの注液方法

Info

Publication number
JPS62152148A
JPS62152148A JP60295860A JP29586085A JPS62152148A JP S62152148 A JPS62152148 A JP S62152148A JP 60295860 A JP60295860 A JP 60295860A JP 29586085 A JP29586085 A JP 29586085A JP S62152148 A JPS62152148 A JP S62152148A
Authority
JP
Japan
Prior art keywords
cavity
fluid
condensable
heat pipe
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60295860A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0482060B2 (de
Inventor
Masahiko Ito
雅彦 伊藤
Tsuneaki Motai
恒明 馬渡
Masushi Sakatani
益司 坂谷
Masataka Mochizuki
正孝 望月
Katsuma Tanaka
勝磨 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP60295860A priority Critical patent/JPS62152148A/ja
Publication of JPS62152148A publication Critical patent/JPS62152148A/ja
Publication of JPH0482060B2 publication Critical patent/JPH0482060B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP60295860A 1985-12-25 1985-12-25 マイクロヒ−トパイプの注液方法 Granted JPS62152148A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60295860A JPS62152148A (ja) 1985-12-25 1985-12-25 マイクロヒ−トパイプの注液方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60295860A JPS62152148A (ja) 1985-12-25 1985-12-25 マイクロヒ−トパイプの注液方法

Publications (2)

Publication Number Publication Date
JPS62152148A true JPS62152148A (ja) 1987-07-07
JPH0482060B2 JPH0482060B2 (de) 1992-12-25

Family

ID=17826124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60295860A Granted JPS62152148A (ja) 1985-12-25 1985-12-25 マイクロヒ−トパイプの注液方法

Country Status (1)

Country Link
JP (1) JPS62152148A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109579581A (zh) * 2018-11-08 2019-04-05 大连理工大学 一种基于pdms的微热管封装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109579581A (zh) * 2018-11-08 2019-04-05 大连理工大学 一种基于pdms的微热管封装方法

Also Published As

Publication number Publication date
JPH0482060B2 (de) 1992-12-25

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