JPS62169433A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS62169433A
JPS62169433A JP61011770A JP1177086A JPS62169433A JP S62169433 A JPS62169433 A JP S62169433A JP 61011770 A JP61011770 A JP 61011770A JP 1177086 A JP1177086 A JP 1177086A JP S62169433 A JPS62169433 A JP S62169433A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor chip
electrode
electrode connection
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61011770A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0551179B2 (2
Inventor
Hironori Murakami
裕紀 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP61011770A priority Critical patent/JPS62169433A/ja
Publication of JPS62169433A publication Critical patent/JPS62169433A/ja
Publication of JPH0551179B2 publication Critical patent/JPH0551179B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP61011770A 1986-01-22 1986-01-22 半導体装置の製造方法 Granted JPS62169433A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61011770A JPS62169433A (ja) 1986-01-22 1986-01-22 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61011770A JPS62169433A (ja) 1986-01-22 1986-01-22 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS62169433A true JPS62169433A (ja) 1987-07-25
JPH0551179B2 JPH0551179B2 (2) 1993-07-30

Family

ID=11787208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61011770A Granted JPS62169433A (ja) 1986-01-22 1986-01-22 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS62169433A (2)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08236578A (ja) * 1995-03-01 1996-09-13 Nec Corp 半導体素子のフリップチップ実装方法およびこの実装方 法に用いられる接着剤
WO1997022994A1 (en) * 1995-12-15 1997-06-26 Matsushita Electric Industrial Co., Ltd. Method and device for electronic parts mounting and dispenser used therefor
JP2000299553A (ja) * 1999-04-13 2000-10-24 Ricoh Microelectronics Co Ltd 電子回路基板製造方法
JP2002538626A (ja) * 1999-03-03 2002-11-12 インテル・コーポレーション ２つの異なるアンダーフィル材料を有する制御崩壊チップ接続（ｃ４）集積回路パッケージ
US6482676B2 (en) 1997-01-09 2002-11-19 Fujitsu Limited Method of mounting semiconductor chip part on substrate
CN112968109A (zh) * 2020-11-27 2021-06-15 重庆康佳光电技术研究院有限公司 一种驱动背板及其制作方法
JPWO2023119469A1 (2) * 2021-12-22 2023-06-29

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0720958U (ja) * 1993-09-29 1995-04-18 陽 石川 開閉式遮蔽シート

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167340A (en) * 1980-05-27 1981-12-23 Toshiba Corp Junction of semicondctor pellet with substrate
JPS60262430A (ja) * 1984-06-08 1985-12-25 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS62132331A (ja) * 1985-12-05 1987-06-15 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167340A (en) * 1980-05-27 1981-12-23 Toshiba Corp Junction of semicondctor pellet with substrate
JPS60262430A (ja) * 1984-06-08 1985-12-25 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS62132331A (ja) * 1985-12-05 1987-06-15 Matsushita Electric Ind Co Ltd 半導体装置の製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08236578A (ja) * 1995-03-01 1996-09-13 Nec Corp 半導体素子のフリップチップ実装方法およびこの実装方 法に用いられる接着剤
WO1997022994A1 (en) * 1995-12-15 1997-06-26 Matsushita Electric Industrial Co., Ltd. Method and device for electronic parts mounting and dispenser used therefor
US6206066B1 (en) 1995-12-15 2001-03-27 Matsushita Electric Industrial Co., Ltd. Apparatus for mounting an electronic component
KR100317154B1 (ko) * 1995-12-15 2002-02-28 모리시타 요이찌 전자부품의조립방법과이에사용되는장치및디스펜서
US6527905B1 (en) 1995-12-15 2003-03-04 Matsushita Electric Industrial Co., Ltd. Method for mounting electronic components and apparatus and dispenser used in the method
US6482676B2 (en) 1997-01-09 2002-11-19 Fujitsu Limited Method of mounting semiconductor chip part on substrate
JP2002538626A (ja) * 1999-03-03 2002-11-12 インテル・コーポレーション ２つの異なるアンダーフィル材料を有する制御崩壊チップ接続（ｃ４）集積回路パッケージ
JP2000299553A (ja) * 1999-04-13 2000-10-24 Ricoh Microelectronics Co Ltd 電子回路基板製造方法
CN112968109A (zh) * 2020-11-27 2021-06-15 重庆康佳光电技术研究院有限公司 一种驱动背板及其制作方法
JPWO2023119469A1 (2) * 2021-12-22 2023-06-29

Also Published As

Publication number Publication date
JPH0551179B2 (2) 1993-07-30

Similar Documents

Publication Publication Date Title
JPH09237806A (ja) 半導体装置とその製造方法及びこの半導体装置を用いた実装構造体とその製造方法
JP2003133508A (ja) 半導体装置
JP2003007902A (ja) 電子部品の実装基板及び実装構造
JPS62169433A (ja) 半導体装置の製造方法
JPH08213425A (ja) 半導体装置およびその製造方法
JP3702062B2 (ja) 圧力センサ装置
JPS6351538B2 (2)
JPH0997815A (ja) フリップチップ接合方法およびそれにより得られる半導体パッケージ
JP3309832B2 (ja) 電子部品の接続構造及び接続方法
JP2699726B2 (ja) 半導体装置の実装方法
JP2000021935A (ja) 電子部品実装体及びその製造方法
JP2000058597A (ja) 電子部品実装方法
JP2812316B2 (ja) 半導体装置の製造方法
JP3006957B2 (ja) 半導体装置の実装体
CN104347547A (zh) 半导体封装件及其的制造方法
JP2841822B2 (ja) 混成集積回路の製造方法
JP2721790B2 (ja) 半導体装置の封止方法
JPH03116838A (ja) 半導体集積回路装置およびその製造方法
JPH1079403A (ja) 半導体装置及びその製造方法
JP2001085471A (ja) 電子部品の実装方法
JP2001257305A (ja) 樹脂封止型半導体装置及びその製造方法
JPH0677285A (ja) Ｉｃ素子の実装方法
JP2003324125A (ja) 半導体装置
JP3380058B2 (ja) バンプ転写用フレーム
JPH06232208A (ja) 半導体装置の封止方法と封止構造

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees