JPS62193723U - - Google Patents
Info
- Publication number
- JPS62193723U JPS62193723U JP8196786U JP8196786U JPS62193723U JP S62193723 U JPS62193723 U JP S62193723U JP 8196786 U JP8196786 U JP 8196786U JP 8196786 U JP8196786 U JP 8196786U JP S62193723 U JPS62193723 U JP S62193723U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- steam chamber
- processing apparatus
- heating section
- wafer processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図は本考案に係るウエハ処理装置の全体を
示す平面図、第２図はその側面を概念的に示した
図、第３図は第１図の要部を拡大して示す―
線断面図である。
図において、２は熱処理プレート（加熱部）、
１０，Ｒは蒸気室、１１，１３は導管、１４は有
機化合物液体、１５はタンクである。なお、各図
中、同一符号は同一又は相当部分を示す。
FIG. 1 is a plan view showing the entire wafer processing apparatus according to the present invention, FIG. 2 is a conceptual side view thereof, and FIG. 3 is an enlarged view of the main parts of FIG. 1.
FIG. In the figure, 2 is a heat treatment plate (heating part),
10 and R are steam chambers, 11 and 13 are conduits, 14 is an organic compound liquid, and 15 is a tank. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
レジスト塗布を施す手段を備えたウエハ処理装置
において、上記ウエハを加熱する加熱部とこの加
熱部に対して昇降制御可能な有機化合物の蒸気を
封塞する下面の開口した蒸気室とを設けるととも
に、この蒸気室の下降端において上記加熱部とで
画成する蒸気室内を減圧後上記蒸気を導入して上
記ウエハに上記有機化合物を被着形成させる上記
被着手段を設けたことを特徴とするウエハ処理装
置。 (2) 上記被着手段は、上記蒸気室減圧手段と上
記蒸気給送手段とを備えたことを特徴とする実用
新案登録請求の範囲第１項記載のウエハ処理装置
。[Scope of Claim for Utility Model Registration] (1) In a wafer processing apparatus equipped with means for heating a semiconductor wafer and applying photoresist to the wafer, a heating section that heats the wafer and the heating section can be controlled up and down. A steam chamber with an open bottom for sealing the vapor of the organic compound is provided, and at the descending end of the steam chamber, the pressure is reduced in the steam chamber defined by the heating section, and then the vapor is introduced to the wafer. A wafer processing apparatus comprising the above-described deposition means for depositing and forming an organic compound. (2) The wafer processing apparatus according to claim 1, wherein the deposition means includes the steam chamber decompression means and the steam supply means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8196786U JPS62193723U (en) | 1986-05-30 | 1986-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8196786U JPS62193723U (en) | 1986-05-30 | 1986-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62193723U true JPS62193723U (en) | 1987-12-09 |
Family
ID=30934192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8196786U Pending JPS62193723U (en) | 1986-05-30 | 1986-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62193723U (en) |
-
1986
- 1986-05-30 JP JP8196786U patent/JPS62193723U/ja active Pending
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