JPS62197863U - - Google Patents
Info
- Publication number
- JPS62197863U JPS62197863U JP1986086061U JP8606186U JPS62197863U JP S62197863 U JPS62197863 U JP S62197863U JP 1986086061 U JP1986086061 U JP 1986086061U JP 8606186 U JP8606186 U JP 8606186U JP S62197863 U JPS62197863 U JP S62197863U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- water cooling
- insulating material
- thermally conductive
- cooling fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986086061U JPS62197863U (fr) | 1986-06-07 | 1986-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986086061U JPS62197863U (fr) | 1986-06-07 | 1986-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62197863U true JPS62197863U (fr) | 1987-12-16 |
Family
ID=30942026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986086061U Pending JPS62197863U (fr) | 1986-06-07 | 1986-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62197863U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010103582A (ja) * | 2004-03-31 | 2010-05-06 | Dowa Holdings Co Ltd | アルミニウム接合部材 |
-
1986
- 1986-06-07 JP JP1986086061U patent/JPS62197863U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010103582A (ja) * | 2004-03-31 | 2010-05-06 | Dowa Holdings Co Ltd | アルミニウム接合部材 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS628641U (fr) | ||
| JPS6163847U (fr) | ||
| JPH01115255U (fr) | ||
| JPS61104157U (fr) | ||
| JPS6042742U (ja) | 半導体装置 | |
| JPS62101290U (fr) | ||
| JPS5857030U (ja) | 伝熱性絶縁シ−ト | |
| JPS6081657U (ja) | 半導体素子の放熱器 | |
| JPS62174341U (fr) | ||
| JPS6130252U (ja) | 半導体装置 | |
| JPS60163738U (ja) | 半導体装置 | |
| JPS63195745U (fr) | ||
| JPS6260042U (fr) | ||
| JPS62124856U (fr) | ||
| JPS58162649U (ja) | 放熱フイン付半導体素子 | |
| JPS63127151U (fr) | ||
| JPS60163740U (ja) | 半導体装置 | |
| JPS6083254U (ja) | 半導体素子の冷却構造 | |
| JPH024255U (fr) | ||
| JPS5885351U (ja) | 半導体整流素子の冷却体 | |
| JPS6265834U (fr) | ||
| JPS59146969U (ja) | 半導体装置 | |
| JPS61168640U (fr) | ||
| JPS6066035U (ja) | 半導体装置 | |
| JPS6113945U (ja) | ヒ−トパイプ付鉄製放熱体 |