JPS62206894A - 印刷回路基板の修理方法 - Google Patents

印刷回路基板の修理方法

Info

Publication number
JPS62206894A
JPS62206894A JP61275513A JP27551386A JPS62206894A JP S62206894 A JPS62206894 A JP S62206894A JP 61275513 A JP61275513 A JP 61275513A JP 27551386 A JP27551386 A JP 27551386A JP S62206894 A JPS62206894 A JP S62206894A
Authority
JP
Japan
Prior art keywords
cutter
conductor
circuit board
repair
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61275513A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0311117B2 (2
Inventor
ジヨセフ・アンドリユー・ローセツク
ジエームズ・レイモンド・テシア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS62206894A publication Critical patent/JPS62206894A/ja
Publication of JPH0311117B2 publication Critical patent/JPH0311117B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49746—Repairing by applying fluent material, e.g., coating, casting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP61275513A 1986-03-05 1986-11-20 印刷回路基板の修理方法 Granted JPS62206894A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/836,411 US4691426A (en) 1986-03-05 1986-03-05 Repair of strip conductor on electrical circuit board
US836411 1986-03-05

Publications (2)

Publication Number Publication Date
JPS62206894A true JPS62206894A (ja) 1987-09-11
JPH0311117B2 JPH0311117B2 (2) 1991-02-15

Family

ID=25271916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61275513A Granted JPS62206894A (ja) 1986-03-05 1986-11-20 印刷回路基板の修理方法

Country Status (3)

Country Link
US (1) US4691426A (2)
EP (1) EP0235625A3 (2)
JP (1) JPS62206894A (2)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912843A (en) * 1988-05-26 1990-04-03 Siemens Aktiengesellschaft Method for repairing interconnect interruptions
US5153408A (en) * 1990-10-31 1992-10-06 International Business Machines Corporation Method and structure for repairing electrical lines
DE19539065A1 (de) * 1995-10-20 1997-04-24 Audi Ag Verfahren zum Ausbessern von Beschichtungsfehlern
US6035526A (en) * 1997-11-18 2000-03-14 Ntn Corporation Method of repairing defect and apparatus for repairing defect
JP2021171874A (ja) * 2020-04-24 2021-11-01 セイコーエプソン株式会社 ワーク処理方法
CN116390364A (zh) * 2023-02-06 2023-07-04 湖北全成信精密电路有限公司 Pcb板残铜修复方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181089A (ja) * 1983-03-30 1984-10-15 東レエンジニアリング株式会社 基板回路の切断方法
JPS6035570U (ja) * 1983-08-17 1985-03-11 富士通株式会社 プリント基板の導体パタ−ンの切断装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3206354A1 (de) * 1982-02-22 1983-09-01 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Vorrichtung zum aendern oder reparieren von nicht sichtbaren leiterbahnmustern von mehrlagigen leiterplatten

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181089A (ja) * 1983-03-30 1984-10-15 東レエンジニアリング株式会社 基板回路の切断方法
JPS6035570U (ja) * 1983-08-17 1985-03-11 富士通株式会社 プリント基板の導体パタ−ンの切断装置

Also Published As

Publication number Publication date
JPH0311117B2 (2) 1991-02-15
US4691426A (en) 1987-09-08
EP0235625A3 (en) 1989-06-14
EP0235625A2 (en) 1987-09-09

Similar Documents

Publication Publication Date Title
US5773764A (en) Printed circuit board panel
JPS62206894A (ja) 印刷回路基板の修理方法
JP3583456B2 (ja) 加熱複合ガラスシートの製造方法
US4654102A (en) Method for correcting printed circuit boards
EP0407940B1 (en) Method for joining together associated metal conductors of a layer structure with an insulating layer provided therebetween
US4778556A (en) Apparatus for correcting printed circuit boards
US4527041A (en) Method of forming a wiring pattern on a wiring board
CN110928087B (zh) Tft基板的断线修复方法
US4748773A (en) Biased grinding assembly
JP4094188B2 (ja) 被覆電線の皮剥き方法および装置
EP0294478B1 (en) Improved grinding guide and method
JPS6298684A (ja) 劈開装置及び劈開方法
JPH0521933A (ja) 薄膜基板修正装置
US3279037A (en) Method of assembling electrical elements
JP2000323812A (ja) 部品実装基板及びその製造方法とその検査装置
JPH04332879A (ja) ショート・オープンチェッカーおよびその使用によるチェック方法
JP3114693B2 (ja) 配線基板を修正する溶断装置
JPH06174774A (ja) Ｔａｂフィルムキャリアテープの電気検査方法
JP3894670B2 (ja) 検査治具の接続方法
CN112432959A (zh) 一种用于检测和修复pcb板短路的微雕修复机
JPH0588134A (ja) 液晶表示装置
JPS59206776A (ja) プリント配線板の検査装置
JP2007123660A (ja) プリント配線基板の配線修復方法及びそれに用いる配線修復装置
JPS6297796A (ja) プリント基板修復溶接機
GB2155382A (en) Stitch welding of wire to a printed circuit board