JPS62242531A - Blackening treating method of copper-lined laminated board - Google Patents
Blackening treating method of copper-lined laminated boardInfo
- Publication number
- JPS62242531A JPS62242531A JP8665586A JP8665586A JPS62242531A JP S62242531 A JPS62242531 A JP S62242531A JP 8665586 A JP8665586 A JP 8665586A JP 8665586 A JP8665586 A JP 8665586A JP S62242531 A JPS62242531 A JP S62242531A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- blackening
- clad laminate
- clad
- blackening treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 22
- 238000011282 treatment Methods 0.000 claims description 27
- 238000005406 washing Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 6
- 238000007664 blowing Methods 0.000 claims description 5
- 238000009835 boiling Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000002798 polar solvent Substances 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000007800 oxidant agent Substances 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 241000272814 Anser sp. Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- YYRMJZQKEFZXMX-UHFFFAOYSA-N calcium;phosphoric acid Chemical compound [Ca+2].OP(O)(O)=O.OP(O)(O)=O YYRMJZQKEFZXMX-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- -1 methanol and ethanol Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002426 superphosphate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、黒化処理むらを発生させない多層板用銅張積
層板の黒化処理方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method for blackening a copper-clad laminate for a multilayer board that does not cause uneven blackening.
（従来の技術）
近年電子機器の発達およびそれに伴う印刷配線板の高密
度化に対処して多層基板が用いられるようになってきて
いる。この多層基板は、薄い内層用両面板に回路を形成
し、その上にプリプレグと銅箔を積層して加熱、加圧す
ることにより製造されている。(Prior Art) In recent years, multilayer substrates have come into use in response to the development of electronic devices and the accompanying increase in the density of printed wiring boards. This multilayer board is manufactured by forming a circuit on a thin double-sided inner layer board, laminating prepreg and copper foil thereon, and heating and pressurizing the board.
しかしながら、内層板上の回路銅箔の表面はそのままの
状態であると、加熱や吸湿により層間剥離が生じ易いた
め、通常様々な表面処理を施して剥離を防止する方法が
とられている。However, if the surface of the circuit copper foil on the inner layer board is left as is, delamination is likely to occur due to heating or moisture absorption, so various surface treatments are usually applied to prevent delamination.
このような方法として、銅雁表面の黒化処理や黄銅化処
理等の方法が行われている。これらの方法の内、引剥し
強度、耐熱性等の諸特性が優れてい為ことから、酸化剤
を用いて表面に黒色酸化被膜を形成させる黒化処理が最
も一般的に用いられている。As such methods, methods such as blackening treatment and brassing treatment of the surface of the copper goose have been carried out. Among these methods, blackening treatment, in which a black oxide film is formed on the surface using an oxidizing agent, is most commonly used because it has excellent properties such as peel strength and heat resistance.
（発明が解決しようとする問題点）
しかしながらこの黒化処理方法においては、製造工程中
に形成された種々の処理膜、鋼部表面が醸化されるのを
防ぐために行われる塩酸洗浄および水洗い時に付着した
水滴、内層板に形成された信号回路等に起因して処理む
らが生じ易いという問題があった。なお水滴の残留を防
ぐために、黒化処理の前に乾燥工程を設けることも考え
られるが、乾燥条件によってはパターニング時に寸法変
化が発生することがあり回路設計上好ましくない。(Problems to be Solved by the Invention) However, in this blackening treatment method, various treatment films formed during the manufacturing process and during hydrochloric acid cleaning and water washing performed to prevent the surface of the steel part from accumulating. There is a problem in that processing unevenness tends to occur due to attached water droplets, signal circuits formed on the inner layer plate, and the like. In order to prevent water droplets from remaining, it may be possible to provide a drying process before the blackening process, but depending on the drying conditions, dimensional changes may occur during patterning, which is not preferable in terms of circuit design.
そして従来このような処理むらが発生した場合には、黒
化処理をヤリなおしたり、前工程の研磨からやりなおし
たりすることが行われていた。Conventionally, when such processing unevenness occurs, the blackening process is redone or the previous polishing process is restarted.
しかしながら黒化処理をくり返して行なう場合には、効
率が悪いうえに、最初に正常に黒化された部分は過剰に
黒化処理が行われることになってしまい、処理膜が切れ
やすくなって引剥し強度、耐熱性が正常晶よりも弱くな
ってしまうという問題があった。However, if the blackening treatment is repeated, it is not efficient, and the areas that were normally blackened the first time will be over-blackened, making the treated film more likely to break and causing problems. There was a problem that the peel strength and heat resistance were weaker than normal crystals.
また前工程の研磨からヤリなおす場合には、銅箔の処理
層を除去してしまうため、処理層の均一化は図れるが、
前述の場合より一層効率が悪く、さらに再研磨により内
層銅箔が薄くなるためスルーホール信頼性が低下し好ま
しくない。Also, when re-polishing from the previous polishing process, the treated layer of the copper foil is removed, so the treated layer can be made uniform, but
The efficiency is even worse than the above-mentioned case, and since the inner layer copper foil becomes thinner due to re-polishing, the reliability of the through-hole decreases, which is undesirable.
本発明は、このような従来の問題を解消すべくなされた
もので、黒化処理むらがなく黒化膜の特性および処理効
率ともに良好な黒化処理方法を提供することを目的とす
る。The present invention has been made to solve these conventional problems, and an object of the present invention is to provide a blackening treatment method that has no unevenness in the blackening treatment and has good characteristics of the blackening film and treatment efficiency.
［発明の構成］
（問題点を解決するための手段）
本発明者らは、表面に残る水洗水を速やかに除去する方
法に関して検討を重ねた結果、次のような方法を開発し
た。すなわち本発明の黒化処理方法は、多層板用銅張積
層板を、酸化剤および塩基性物質を含有する処理液に浸
漬して黒化処理を行う銅張積層板の黒化処理方法におい
て、前記銅張積層板を黒化処理液に浸漬するに先立って
、低沸点の有機溶剤による洗浄および乾燥を順に行うこ
とを特徴としている。[Structure of the Invention] (Means for Solving the Problems) The present inventors have repeatedly studied methods for quickly removing washing water remaining on the surface, and as a result, have developed the following method. That is, the blackening treatment method of the present invention is a method for blackening a copper-clad laminate for a multilayer board, in which the copper-clad laminate for a multilayer board is immersed in a treatment liquid containing an oxidizing agent and a basic substance to carry out the blackening treatment. Prior to immersing the copper-clad laminate in the blackening treatment liquid, the copper-clad laminate is sequentially washed with a low boiling point organic solvent and dried.
本発明における黒化処理直前の有機溶剤としては、有機
極性溶剤、特にメタノール、エタノール等の低級アルコ
ール類あるいはアセトン、メヂルエチルケトン等の低級
ケトン類等の比較的沸点の低い有機極性溶剤が適してい
る。As the organic solvent immediately before the blackening treatment in the present invention, organic polar solvents, particularly organic polar solvents with a relatively low boiling point such as lower alcohols such as methanol and ethanol, or lower ketones such as acetone and methyl ethyl ketone, are suitable. ing.
（作 用）
このように構成された本発明の銅張積層板の黒化処理方
法においては、黒化処理に先立って銅張積層板を洗浄す
る有機溶剤が低沸点であるため、低温でも乾燥除去しや
すく、銅張積層板表面の水滴を容易に除去しうる。特に
水に溶解する＋ｉ機積極性溶剤使用した場合には、仮に
水洗等の工程後の乾燥が充分に行われない場合であって
も、次工程の黒化処理溶液に溶解するので処理ムラ等の
原因になるようなことはない。(Function) In the blackening treatment method for copper-clad laminates of the present invention configured as described above, since the organic solvent for cleaning the copper-clad laminates prior to blackening treatment has a low boiling point, drying is possible even at low temperatures. It is easy to remove, and water droplets on the surface of the copper-clad laminate can be easily removed. In particular, when using an aggressive solvent that dissolves in water, even if drying is not done sufficiently after washing with water, it will dissolve in the blackening treatment solution in the next process, resulting in uneven treatment. There is no such thing as a cause.
（実施例）
以下本発明の実施例について説明する。図は本発明の一
実施例に使用される製造装置の概略図であり、本発明の
黒化処理方法は、このような装置を用いて次のように行
なわれる。(Example) Examples of the present invention will be described below. The figure is a schematic diagram of a manufacturing apparatus used in an embodiment of the present invention, and the blackening treatment method of the present invention is carried out as follows using such an apparatus.
まず、黒化処理されるべき銅張積層板１は、オートラッ
ク２より吊下げられたランク３内に縦に重ねて収容され
る。次いでオートラック２を作動させてラック３を下降
させ、銅張積層板１を塩酸槽４に浸漬させて酸洗いを行
なう。酸洗いされた銅張積層板１は、同様にしてオート
ラック２により移動され水洗槽５．６にて水洗される。First, the copper-clad laminates 1 to be blackened are stored vertically in a rank 3 suspended from an auto rack 2 in a stacked manner. Next, the auto rack 2 is operated to lower the rack 3, and the copper clad laminate 1 is immersed in a hydrochloric acid bath 4 for pickling. The pickled copper clad laminate 1 is similarly moved by the auto rack 2 and washed in a washing tank 5.6.
さらに脱脂槽７、水洗槽８．９、ソフトエツチング槽１
０１水洗槽１１．１２に順次浸漬された後、有機溶剤槽
１３に浸漬される。ここで表面が洗浄された後、銅張積
層板１は熱風吹き出しノズル１４の上方に停止され、熱
風吹ぎ出しノズル１４から吹き出される熱風（５０〜８
０℃）により、表面に残留する液滴が、乾燥除去される
。このとき生ずる溶剤蒸気および水蒸気は、オートラッ
ク２上方に設けられたドラフト１５により吸引除去され
る。なお熱風吹き出し用ノズル１４の内部には、加熱用
ヒータ１６および送風用ファン１７が備えられている。In addition, degreasing tank 7, washing tank 8.9, soft etching tank 1
After being sequentially immersed in the 01 water washing tank 11 and 12, it is immersed in the organic solvent tank 13. After the surface is cleaned here, the copper-clad laminate 1 is stopped above the hot air blowing nozzle 14, and the hot air (50 to 80
0°C), the droplets remaining on the surface are dried and removed. The solvent vapor and water vapor generated at this time are removed by suction by a draft 15 provided above the autorack 2. Note that a heating heater 16 and a blowing fan 17 are provided inside the hot air blowing nozzle 14 .
このようにして表面が充分に乾燥された銅張積層板１は
、次に液温９０℃の下記の組成の黒化処理液を満たした
黒化処理層１８に４分間浸漬されて黒化処理され、水洗
槽１９．２０により水洗いされた後乾燥装置２１に送ら
れる。The copper-clad laminate 1 whose surface has been sufficiently dried in this manner is then immersed for 4 minutes in a blackening treatment layer 18 filled with a blackening treatment liquid having the following composition at a liquid temperature of 90°C to undergo blackening treatment. After being washed with water in washing tanks 19 and 20, it is sent to a drying device 21.
亜塩素酸ナトリウム（Ｎａ Ｃｌ０ｚ ＞２５０ ／ｆ
ｌ水酸化ナトリウム（Ｎａ ０１−１＞８（Ｊ／Ｊ２過
リン酸ナトリウム（Ｎａ ３ ＰＯ４） ８（１／Ｊ２
なお、この図において、作業開始時の銅張積層板１およ
びラック２の位置は点線で図示し、熱風乾燥時の位置を
実線で示している。Sodium chlorite (Na Cl0z >250/f
l Sodium hydroxide (Na 01-1>8 (J/J2 Sodium superphosphate (Na 3 PO4) 8 (1/J2
In this figure, the positions of the copper-clad laminate 1 and the rack 2 at the start of work are shown by dotted lines, and the positions at the time of hot air drying are shown by solid lines.
第１表は以上のようにして実施した本発明の実施例およ
び比較例の処理条件を示しており、第２表はこの各条件
下で）ｑられた処理膜の特性を示している。なお使用し
たパターンは信号回路である。Table 1 shows the processing conditions of the examples of the present invention and comparative examples carried out as described above, and Table 2 shows the characteristics of the treated films under each of these conditions. Note that the pattern used is a signal circuit.
（以下余白） 第１表 Ｏ印は工程を実施したことを示す。(Margin below) Table 1 The O mark indicates that the process was performed.
＊・・・・・・・・・機械研磨、酸洗浄、水洗等の処理
＊＊・・・・・・・・・黒化処理液の温度低下防止のた
めの予熱
＊＊＊・・・・・・・・・熱風吹きつけ（以下余白）
第２表
上表中の外観・処理ムラの記号は次の状態を表し、
Ｏ・・・ムラなし、Ｏ△・・・ごく一部にムラありΔ・
・・一部にムラあり、Ｘ・・・ムラがかなり発生ハンダ
耐熱性の０印は変化がなかったことを表す。＊・・・・・・・・・Processing such as mechanical polishing, acid cleaning, water washing, etc. ＊＊・・・・・・・・・Preheating to prevent the temperature of the blackening treatment liquid from dropping ＊＊＊・・・・・・...Hot air blowing (blank below) Symbols for appearance/processing unevenness in the upper table of Table 2 represent the following conditions: 0: No unevenness, O△: A small portion of unevenness. Δ・
... Some unevenness, X... Considerable unevenness. 0 mark for solder heat resistance indicates no change.
第１表および第２表から明らかなように、実施例１〜４
においては、外観が優秀で処理むらのない優れた特性を
有する処理膜が得られた。As is clear from Table 1 and Table 2, Examples 1 to 4
A treated film was obtained which had an excellent appearance and excellent properties with no processing unevenness.
これに対して比較例１〜４の場合には、外観にむらを生
じたり、あるいは引剥し強度に劣化がみられた。On the other hand, in the case of Comparative Examples 1 to 4, uneven appearance occurred or deterioration in peel strength was observed.
［発明の効果］
以上説明したように、本発明によれば銅箔表面の水分を
黒化処理前に速やかに除去することが可能であるので、
外観、処理むらのない優秀な特性を有する黒化処理膜が
得られる。さらに乾燥条件がおだやかであるため、銅張
積層板のパターニングの際に寸法変化をおこすことがな
く、高信頼性のポリイミド多図板等への適用も可能であ
る。[Effects of the Invention] As explained above, according to the present invention, it is possible to quickly remove moisture on the surface of a copper foil before blackening treatment.
A blackened film having excellent properties with no appearance or unevenness can be obtained. Furthermore, since the drying conditions are gentle, dimensional changes do not occur during patterning of copper-clad laminates, and it can also be applied to highly reliable polyimide multi-pattern boards.
また乾燥工程において、銅張積層板が適麿に加温される
ので湯洗い工程を省略することかでき、ざらに、製造工
程中胴箔面に形成された処し！Ｉ！膜＜ｔｔ化防止膜等
）を、効果的に除去することができる。In addition, in the drying process, the copper-clad laminate is heated to an appropriate temperature, so the hot water washing process can be omitted, and the surface of the body foil during the manufacturing process can be easily removed. I! (film<tt prevention film, etc.) can be effectively removed.
図は本発明の一実施例の！ｇ造装置の概略図である。
１・・・・・・・・・・・・銅張積層板２・・・・・・
・・・・・・オートラック３・・・・・・・・・・・・
ラック
４・・・・・・・・・・・・塩酸槽
５．６．８．９．１１．１２The figure shows one embodiment of the present invention! FIG. 1... Copper clad laminate 2...
・・・・・・Auto rack 3・・・・・・・・・・・・
Rack 4...... Hydrochloric acid tank 5.6.8.9.11.12
Claims (4)
を含有する処理液に浸漬して黒化処理を行う銅張積層板
の黒化処理方法において、前記銅張積層板を黒化処理液
に浸漬するに先立って、低沸点の有機溶剤による洗浄お
よび乾燥を順に行うことを特徴とする銅張積層板の黒化
処理方法。(1) In the blackening treatment method for copper-clad laminates, in which the copper-clad laminates for multilayer boards are subjected to blackening treatment by immersing them in a treatment solution containing an oxidizing agent and a basic substance, the copper-clad laminates are blackened. 1. A method for blackening a copper-clad laminate, which comprises sequentially washing with a low boiling point organic solvent and drying prior to immersion in a heat treatment solution.
１項記載の銅張積層板の黒化処理方法。(2) The method for blackening a copper-clad laminate according to claim 1, wherein the organic solvent is an organic polar solvent.
は低級ケトン類である特許請求の範囲第２項記載の銅張
積層板の黒化処理方法。(3) The method for blackening a copper-clad laminate according to claim 2, wherein the low boiling point organic polar solvent is a lower alcohol or a lower ketone.
る特許請求の範囲第１項ないし第３項のいずれか１項記
載の銅張積層板の黒化処理方法。(4) The method for blackening a copper-clad laminate according to any one of claims 1 to 3, wherein the drying is performed by blowing hot air at 50 to 80°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61086655A JP2519033B2 (en) | 1986-04-15 | 1986-04-15 | Blackening method for copper clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61086655A JP2519033B2 (en) | 1986-04-15 | 1986-04-15 | Blackening method for copper clad laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62242531A true JPS62242531A (en) | 1987-10-23 |
| JP2519033B2 JP2519033B2 (en) | 1996-07-31 |
Family
ID=13893046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61086655A Expired - Lifetime JP2519033B2 (en) | 1986-04-15 | 1986-04-15 | Blackening method for copper clad laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2519033B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04208596A (en) * | 1990-11-30 | 1992-07-30 | Toppan Printing Co Ltd | Manufacture of multilayer printed circuit board |
| JPH06262722A (en) * | 1993-01-14 | 1994-09-20 | Matsushita Electric Works Ltd | Preparation of composite body of metal copper and resin |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5268971A (en) * | 1975-12-05 | 1977-06-08 | Hitachi Chemical Co Ltd | Method of pretreating adhesion of multiple layers of multiilayer printed circuit board |
| JPS58104745A (en) * | 1981-12-17 | 1983-06-22 | 日立電線株式会社 | Manufacturing method for copper clad laminates |
| JPS59208897A (en) * | 1983-05-13 | 1984-11-27 | 日本電気株式会社 | Method of producing multilayer printed circuit board |
| JPS6046375A (en) * | 1983-05-23 | 1985-03-13 | シツプレ−・カンパニ−・インコ−ポレ−テツド | Solution for forming black oxide film and method for laminating copper or copper alloy on dielectric material using the solution |
| JPS6092842A (en) * | 1983-10-27 | 1985-05-24 | 日立電線株式会社 | Manufacture of copper lined laminated board |
-
1986
- 1986-04-15 JP JP61086655A patent/JP2519033B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5268971A (en) * | 1975-12-05 | 1977-06-08 | Hitachi Chemical Co Ltd | Method of pretreating adhesion of multiple layers of multiilayer printed circuit board |
| JPS58104745A (en) * | 1981-12-17 | 1983-06-22 | 日立電線株式会社 | Manufacturing method for copper clad laminates |
| JPS59208897A (en) * | 1983-05-13 | 1984-11-27 | 日本電気株式会社 | Method of producing multilayer printed circuit board |
| JPS6046375A (en) * | 1983-05-23 | 1985-03-13 | シツプレ−・カンパニ−・インコ−ポレ−テツド | Solution for forming black oxide film and method for laminating copper or copper alloy on dielectric material using the solution |
| JPS6092842A (en) * | 1983-10-27 | 1985-05-24 | 日立電線株式会社 | Manufacture of copper lined laminated board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04208596A (en) * | 1990-11-30 | 1992-07-30 | Toppan Printing Co Ltd | Manufacture of multilayer printed circuit board |
| JPH06262722A (en) * | 1993-01-14 | 1994-09-20 | Matsushita Electric Works Ltd | Preparation of composite body of metal copper and resin |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2519033B2 (en) | 1996-07-31 |
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