JPS62273797A - Method of repairing discontinuity of wiring pattern - Google Patents
Method of repairing discontinuity of wiring patternInfo
- Publication number
- JPS62273797A JPS62273797A JP11775586A JP11775586A JPS62273797A JP S62273797 A JPS62273797 A JP S62273797A JP 11775586 A JP11775586 A JP 11775586A JP 11775586 A JP11775586 A JP 11775586A JP S62273797 A JPS62273797 A JP S62273797A
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- repairing
- wire
- disconnection
- connecting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 18
- 239000000463 material Substances 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 2
- 238000003466 welding Methods 0.000 description 12
- 238000005219 brazing Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
＆ 発明の詳細な説明
本発明は配線パターンの断線修理方法に関し、特に高密
度な印刷配線板の製造過程で生じ易い微細な配線回路の
断線修理の方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for repairing disconnections in wiring patterns, and more particularly to a method for repairing disconnections in minute wiring circuits that tend to occur during the manufacturing process of high-density printed wiring boards.
従来、この種の印刷配線板の断線修理は、配線パターン
と同じ幅の金属線材を断線個所に載置し、ウェルダーに
よる抵抗溶接法を用いて溶接することによって断線修理
を行っている。Conventionally, disconnections in this type of printed wiring board have been repaired by placing a metal wire with the same width as the wiring pattern on the disconnected area and welding it using a resistance welding method using a welder.
このウェルダーによる抵抗溶接法は、溶接線材に低電圧
、高電流を流すことで、溶接物間の接触抵抗及び溶接物
自体の抵抗による発熱を利用した溶接方法である。This resistance welding method using a welder is a welding method that utilizes heat generated by the contact resistance between the objects to be welded and the resistance of the objects to be welded themselves by passing a low voltage and high current through the welding wire.
上述した従来の抵抗溶接法は高融点金属の溶接、スポッ
ト溶接を行うために適した方法であるが、溶接点を小さ
く絞り込むことには限界がある。一方、配線パターン幅
は印刷配線板の高密度化技術の進歩に伴なって微細化が
求められており、ウェルダーによる溶接法では配線パタ
ーンと接続線材との接線個所のズレが生じやすい。さら
に配線パターン幅の微細化によって溶接時の接続線材の
配置が不安定となり、最悪の場合には、配線パターン自
体を溶解、蒸発させて微細な配線パターンに二次断線を
発生させるといった欠点を有している。The conventional resistance welding method described above is suitable for welding high melting point metals and spot welding, but there is a limit to narrowing down the welding points to a small number. On the other hand, the width of the wiring pattern is required to be made finer with the progress of high-density technology for printed wiring boards, and welding using a welder tends to cause misalignment of the tangential points between the wiring pattern and the connecting wire. Furthermore, the miniaturization of the wiring pattern width makes the arrangement of connecting wires during welding unstable, and in the worst case, the wiring pattern itself may melt or evaporate, causing secondary disconnection in the fine wiring pattern. are doing.
本発明の目的はかかる従来の断線修理方法では難しい微
細幅の配線パターンの断線修理方法を提供することにあ
る。An object of the present invention is to provide a method for repairing a disconnection in a wiring pattern having a fine width, which is difficult to use with such conventional disconnection repair methods.
すなわち本発明によれば、印刷配線板上に形成された配
線パターンの断線部分に、少なくとも一種類の良導性金
属の母材層と、ろう付性を有する一Ｎ票の金属またはろ
う付性を育する二種類以上の金屑の合金屑からなる接続
線材を載置し、配線パターンと接続線材の接触部分にレ
ーザー光線を照射してろう付け接続することを特徴とす
る配線パターンの断線修理方法が得られる。とくに、断
線部分に少なくとも一種以上の金属の母材層および合金
層を有することを特徴とし、断面が矩形であり、配線パ
ターンと同じ幅以下である接続線材を配線パターン上の
断線部分に載置する工程と、レーザ光線の照射幅をレン
ズによって接続線材の幅以下に絞り込む工程と、レーザ
光線の照射深度が線材と配線パターンとが重なって接触
する位置にレンズの焦点を合わせる調整工程と、断線部
分の両端にレーザ光線を照射し、接続線材と配線パター
ンとを溶接する工程を有する。That is, according to the present invention, a base material layer of at least one type of good conductive metal and a 1N metal having brazeability or a brazeability metal are provided in the disconnected portion of the wiring pattern formed on the printed wiring board A method for repairing a disconnection in a wiring pattern, characterized by placing a connecting wire made of alloy scraps of two or more types of gold scraps that grow, and irradiating the contact portion of the wiring pattern and the connecting wire with a laser beam to make the connection by brazing. is obtained. In particular, a connecting wire characterized by having at least one metal base material layer and an alloy layer in the disconnection part, having a rectangular cross section, and having a width equal to or less than the wiring pattern is placed on the disconnection part on the wiring pattern. a process of narrowing down the irradiation width of the laser beam to less than the width of the connecting wire using a lens, an adjustment process of focusing the lens on a position where the irradiation depth of the laser beam overlaps and contacts the wire and the wiring pattern, and The method includes a step of irradiating both ends of the portion with a laser beam to weld the connecting wire and the wiring pattern.
以下、本発明配線パターンの断線修理方法について図面
を参照して説明する。Hereinafter, a method for repairing a disconnection in a wiring pattern according to the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例で、配線パターンの断線個所
に断面が矩形状の修復用の接続線材を橋絡している状態
の縦断面図である。FIG. 1 is a longitudinal cross-sectional view showing an embodiment of the present invention in which a connection wire for repair with a rectangular cross section is bridged to a disconnected portion of a wiring pattern.
架台（図示省略）に吊設されたレーザ装置１を印刷配線
基板２上の配線バク−７３の上方に移動させ、配線パタ
ーン３の断線個所３ａを中心として左右の配線パターン
３，３に沿って後述する接続線材４のろう材層を配線パ
ターン３上に接触、載置する。The laser device 1 suspended from a pedestal (not shown) is moved above the wiring board 73 on the printed wiring board 2, and the laser device 1 is moved along the left and right wiring patterns 3, 3 centering on the disconnection point 3a of the wiring pattern 3. A brazing material layer of a connecting wire 4, which will be described later, is brought into contact with and placed on the wiring pattern 3.
次にレーザ装置１からたとえばＹＡＧなどの赤外領域の
波長を有するレーザ光線１ａを発生させ、集光レンズ１
ｂで絞り、配線パターン３上の接続線材４に焦点を合わ
せて照射し、ろう材層４ｂを溶解してろう付けを行う。Next, a laser beam 1a having a wavelength in the infrared region such as YAG is generated from the laser device 1, and the condenser lens 1
b, and the connection wire 4 on the wiring pattern 3 is focused and irradiated to melt the brazing material layer 4b and perform brazing.
図中、配線パターン３はガラス−エポキシ。In the figure, wiring pattern 3 is glass-epoxy.
ガラス−ポリイミドなどの絶縁性基板上に公知のテ／テ
ィング法、アディティブ法などの印刷配線板の製造方法
で配線パターン３を形成し、配線パターン３に断線個所
３ａを有するものである。A wiring pattern 3 is formed on an insulating substrate such as glass-polyimide by a known printed wiring board manufacturing method such as a printing method or an additive method, and the wiring pattern 3 has a disconnection portion 3a.
修理可能なパターン３の線幅には特に限定はなく、幅５
０〜１００μの微細な配線パターンの断線修理も可能で
ある。There is no particular limitation on the line width of repairable pattern 3, and the width is 5.
It is also possible to repair disconnections in fine wiring patterns of 0 to 100μ.
配線パターン３の断線修理に用いる接合線材４は良導電
性のＣｕ、Ａｕなどの金屑材料、またはＣｕ−Ｎｉなど
の合金材料からなる母材層４ａの片面にＡｇ−Ｐ−Ｃｕ
などのろう材層４ｂを機械的圧着などの手段により接合
した複合線材が使用可能であるが、特に母材層４ａに断
面が矩形の銅線を用いその片面、または両面にＡｇ−Ｐ
−Ｃｕのろう材層を接合した接続線材が良好である。A bonding wire 4 used for repairing a disconnection in the wiring pattern 3 is made of a base material layer 4a made of a metal scrap material such as Cu or Au, or an alloy material such as Cu-Ni, which has good conductivity.
It is possible to use a composite wire material in which the brazing material layer 4b is joined by means such as mechanical crimping, but in particular, a copper wire with a rectangular cross section is used for the base material layer 4a, and Ag-P is used on one or both sides of the copper wire.
-The connection wire material bonded with the Cu brazing material layer is good.
照射点の位置決めはレーザ装置に組み込まれたモニター
によって行うことができる。照射点の大きさはレーザ装
置内の集光レンズ１ｂの絞りによって調整が可能である
。The positioning of the irradiation point can be performed by a monitor built into the laser device. The size of the irradiation point can be adjusted by adjusting the aperture of the condenser lens 1b within the laser device.
また、レーザ光＠ １ ａの出力は接続線材４の材質、
形状、及び配線パターン３の厚さによって調整する。In addition, the output of the laser beam @ 1 a depends on the material of the connecting wire 4,
It is adjusted depending on the shape and the thickness of the wiring pattern 3.
［発明の効果］
以上説明したように本発明は印刷配線板上の配線パター
ンの断線修理をレーザ光線の照射によって修復用線材を
配線パターンに溶接する非接触の断線修理方法であるた
め従来用いられているウェルダーによる断線修理で生じ
やすい配線バタ゛−ンと線材との接続個所のズレを生じ
ることがない。また、レーザ光線を絞り込むことによっ
て、従来のウェルダーで断線修理できる幅よりも微細な
配線パターン幅の断線修理ができる利点がある。[Effects of the Invention] As explained above, the present invention is a non-contact method for repairing a disconnection in a wiring pattern on a printed wiring board by welding a repair wire to the wiring pattern by irradiation with a laser beam, which is not conventionally used. There is no misalignment of the connection point between the wiring pattern and the wire, which is likely to occur when repairing a disconnection using a welder. Furthermore, by narrowing down the laser beam, there is an advantage that it is possible to repair a wire break in a finer wiring pattern width than that which can be repaired using a conventional welder.
本発明実施例では接続線材の断線形状を矩形に加工した
もので説明したが、断面形状が円形、楕円形であるもの
も使用できることは勿論である。In the embodiments of the present invention, connection wires having a rectangular disconnection shape have been described, but it goes without saying that wires having a circular or elliptical cross-sectional shape can also be used.
第１図は本発明に用いる装置および接続線材の縦断面図
。
１・・・レーザ装置、 Ｉａ・・・レーザ光線。
１ｂ・・・集光レンズ。
２・・・印刷配線基板、 ３・・・配線パターン。
４・・・接続線材、 ４ａ・・・（接続線材の）母材
層。
４ｂ・・・（接続線材の）ろう材層。FIG. 1 is a longitudinal sectional view of a device and a connecting wire used in the present invention. 1... Laser device, Ia... Laser beam. 1b...Condensing lens. 2...Printed wiring board, 3...Wiring pattern. 4... Connection wire material, 4a... Base material layer (of the connection wire material). 4b... Brazing metal layer (of the connecting wire).
Claims (1)
、少なくとも一種類の良導性金属の母材層と、ろう付性
を有する一種類の金属またはろう付性を有する二種類以
上の金属の合金層とからなる接続線材を載置し、前記配
線パターンと接続線材との接触部分にレーザ光線を照射
してろう付け接続することを特徴とする配線パターンの
断線修理方法。A base material layer of at least one kind of good conductive metal and one kind of metal having brazeability or two or more kinds of metals having brazeability are applied to the disconnected portion of the wiring pattern formed on the printed wiring board. A method for repairing a disconnection in a wiring pattern, comprising: placing a connecting wire made of an alloy layer, and irradiating a laser beam onto a contact portion between the wiring pattern and the connecting wire to braze the connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11775586A JPS62273797A (en) | 1986-05-21 | 1986-05-21 | Method of repairing discontinuity of wiring pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11775586A JPS62273797A (en) | 1986-05-21 | 1986-05-21 | Method of repairing discontinuity of wiring pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62273797A true JPS62273797A (en) | 1987-11-27 |
Family
ID=14719519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11775586A Pending JPS62273797A (en) | 1986-05-21 | 1986-05-21 | Method of repairing discontinuity of wiring pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62273797A (en) |
-
1986
- 1986-05-21 JP JP11775586A patent/JPS62273797A/en active Pending
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