JPS6227541B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a test device for continuously testing the electrical characteristics of semiconductor devices, in which semiconductor devices supplied in a single row are arranged in parallel. The present invention relates to a distribution chute device for distributing to each of a plurality of test heads. [Technical background of the invention and its problems] For example, in the case of semiconductor devices such as ICs (semiconductor integrated circuit devices), electrical characteristic tests are conducted on each manufactured product to sort them into good and defective products. is required. And a large amount
BACKGROUND ART Testing equipment equipped with a so-called high-speed handler has conventionally been used to continuously and automatically perform preliminary tests on IC products and the like. FIG. 1 is a schematic explanatory diagram showing the conventional test apparatus for semiconductor devices. In the figure, reference numeral 1 denotes a pre-test chute section for arranging continuously supplied semiconductor devices in a single row. Semiconductor devices a ₁ , a ₂ . ing. The test head section 2 tests the electrical characteristics of the shunted semiconductor devices, and the semiconductor devices determined to be good or defective are shunted to the sorting chute section 3. After the test head section 2 becomes empty, the next semiconductor device is thrown out from the pre-test shoot section 1. Note that the test of the semiconductor device described above is performed using a tester (not shown) connected to the test head section 2. On the other hand, the sorting chute section 3
If the semiconductor device thrown out from the test head section 2 is a good product, a command is obtained from the tester (not shown) and the semiconductor device is thrown to the good product shoot section 4 disposed immediately downstream. Also,
If the semiconductor device being shunted out is a defective product, the sorting chute section 3 is rotated by 90 degrees in response to a command from the tester (not shown) and transferred to the defective product chute section 5 arranged in the rotated direction. Defective semiconductor devices are now being shunted. As described above, the conventional test apparatus for semiconductor devices was equipped with only one test head section 2, and was configured as a single-row chute circuit system as a whole. Moreover, the test head section 2 was not configured to be able to test multiple samples at the same time.
It is necessary to adopt a system in which semiconductor devices are sequentially supplied to the test head section 2 one by one and tested one by one, and there is a problem in that a considerable amount of time is lost during the process. Furthermore, when a semiconductor device determined to be a defective product is to be shunted to the defective product chute section 5, the sorting chute section 3 must be rotated, and there is a problem in that time is lost at this time as well. Due to these factors, in conventional test equipment for semiconductor devices, the overall machine index has to be quite large, approximately 1.0 to 15 seconds, which makes it difficult to improve work efficiency and overall productivity. This had become a major obstacle. By the way, as is clear from the above, the following two basic ideas can be cited for configuring an efficient semiconductor device testing apparatus with a small machine index. 1st
In addition, by providing a plurality of test heads in parallel, a plurality of parallel chute circuit systems including the test heads are formed as a whole. For this purpose, a mechanism is required to efficiently distribute the semiconductor devices supplied in a single row from the pre-test chute to each of the plurality of test heads. Second, it is possible to test a plurality of semiconductor devices simultaneously with each test head. For this purpose,
A mechanism is required for each test head to reliably and efficiently shunt a plurality of semiconductor devices to be tested simultaneously as one unit. Incidentally, in the conventional semiconductor device testing apparatus shown in FIG. 1, the mechanism for shunting a semiconductor device from the pre-test shunt section 1 to the test head section 2 will be explained as follows. As shown in FIG. 2, the pre-test chute section consists of a supply section 1' and a fixed chute section 1''.The supply section is a section that supplies semiconductor devices in a single row, and the fixed chute section 1'' is a section that supplies semiconductor devices in a single row. This is the part for shunting the supplied semiconductor devices to the test head section 2. A detector 6 is provided at the upper end of the fixed chute section 1'' to detect when a semiconductor device is being shunted from the supply section 1'. Cylinders (hereinafter referred to as pen air cylinders) 7 and 8 are provided, and a shoot blow nozzle 9 facing downstream is provided between the pen air cylinders 7 and 8. When a semiconductor device is shunted into the chute section 1'', the detector 6 detects this and first protrudes the piston rod of the pen air cylinder 8 on the downstream side, stopping the test equipment (in the following explanation, this operation will be described). is called the protrusion of the pen air cylinder). When the next semiconductor device is shot in this state,
The detector 6 detects this, and the pen air cylinder 7 on the upstream side is then projected to anchor the semiconductor device. Subsequently, only the pen air cylinder 8 is retracted to release the mooring of the semiconductor device, and at the same time, the blow nozzle 9 blows out the unmoored semiconductor device to the test head section 2. At this time,
The pen air cylinder 8 continues to tether the semiconductor device. Then, the pen air cylinder 8 protrudes again, and at the same time, the pen air cylinder 7 retracts, and the unmoored semiconductor device falls and is moored to the pen air cylinder 8. Then, when a new semiconductor device is thrown out from the supply section 1', the pen air cylinder 7 protrudes again in response to a detection signal from the detector 6 and anchors it. From then on,
By a similar operation, the semiconductor devices are shunted one by one to the test head section 2. Now, as far as such a shunting mechanism used in conventional semiconductor equipment to shunt the semiconductor device to the test head section is concerned, the two basic ideas mentioned above can be realized and the machine index can be small and efficient. Test equipment cannot be configured. That is, it is not possible to distribute semiconductor devices to a plurality of test heads arranged in parallel using only one fixed chute section 1'', and therefore a plurality of parallel shoot circuit systems including the test head sections are constructed. Furthermore, with the above-mentioned shoot mechanism, the number of semiconductor devices for which the shoot timing can be completely controlled, that is, the number of semiconductor devices that can be shunted by the blowing from the blow nozzle 9 is only one. On the other hand, if a plurality of semiconductor devices are set up and tested at the same time in the test head section 2, the shoot timing of the same number of semiconductor devices must be completely controlled, and if this is not possible, Otherwise, it is impossible to reliably set a plurality of semiconductor devices in the test head 2. Therefore, as long as the above-mentioned chute mechanism is used, it is not possible to realize a configuration in which the test head section 2 tests a plurality of semiconductor devices at the same time. [Object of the Invention] A first object of the present invention is to provide test equipment for semiconductor devices having a plurality of parallel shoot circuit systems including test heads, which are arranged in a single row and supplied. It is an object of the present invention to provide a distribution chute device capable of distributing and setting semiconductor devices to each of a plurality of rows of test head sections. In order to realize a semiconductor device that can test multiple semiconductor devices at the same time, it is an object of the present invention to provide a distribution shoot device that can completely control the shoot timing of a plurality of semiconductor devices. In order to realize an efficient semiconductor device testing device with a small machine index, it is an object of the present invention to provide a distribution chute device with a high operating rate. [Summary of the Invention] The distribution chute device of the present invention is a semiconductor device testing device. The first feature is that it is capable of reciprocating in the lateral direction by an attached drive device.The drive device includes, for example, an air Due to this feature, the distribution chute of the present invention receives semiconductor devices from the pre-test chute and transfers them to each of a plurality of test heads disposed in parallel immediately downstream thereof. The distribution can be shot, therefore,
It becomes possible to construct a plurality of shoot circuit systems including test heads arranged in parallel. Moreover, by including multiple chute rows in parallel in this distribution chute section, one chute row can receive semiconductor devices from the pre-test chute section, and multiple chute rows can receive semiconductor devices from another chute row that has already received semiconductor devices. It is also possible to perform the operation of shunting a semiconductor device to one of the individually arranged test heads at the same time, resulting in a distribution shunting device with a high operating rate. A second feature of the distribution chute device of the present invention is that each chute row can receive a plurality of semiconductor devices, and all of the plurality of semiconductor devices accommodated therein can be shunted to the test head section. This means that the timing can be completely controlled. The specific configuration for this purpose includes a detector for detecting that the semiconductor device has been shunted from the pre-test chute section, a pen air cylinder for locking and unlocking the semiconductor device, and a pen air cylinder for locking and releasing the semiconductor device. Each chute row is provided with a plurality of sets of shoot timing control mechanisms each including a blow nozzle for shooting the apparatus to the test head. This second feature makes it possible systemically to construct each test head section to simultaneously test a plurality of semiconductor devices. Moreover, this makes it possible to obtain a distribution chute device with an even higher operating rate. [Embodiment of the Invention] FIG. 3 is a plan view of a distribution chute device according to an embodiment of the present invention, and FIG. 4 is a side view of the distribution chute device as viewed from the -line direction. In these figures, 1
1 is a distribution chute device. The distribution chute device 11 has a lower support frame 1 shown in FIG.
Two chute rows 14 ₁ , 14 ₂ are formed in parallel and are defined by the upper support frame 13 and the upper support frame 13 . A detector 1 for detecting semiconductor devices that have been shot is located below the chute row 14 ₁ .
5a is provided. In this embodiment, an optical fiber sensor embedded in the lower support frame 12 is used as the detector 15a. In addition, the detector 1
5a, and a pen air cylinder 16 on the downstream side thereof for locking and unlocking the semiconductor device.
A is provided on the upstream side, and a blow nozzle 17a is provided at an angle in the downstream direction in order to shoot the semiconductor device to the next stage. The pen air cylinder 16a and the blow nozzle 17a are provided on the upper support frame 13. The detector 15a, the pen air cylinder _16a , and the blow nozzle 17a provided at the lower part of the shoot row 141 constitute a set of shoot timing control mechanism.
A similar shoot timing control mechanism consisting of a detector 15b, a pen air cylinder 16b and a blow nozzle 17b is also provided in the upper part of the shoot row ₁₄₁ . On the other hand, the other chute row ₁₄₂ is similarly provided with a set of chute timing control mechanisms consisting of a detector 15c, a pen air cylinder 16c and a blow nozzle 17c in its lower part, and a set of chute timing control mechanisms in its upper part. Detector 1
5d, a pen air cylinder 16d and a blow nozzle 17d. The distribution chute device 11 having the above structure has a driving pen air cylinder 18.
is attached, and the drive air cylinder 18 moves the semiconductor device in a direction perpendicular to the chute direction,
That is, it is possible to reciprocate in the lateral direction. The distribution chute device 11 reciprocates from the position shown to a position 11' shown in phantom in the figure. At both ends of this reciprocating range, there are chute start detectors 19 ₁ for detecting that the distribution chute device has come to the relevant position and stopping it, as well as for instructing the shunt of the semiconductor device. ₁₉₂ is provided. In addition, 20 is a pre-test chute portion disposed immediately upstream of the distribution chute device 11 in the semiconductor device test equipment, and 30 ₁ and 30 ₂ are test head portions disposed immediately downstream of the distribution chute device. be. When the distribution chute device 11 is located at the right end of the reciprocating range as shown in the figure, the chute row ₁₄₁ and the pre-test chute section 20 communicate with each other, and the chute row ₁₄₂ and the test head section ₃₀₂ communicate with each other. On the other hand, when the distribution chute section 11 is located at the left end 11' of the reciprocating range, the chute row ₁₄₁ and the test head section ₃₀₁ communicate with each other, and the chute row ₁₄₂ and the pre-test chute section 20 communicate with each other.
are arranged so that they communicate with each other. The operation of the distribution chute device having the above configuration will be explained as follows. First, in the illustrated state, it is assumed that the chute row ₁₄₁ of the distribution chute device 11 is empty, and in the other chute row ₁₄₂ , one semiconductor device is moored to the pen air cylinders 16c and 16d. When a semiconductor device is shunted from the pre-test chute section 20 to the chute row ₁₄₁ in this state, the detector 15a detects this and protrudes the pen air cylinder 16a.
As a result, the semiconductor device is connected to the pen air cylinder 16a.
moored at. When the next semiconductor device is thrown out, the detector 15b detects this and causes the pen air cylinder 16b to protrude, and the semiconductor device is moored by the pen air cylinder. While the two semiconductor devices are thus accommodated in the chute row ₁₄₁ , the two semiconductor devices accommodated in the other chute row ₁₄₂ are shunted to the test head section ₃₀₂ in the following manner. . First, the pen air cylinder 16c is retracted to release the mooring of the semiconductor device, and the blow nozzle 17c is blown out, and the semiconductor device housed in the lower part of the shoot row ₁₄₂ is thrown to the test head section ₃₀₂ . . Subsequently, the pen air cylinder 16d retracts to unmoor the semiconductor device, and the blow nozzle 1
7d blows out and the semiconductor device housed in the upper portion is thrown to the test head section ₃₀₂ . In this way, the operation of accommodating two semiconductor devices in the chute row _14-1 and the two semiconductor devices accommodated in the chute row _14-2 are transferred to the test head section 30.
After the action of shooting to ₂ is performed at the same time,
The driving air cylinder 18 is driven to move the distribution chute device to the left. Distribution chute device 11
When the chute reaches the predetermined position indicated by the imaginary line in the figure, the chute start detector ₁₉₁ detects this and stops the movement, and the test head ₃₀₁ of the semiconductor devices housed in the chute row ₁₄₁ is moved. chute and chute row 1 from the pre-test chute section 20
Shunting of the semiconductor device to ₄₂ is started. This shooting operation is exactly the same as described above.
Thereafter, the distribution chute device 11 drives the driving air cylinder 18 and the detector 19 for starting the chute.
₂ returns to the initial position, and thereafter the same operation as described above is repeated. According to the distribution chute device of the above embodiment, the semiconductor devices supplied in a single row from the pre-test chute section 20 are distributed to each of the two test head sections 30 ₁ and 30 ₂ arranged in parallel. Therefore, the test head section 3 is installed in the test equipment for semiconductor devices.
0 ₁ and 30 ₂ , respectively, can be realized. In addition, the test head section 2
It is possible to simultaneously shoot the semiconductor device from the distribution chute device 11 to the distribution chute device 11 and to shoot the semiconductor device from the distribution chute device 11 to the test head section ₃₀₁ or ₃₀₂ . Comparatively, the loss time is small. Furthermore, _{the 2}
The shoot timing of each semiconductor device is completely controlled by an independent shoot timing control mechanism provided at each mooring position. This makes it possible to shoot two semiconductor devices into each of the test heads 30 ₁ and 30 ₂ as a unit, one at a time, at a time when each semiconductor device is reliably set at the test position. , it is possible to realize a shoot system for simultaneously testing two semiconductor devices using each of the test head sections 30 ₁ and 30 ₂ . Note that the present invention is not limited to the above embodiments, and various modifications are possible. For example, the number of chute rows provided in the distribution chute device 11 can be three or more, and conversely, even if the chute row is a single row, it is possible to distribute and chute semiconductor devices to multiple rows of test heads. be. Further, by providing three or more sets of shoot timing control mechanisms in each of the shoot rows 14 ₁ and 14 ₂ , three or more shoot rows can be accommodated in each shoot row. On the other hand, even if the structure can accommodate only one semiconductor device, the effect of distributing it to multiple rows of test heads can still be obtained. Furthermore, various drive devices other than the air cylinder 18 can be used as a drive device for laterally driving the distribution chute device 11, and various commonly used sensors other than optical fiber sensors can be used as the detectors 15a to 15d. Can be used. [Effects of the Invention] As detailed above, according to the distribution device of the present invention, it is possible to configure a plurality of parallel shoot circuit systems including a test head section in a test device for semiconductor devices.
In addition, it has remarkable effects such as making it possible to adopt a system configuration in which a single test head section can simultaneously test multiple semiconductor devices. It is possible to realize a test device for

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram schematically showing a conventional semiconductor device testing apparatus, FIG. 2 is a plan view showing the structure of a stationary chute for shunting a semiconductor device to a test head in a conventional semiconductor device, and FIG. The figure is a plan view of a distribution chute device according to an embodiment of the present invention.
FIG. 4 is a side view in the line direction of FIG. 3. DESCRIPTION OF SYMBOLS 11...Distribution chute device, 12...Lower support plate, 13...Upper support plate, _141,142 ...Chute row, 15a- _15d ...Detector, 16a-
16d...Pen air cylinder, 17a-17d...
... Blow nozzle, 18 ... Driving air cylinder,
19 ₁ , 19 ₂ ... Shoot start detector, 20
... Pre-test chute section, 30 ₁ , 30 ₂ ... Test head section.

Claims (1)

[Claims] 1. At least one row of shoots through which semiconductor devices are shot, a drive device for horizontally reciprocating the entire row of shoots, and detecting the position of the row of shoots. A detector for stopping the chute train at a position where semiconductor devices can be shunted from the previous stage to the chute row or from the chute row to the next stage; an air cylinder that has a piston rod that protrudes into the chute row to moor the semiconductor device based on the detection signal of the detector; A distribution chute device comprising a blow nozzle that shoots to a stepped portion and at least one set of shoot timing control devices provided along a chute row, the distribution chute device being continuously supplied in a test equipment for semiconductor devices. After receiving the semiconductor devices from one fixed pre-test chute section in which the semiconductor devices are arranged in a single row and shunted to the next stage section, the semiconductor devices are received into the chute row located directly below the pre-test chute section. A distribution chute apparatus characterized in that the semiconductor device is moved directly above one of a plurality of test heads fixedly arranged in parallel below, and the received semiconductor device is shunted to the test head. 2. having a plurality of said chute rows provided in parallel, and receiving and accommodating the chute of a semiconductor device from a front stage part in one chute row;
2. The distribution chute apparatus according to claim 1, wherein the operation of shunting semiconductor devices from another chute row in which semiconductor devices are already accommodated to the next stage is performed simultaneously. 3. The distribution chute device according to claim 1 or 2, wherein two or more sets of the chute timing mechanisms are provided along one chute row. 4. The distribution chute device according to claim 1, 2, or 3, wherein an optical fiber sensor is used as a detector constituting the chute timing control mechanism. 5. The distribution chute device according to claim 4, wherein the optical fiber sensor is embedded in a wall defining the chute row. 6. According to any one of claims 1 to 5, the blow nozzle is embedded in a wall defining the chute row at a predetermined angle with the wall. distribution chute device. 7. The distribution chute device according to any one of claims 1 to 6, wherein the air cylinder is embedded in a wall defining the chute row.