JPS62292262A - はんだ付け装置 - Google Patents

はんだ付け装置

Info

Publication number
JPS62292262A
JPS62292262A JP62093432A JP9343287A JPS62292262A JP S62292262 A JPS62292262 A JP S62292262A JP 62093432 A JP62093432 A JP 62093432A JP 9343287 A JP9343287 A JP 9343287A JP S62292262 A JPS62292262 A JP S62292262A
Authority
JP
Japan
Prior art keywords
rack
solder
molten solder
soldering
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62093432A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0527512B2 (2
Inventor
ジヨン・パトリツク・シンプソン
ゲイリー・レイ・ニユーマン
ジエームズ・マイケル・ラーナード
アラン・ジエームズ・エメリツク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS62292262A publication Critical patent/JPS62292262A/ja
Publication of JPH0527512B2 publication Critical patent/JPH0527512B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2900/00—Application of doors, windows, wings or fittings thereof
    • E05Y2900/40—Application of doors, windows, wings or fittings thereof for gates
    • E05Y2900/402—Application of doors, windows, wings or fittings thereof for gates for cantilever gates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP62093432A 1986-06-11 1987-04-17 はんだ付け装置 Granted JPS62292262A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87331886A 1986-06-11 1986-06-11
US873318 1986-06-11

Publications (2)

Publication Number Publication Date
JPS62292262A true JPS62292262A (ja) 1987-12-18
JPH0527512B2 JPH0527512B2 (2) 1993-04-21

Family

ID=25361396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62093432A Granted JPS62292262A (ja) 1986-06-11 1987-04-17 はんだ付け装置

Country Status (3)

Country Link
EP (1) EP0249168B1 (2)
JP (1) JPS62292262A (2)
DE (1) DE3766421D1 (2)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2265101B (en) * 1992-03-17 1995-05-10 Sun Ind Coatings Soldering apparatus and method
CN115700017A (zh) * 2020-07-17 2023-02-03 株式会社富士 涂布装置及元件安装机
US11389888B2 (en) * 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing
CN115302040B (zh) * 2022-09-08 2023-10-20 无锡富乐电子有限公司 变压器自动化生产线及治具系统
CN116511632B (zh) * 2023-04-14 2024-01-16 山东乾元半导体科技有限公司 一种led生产涂锡设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5233859A (en) * 1975-09-09 1977-03-15 Blackstone Corp Dip soldering method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2723922A (en) * 1952-12-31 1955-11-15 Sylvania Electric Prod Lead tinning machine
US2821159A (en) * 1956-01-23 1958-01-28 Acf Ind Inc Notch tinner
US3058441A (en) * 1956-10-02 1962-10-16 Sanders Associates Inc Soldering apparatus and method of soldering electrical conductors
FR2347959A1 (fr) * 1976-04-12 1977-11-10 Bertin & Cie Procede d'egouttage de pieces sorties de bains de galvanisation a chaud et machines appliquant le procede
DE3175787D1 (en) * 1981-04-15 1987-02-05 Siemens Ag Albis Method and apparatus for the removal of solder from drilled holes of non furnished printed-circuit boards clad with solder
EP0166817B1 (de) * 1984-06-07 1987-08-19 Roederstein Spezialfabriken für Bauelemente der Elektronik und Kondensatoren der Starkstromtechnik GmbH Verfahren und Vorrichtung zum Verlöten von Anschlussdrähten von elektrischen Bauteilen sowie Anordnung aus elektrischen Bauteilen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5233859A (en) * 1975-09-09 1977-03-15 Blackstone Corp Dip soldering method

Also Published As

Publication number Publication date
EP0249168A2 (en) 1987-12-16
EP0249168A3 (en) 1989-01-11
EP0249168B1 (en) 1990-11-28
DE3766421D1 (de) 1991-01-10
JPH0527512B2 (2) 1993-04-21

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