JPS62297493A - 半導体ウェハー用メッキ装置 - Google Patents

半導体ウェハー用メッキ装置

Info

Publication number
JPS62297493A
JPS62297493A JP13829386A JP13829386A JPS62297493A JP S62297493 A JPS62297493 A JP S62297493A JP 13829386 A JP13829386 A JP 13829386A JP 13829386 A JP13829386 A JP 13829386A JP S62297493 A JPS62297493 A JP S62297493A
Authority
JP
Japan
Prior art keywords
plating
plating solution
wafer
liquid
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13829386A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0240746B2 (2
Inventor
Junichi Tezuka
純一 手塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP13829386A priority Critical patent/JPS62297493A/ja
Publication of JPS62297493A publication Critical patent/JPS62297493A/ja
Publication of JPH0240746B2 publication Critical patent/JPH0240746B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP13829386A 1986-06-16 1986-06-16 半導体ウェハー用メッキ装置 Granted JPS62297493A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13829386A JPS62297493A (ja) 1986-06-16 1986-06-16 半導体ウェハー用メッキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13829386A JPS62297493A (ja) 1986-06-16 1986-06-16 半導体ウェハー用メッキ装置

Publications (2)

Publication Number Publication Date
JPS62297493A true JPS62297493A (ja) 1987-12-24
JPH0240746B2 JPH0240746B2 (2) 1990-09-13

Family

ID=15218499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13829386A Granted JPS62297493A (ja) 1986-06-16 1986-06-16 半導体ウェハー用メッキ装置

Country Status (1)

Country Link
JP (1) JPS62297493A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152222A (ja) * 1991-03-08 1993-06-18 Motorola Inc 液相堆積を用いた半導体装置における材料層の形成方法
JPH08253892A (ja) * 1995-03-16 1996-10-01 Nippondenso Co Ltd めっき装置およびめっき方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58759A (ja) * 1981-03-30 1983-01-05 ア−ルアイエイ・プロダクツ・インコ−ポレイテツド 非煮沸変性によるアツセイ方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58759A (ja) * 1981-03-30 1983-01-05 ア−ルアイエイ・プロダクツ・インコ−ポレイテツド 非煮沸変性によるアツセイ方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152222A (ja) * 1991-03-08 1993-06-18 Motorola Inc 液相堆積を用いた半導体装置における材料層の形成方法
JPH08253892A (ja) * 1995-03-16 1996-10-01 Nippondenso Co Ltd めっき装置およびめっき方法

Also Published As

Publication number Publication date
JPH0240746B2 (2) 1990-09-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees