JPS6233310B2 - - Google Patents
Info
- Publication number
- JPS6233310B2 JPS6233310B2 JP56180846A JP18084681A JPS6233310B2 JP S6233310 B2 JPS6233310 B2 JP S6233310B2 JP 56180846 A JP56180846 A JP 56180846A JP 18084681 A JP18084681 A JP 18084681A JP S6233310 B2 JPS6233310 B2 JP S6233310B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- film
- solution
- alloy
- iodine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56180846A JPS5881973A (ja) | 1981-11-11 | 1981-11-11 | 金−ゲルマニウム合金膜のエツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56180846A JPS5881973A (ja) | 1981-11-11 | 1981-11-11 | 金−ゲルマニウム合金膜のエツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5881973A JPS5881973A (ja) | 1983-05-17 |
| JPS6233310B2 true JPS6233310B2 (2) | 1987-07-20 |
Family
ID=16090375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56180846A Granted JPS5881973A (ja) | 1981-11-11 | 1981-11-11 | 金−ゲルマニウム合金膜のエツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5881973A (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0866209A (ja) * | 1994-08-16 | 1996-03-12 | Aucera Technol Corp | ウオッチバンドの構造 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4654116A (en) * | 1984-11-09 | 1987-03-31 | American Electronic Laboratories, Inc. | Method for producing high resolution etched circuit patterns from clad laminates |
| WO2008026542A1 (en) * | 2006-08-28 | 2008-03-06 | Mitsubishi Chemical Corporation | Etchant and etching process |
-
1981
- 1981-11-11 JP JP56180846A patent/JPS5881973A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0866209A (ja) * | 1994-08-16 | 1996-03-12 | Aucera Technol Corp | ウオッチバンドの構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5881973A (ja) | 1983-05-17 |
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