JPS6233332Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an improved type of heat dissipation fin used for the purpose of dissipating heat from flat semiconductor devices and the like.

Figure 1 is a configuration diagram of a conventional heat dissipation fin.
Figure 1a is a front view, Figure 1b is a ZZ sectional view,
Figure c is a YY sectional view, and Figure 1 d is a XX sectional view.
Further, FIG. 3 shows the heat dissipation fin 11 and the flat semiconductor element 9.
and 2 used for the purpose of pressurizing the flat semiconductor element 9.
This is an embodiment of a conventional stack combined with a book shaft 10, and a conductor 12 for external connection is connected to the upper end of the heat dissipation fin.

As shown in Figure 1a, the conventional type has a round hole punched in the center of the rectangle to pass the round bar 2 through, and holes with a semicircular diameter punched in two places at the top and bottom to pass the shaft 10 through. a round bar 2 machined by a highly precise mechanism to join the flat semiconductor element 9 and the thin plate 1; It is composed of a rectangular base 3, and the thin plate 1 requires a structure in which several sheets are further stacked as shown in Figure 1c, with equal intervals between each thin plate. Projections 4 are provided at these locations.

The conventional heat dissipation fin 11 is formed by assembling the above-mentioned thin plate 1, round bar 2, and base 3 together and fixing them with brazing material. However, the conventional type has the following drawbacks. First, as is clear from Figures 1b and 1c, the bonding surface 14 of the round bar 2 with the flat semiconductor element 9 is a thin plate, even though it has been machined with high precision in consideration of thermal resistance etc. 1 and base 3 because it protrudes beyond the surface of
When assembling the heat dissipation fin 11 or during transportation, storage, and handling, the bonding surface is likely to be damaged, and machining may be required to remove the damage in some cases.
Second, as shown in Figure 1 a and b, since the joint surface between the thin plate 1 and the base 3 is flat, depending on how they are assembled, a gap may be created in that part and brazing may not be completed completely. Also, it is difficult to position the base 3 with respect to the round bar 2 and the thin plate 1. Thirdly, in order to eliminate the drawback mentioned in the first section, it is necessary to make the convex part shown in Fig. The protruding dimension of the portion is limited by the thickness of the thin plate 1. The latter has the disadvantage that the material cost is high and that when two sets of radiation fins 11 are used in a stacked manner, a gap is created between the element joint surfaces 14 of each round bar 2.

An object of the present invention is to provide a flat heat dissipation fin for semiconductors that eliminates the above-mentioned drawbacks.

Fig. 2 is a configuration diagram of the heat dissipation fin according to the present invention, Fig. 2a is a front view, Fig. 2b is a WW sectional view,
FIG. 2c is a VV sectional view, and FIG. 2d is a UU sectional view. Also, FIG. 4 shows a conventional stack, similar to FIG.
This is an embodiment of a stack according to the present invention that combines the above, and a conductor 12 for external connection is connected to the upper end of the heat dissipation fin 13.

The heat dissipation fin 13 according to the present invention has a round hole punched in the center of the rectangle to pass the round rod 2 through, and a semi-circular diameter punched in two places above and below to pass the shaft 10. thin plate 5 with holes
As shown in FIG. 2b, the rectangular extruded material is made with grooves corresponding to the number of thin plates 5 to be used, in order to facilitate its combination with the thin plates 5, thereby preventing the brazing material from flowing into the external circuit connection holes 15. It consists of a base 7 with a hole 16 cut out therein, and a round bar 6 with a stepped structure on one side, and the semi-circular part of the thin plate 5 is structured to fit into a groove in the base 7. .

In addition, in several places on the thin plate 5 as shown in FIG. In order to protect it, a part of the thin plate 5 is machined with a press at the same time as other round holes and round holes, and bent into an L shape, as shown in FIG. 2d. Since this L-shaped protrusion 8 protrudes beyond the flat semiconductor element bonding surface 14, damage to the bonding surface 14 is prevented, and positioning of the thin plate 5, round bar 6, and base 7 is facilitated.
The brazing on the joining surfaces of each part will also be done in a well-balanced manner.

As described above, with the adoption of the present invention, the assembly time is shortened compared to the conventional heat dissipation fin 11, and the reliability of the product can be improved by preventing damage to the element bonding surface 14.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram of a conventional heat dissipation fin, in which Fig. 1a is a front view, Fig. 1b is a ZZ sectional view, Fig. 1c is a YY sectional view, Fig. 1d is a XX sectional view, or Fig. 2 is a configuration diagram of a heat dissipation fin showing an embodiment of the present invention, Fig. 2a is a front view, Fig. 2b is a WW sectional view, Fig. 2c is a VV sectional view, and Fig. 2d is a is a UU sectional view, FIG. 3 is a configuration diagram of a stack using conventional heat dissipation fins, and FIG. 4 is a configuration diagram of a stack using heat dissipation fins according to the present invention. 1...Conventional thin plate, 2...Conventional round bar, 3
...Conventional base, 4...Protrusion of thin plate 1, 5
... Thin plate of the present invention, 6... Round bar of the present invention, 7...
Base of the present invention, 8... Protrusion of thin plate 5, 9...
Flat semiconductor element, 10... Shaft, 11... Conventional heat dissipation fin, 12... External connection conductor, 13
...The heat dissipation fin of the present invention, 14...The flat semiconductor element bonding surface of the heat dissipation fin, 15...The hole for external circuit connection.

Claims (1)

[Scope of utility model registration request] In a heat dissipation fin for a flat semiconductor, which is constructed by brazing a thin plate, a boss for joining a flat semiconductor element, a base for connecting an external circuit, etc., several parts of the thin plate are protruded in an L shape, and the L-shaped protrusions reduce the distance between the thin plates. A heat dissipation fin for a flat semiconductor device, which is characterized in that the projecting portion is made to protrude beyond the bonding surface of the flat semiconductor device, thereby protecting the bonding surface of the flat semiconductor device.