JPS6233350Y2 - - Google Patents
Info
- Publication number
- JPS6233350Y2 JPS6233350Y2 JP18150481U JP18150481U JPS6233350Y2 JP S6233350 Y2 JPS6233350 Y2 JP S6233350Y2 JP 18150481 U JP18150481 U JP 18150481U JP 18150481 U JP18150481 U JP 18150481U JP S6233350 Y2 JPS6233350 Y2 JP S6233350Y2
- Authority
- JP
- Japan
- Prior art keywords
- sub
- printed
- board
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 14
- 238000003466 welding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Combinations Of Printed Boards (AREA)
Description
【考案の詳細な説明】
本考案はメインプリント基板にサブプリント基
板を垂設し、両プリント基板間を半田結合したプ
リント配線体に関し、両プリント基板の半田結合
部における半田クラツクの発生防止を目的とす
る。[Detailed description of the invention] This invention relates to a printed wiring body in which a sub-printed board is installed vertically on a main printed board, and the two printed boards are connected by solder. shall be.
メインプリント基板上にサブプリント基板を垂
設したプリント配線体は、配線体のコンパクト化
や配線の高密度化が容易であり、電子チユーナ等
に多用されている。このプリント配線体は、例え
ば第１図および第２図に示すようにメインプリン
ト基板１に穿設された嵌合穴２にサブプリント基
板３の周縁部に形成した凸部４を嵌込んで形成さ
れる。サブプリント基板３は、両面に所定のパタ
ーンで被着形成された導電ランド５，６の所定位
置に図示しないチツプ部品等を予め半田付けした
サブアツセンブル体である。またサブプリント基
板３の凸部４は、メインプリント基板１に設けら
れた嵌合穴２から裏面側に少し突出し、該突出部
分の両面の導電ランド５，６とメインプリント基
板１の裏面の導電ランド７，８とを半田９，１０
で電気的かつ機械的に接続することによつて両プ
リント基板１，３を一体化し、両プリント基板
１，３の電子回路を電気的に接続している。この
両プリント基板１，３の半田付け作業はメインプ
リント基板１の裏面に図示しないチツプ部品等を
半田付けするときに同時に実施される。 A printed wiring body in which a sub-printed circuit board is vertically disposed on a main printed circuit board is easy to downsize the wiring body and increase wiring density, and is often used in electronic tuners and the like. This printed wiring body is formed by fitting a protrusion 4 formed on the peripheral edge of a sub-printed circuit board 3 into a fitting hole 2 drilled in a main printed circuit board 1, as shown in FIGS. 1 and 2, for example. be done. The sub-printed board 3 is a sub-assembled body in which chip parts (not shown) and the like are soldered in advance to predetermined positions of conductive lands 5 and 6 formed on both surfaces in a predetermined pattern. Further, the convex portion 4 of the sub printed circuit board 3 slightly protrudes from the fitting hole 2 provided in the main printed circuit board 1 to the back side, and connects the conductive lands 5 and 6 on both sides of the protruding portion with the conductive land on the back surface of the main printed circuit board 1. Solder lands 7 and 8 to 9 and 10.
Both printed circuit boards 1 and 3 are integrated by electrically and mechanically connecting them, and the electronic circuits of both printed circuit boards 1 and 3 are electrically connected. This soldering work for both printed circuit boards 1 and 3 is carried out simultaneously when chip components, etc. (not shown) are soldered to the back surface of the main printed circuit board 1.
ところで、前記サブプリント基板３の凸部４の
両面に形成される導電ランド５，６の形状や面積
が両面間で同一であることは稀であり、通常は表
面側の導電ランド５はメインおよびサブプリント
基板の電子回路を接続するのに必要な本数の櫛状
パターンに形成され、これに対し裏面側の導電ラ
ンド６は凸部裏面の全域に亘つて形成されてい
る。この凸部裏面の導電ランド６の面積を増大す
ることは、特にこの種のプリント配線体を電子チ
ユーナの構成部品として使用する場合に高周波シ
ールド効果を向上せしめる上に有効である。 By the way, it is rare that the shapes and areas of the conductive lands 5 and 6 formed on both sides of the convex portion 4 of the sub-printed board 3 are the same on both sides, and usually the conductive lands 5 on the front side are the main and The number of comb-like patterns required to connect the electronic circuits of the sub-printed board is formed, and the conductive lands 6 on the back side are formed over the entire rear surface of the convex portion. Increasing the area of the conductive land 6 on the rear surface of the convex portion is effective in improving the high frequency shielding effect, especially when this type of printed wiring body is used as a component of an electronic tuner.
この反面、上述の如くサブプリント基板３の凸
部４両面に設けられた導電ランド５，６の形状と
面積に大きな差があると、サブプリント基板３を
メインプリント基板１に半田付けする際凸部４の
表面側には半田９が部分的に櫛状を呈して熔着
し、一方凸部４の裏面には全面に亘つて半田１０
が熔着する。つまり、凸部４の両面における半田
熔着量が不均等になる。このため半田結合の完了
したプリント配線体の使用時において、加熱、冷
却の繰返しによるプリント基板の伸縮が繰返され
ると、両プリント基板１，３を結合する半田９，
１０間に引張応力を発生し、凸部４との熔着面積
が小さい表面側半田９にクラツクが発生する。こ
のクラツク発生現象はプリント基板と半田との熱
膨張率の差および前記半田熔着量の差に起因する
ものであるが、クラツクの発生によつて所謂、ヒ
ートサイクル特性が大幅に損われる。 On the other hand, if there is a large difference in the shape and area of the conductive lands 5 and 6 provided on both sides of the convex portion 4 of the sub-printed circuit board 3 as described above, the convex portion 4 of the sub-printed circuit board 3 may have a large difference in shape and area. Solder 9 is partially comb-shaped and welded to the front surface of the portion 4, while solder 10 is welded to the entire back surface of the convex portion 4.
is melted. In other words, the amount of solder welding on both surfaces of the convex portion 4 becomes uneven. Therefore, when using a printed circuit board that has been soldered together, if the printed circuit board is repeatedly expanded and contracted due to repeated heating and cooling, the solder 9 that connects both printed circuit boards 1 and 3,
Tensile stress is generated between 10 and 10, and cracks occur in the front side solder 9, which has a small welding area with the convex portion 4. This crack generation phenomenon is caused by the difference in thermal expansion coefficient between the printed circuit board and the solder and the difference in the amount of solder welding, but the generation of cracks significantly impairs the so-called heat cycle characteristics.
本考案は在来のプリント配線体に認められた上
記の欠点を解消した新規な構造的特性を有するプ
リント配線体を提供することをその主要な目的と
するものである。 The principal object of the present invention is to provide a printed wiring body having novel structural characteristics that eliminates the above-mentioned drawbacks observed in conventional printed wiring bodies.
而して本考案の斯かる目的は、メインプリント
基板に穿設した嵌合穴にサブプリント基板の端縁
部を嵌合し、サブプリント基板の両面に設けられ
た導電ランドと対応するメインプリント基板の導
電ランドとを半田結合したプリント配線体であつ
て、前記嵌合穴内に嵌まり込むサブプリント基板
の端縁部は該サブプリント基板の嵌込み方向に延
びる分割溝によつて複数個に分割されており、該
複数個の分割部分においてはレジスト層と導電ラ
ンド形成部位がサブプリント基板の同一面では交
互に位置し、かつ同一の分割部分においては前記
レジスト層と導電ランド形成部位が該サブプリン
ト基板の表裏両面で対向するように位置している
前記プリント配線体を使用することによつて工業
的に有利に達成することができる。 The purpose of the present invention is to fit the edges of the sub-printed circuit board into the fitting holes drilled in the main printed circuit board, and to connect the main printed circuit board to the conductive lands provided on both sides of the sub-printed circuit board. The printed wiring body is soldered to a conductive land of a board, and the edge of the sub-printed board that fits into the fitting hole is divided into a plurality of parts by dividing grooves extending in the fitting direction of the sub-printed board. In the plurality of divided parts, the resist layer and the conductive land forming part are located alternately on the same surface of the sub-printed board, and in the same divided part, the resist layer and the conductive land forming part are located in the same direction. This can be advantageously achieved industrially by using the printed wiring bodies that are located opposite to each other on both the front and back surfaces of the sub-printed board.
以下、図面の例示に基いて本考案を詳述する。
本考案に係るプリント配線体２０は、メインプリ
ント基板１に穿設した嵌合穴２にサブプリント基
板３の端縁部４を嵌合し、サブプリント基板３の
両面に設けられた導電ランド５，６と対応するメ
インプリント基板１の導電ランド７，８とを半田
結合したものであり、第３図に示すように前記嵌
合穴２内に嵌まり込むサブプリント基板３の端縁
部４は該サブプリント基板３の嵌込み方向に延び
る分割溝１１によつて複数個に分割されており、
該複数個の分割部分例えば、４ａ，４ｂ，４ｃお
よび４ｄにおいてはレジスト層１２と導電ランド
形成部位５がサブプリント基板３の同一面では交
互に位置し、かつ同一の分割部分、例えば分割部
分４ａにおいては第４図に示すように前記レジス
ト層１２と導電ランド形成部位５が該サブプリン
ト基板３の表裏両面で対向して位置するように位
置している。 Hereinafter, the present invention will be explained in detail based on the illustrations of the drawings.
The printed wiring body 20 according to the present invention has an end edge 4 of a sub-printed board 3 fitted into a fitting hole 2 formed in a main printed board 1, and conductive lands 5 provided on both sides of the sub-printed board 3. , 6 and the corresponding conductive lands 7, 8 of the main printed circuit board 1 are soldered together, and as shown in FIG. is divided into a plurality of parts by a dividing groove 11 extending in the fitting direction of the sub-printed board 3,
In the plurality of divided portions, for example, 4a, 4b, 4c, and 4d, the resist layer 12 and the conductive land forming portion 5 are alternately located on the same surface of the sub-printed board 3, and in the same divided portion, for example, divided portion 4a. As shown in FIG. 4, the resist layer 12 and the conductive land forming portion 5 are located opposite each other on both the front and back surfaces of the sub-printed board 3.
以上の説明に明らかなように、本考案において
はメインプリント基板１に嵌込まれるサブプリン
ト基板３の端縁部４が分割溝１１によつて複数個
に分割され、サブプリント基板３の導電ランド形
成部位５が該サブプリント基板３の表裏両面にお
いてジグザグ状に位置して半田付けされ、また同
一の分割部分においては片面のみにサブプリント
基板３の導電ランド形成部位５または６とメイン
プリント基板１の導電ランド形成部位７または８
との半田接続部位９を形成するので、前述のプリ
ント基板と半田との熱膨張率の差ならびに半田熔
着量の差に起因するクラツクの発生を完全に防止
することができる。 As is clear from the above description, in the present invention, the edge portion 4 of the sub-printed board 3 fitted into the main printed board 1 is divided into a plurality of parts by the dividing groove 11, and the conductive land of the sub-printed board 3 is divided into a plurality of parts by the dividing groove 11. The forming portions 5 are located in a zigzag pattern on both the front and back sides of the sub-printed board 3 and are soldered, and in the same divided portion, the conductive land forming portions 5 or 6 of the sub-printed board 3 and the main printed board 1 are formed only on one side. Conductive land formation site 7 or 8
Since the solder connection portion 9 is formed between the printed circuit board and the solder, it is possible to completely prevent the occurrence of cracks caused by the difference in coefficient of thermal expansion and the difference in the amount of solder welding between the printed circuit board and the solder.
従つて本考案は、プリント配線体のヒートサイ
クル特性の向上に顕著な改善効果をもたらすもの
である。 Therefore, the present invention brings about a remarkable improvement effect in improving the heat cycle characteristics of printed wiring bodies.
第１図は在来のプリント配線体を分解状態で示
す全体斜視図、第２図は第１図に示すメインプリ
ント基板へのサブプリント基板の熔着状態を説明
するプリント配線体要部の横断面図である。また
第３図は本考案に係るプリント配線体の斜視図で
あり、第４図は本考案要部の横断面図である。
１……メインプリント基板、２……嵌合穴、３
……サブプリント基板、４……凸部または端縁
部、５，６……導電ランド、７，８……導電ラン
ド、９，１０……半田、１１……分割溝、４ａ，
４ｂ，４ｃ，４ｄ……分割部分、１２……レジス
ト層。
Fig. 1 is an overall perspective view showing a conventional printed wiring board in an exploded state, and Fig. 2 is a cross-sectional view of the main parts of the printed wiring board, illustrating the state of welding of the sub-printed circuit board to the main printed circuit board shown in Fig. 1. It is a front view. Further, FIG. 3 is a perspective view of a printed wiring body according to the present invention, and FIG. 4 is a cross-sectional view of the main part of the present invention. 1... Main printed circuit board, 2... Fitting hole, 3
...Sub printed board, 4... Convex portion or edge, 5, 6... Conductive land, 7, 8... Conductive land, 9, 10... Solder, 11... Division groove, 4a,
4b, 4c, 4d... divided portion, 12... resist layer.
Claims (1)
リント基板の端縁部を嵌合し、サブプリント基板
の両面に設けられた導電ランドと対応するメイン
プリント基板の導電ランドとを半田結合したプリ
ント配線体であつて、前記嵌合穴内に嵌まり込む
サブプリント基板の端縁部は該サブプリント基板
の嵌込み方向に延びる分割溝によつて複数個に分
割されており、該複数個の分割部分にはレジスト
層と導電ランド形成部位がサブプリント基板の同
一面では交互に位置しかつ同一の分割部分におい
ては前記レジスト層と導電ランド形成部位が該サ
ブプリント基板の表裏両面で対向するように位置
していることを特徴とする前記プリント配線体。 Printed wiring in which the edges of the sub-printed circuit board are fitted into fitting holes drilled in the main printed circuit board, and the conductive lands provided on both sides of the sub-printed circuit board are soldered to the corresponding conductive lands on the main printed circuit board. The edge portion of the sub-printed board that fits into the fitting hole is divided into a plurality of parts by a dividing groove extending in the fitting direction of the sub-printed board, and the plurality of divided parts The resist layer and the conductive land formation portion are located alternately on the same surface of the sub-printed board, and the resist layer and the conductive land formation portion are located opposite each other on both the front and back surfaces of the sub-printed board in the same divided portion. The printed wiring body characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18150481U JPS5885379U (en) | 1981-12-04 | 1981-12-04 | printed wiring body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18150481U JPS5885379U (en) | 1981-12-04 | 1981-12-04 | printed wiring body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5885379U JPS5885379U (en) | 1983-06-09 |
| JPS6233350Y2 true JPS6233350Y2 (en) | 1987-08-26 |
Family
ID=29979042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18150481U Granted JPS5885379U (en) | 1981-12-04 | 1981-12-04 | printed wiring body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5885379U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269550A (en) * | 2005-03-22 | 2006-10-05 | Sharp Corp | Printed wiring board and mounting structure thereof |
-
1981
- 1981-12-04 JP JP18150481U patent/JPS5885379U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5885379U (en) | 1983-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0223024Y2 (en) | ||
| JPH0412714Y2 (en) | ||
| JPS6233350Y2 (en) | ||
| JPH01289190A (en) | Terminal structure of printed board connection | |
| JP3901625B2 (en) | Bonding structure of chip parts to bus bar | |
| JPS59191761U (en) | printed board | |
| JPH0348490A (en) | Printed wiring board and formation thereof | |
| JP2004327605A (en) | Printed circuit board connection structure | |
| JPH0537271A (en) | Electrode forming method for chip parts | |
| JPH0244537Y2 (en) | ||
| JPH01112793A (en) | Circuit substrate | |
| KR0135036Y1 (en) | Thin film type chip parts of double structure with double resistors | |
| JPH0718476U (en) | Printed board | |
| JPH09283867A (en) | Printed wiring board | |
| JPS6020300Y2 (en) | printed wiring board | |
| JPS6141272Y2 (en) | ||
| JPH11283859A (en) | Chip-shaped circuit part | |
| JPH045280B2 (en) | ||
| JPH0217694A (en) | Printed wiring board for surface-mounted electronic component mounting | |
| JPH0563326A (en) | Combination board terminal structure | |
| JPH0288268U (en) | ||
| JPH10163582A (en) | Printed circuit board for reflow soldering | |
| JPS584213Y2 (en) | Electric circuit wiring body | |
| JPS626711Y2 (en) | ||
| JPH0397969U (en) |