JPS623571U - - Google Patents
Info
- Publication number
- JPS623571U JPS623571U JP9282385U JP9282385U JPS623571U JP S623571 U JPS623571 U JP S623571U JP 9282385 U JP9282385 U JP 9282385U JP 9282385 U JP9282385 U JP 9282385U JP S623571 U JPS623571 U JP S623571U
- Authority
- JP
- Japan
- Prior art keywords
- target
- recess
- magnetron sputtering
- back surface
- sputtering device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims 2
- 238000001514 detection method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000005672 electromagnetic field Effects 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は本考案の一実施例に係わる要部を示す
側面図、第２図は第１図の外観を示す斜視図、第
３図は第１図に示すターゲツトの消耗特性例を示
す図、第４図は従来構成になるマグネトロンスパ
ツタ装置の概略を示す側断面図、第５図は第４図
に示すターゲツトの上に形成される直交電磁界を
模式的に示す図、第６図はターゲツトの消耗状況
を説明するための図、である。
図中において、１，１９はターゲツト、２は凹
所、３，２６はスパツタ領域、４は板状部材、５
，２２はバツキングプレート、１１はマグネトロ
ンスパツタ装置、を示す。
Fig. 1 is a side view showing the main parts of an embodiment of the present invention, Fig. 2 is a perspective view showing the external appearance of Fig. 1, and Fig. 3 is a diagram showing an example of the consumption characteristics of the target shown in Fig. 1. , FIG. 4 is a side sectional view schematically showing a conventional magnetron sputtering device, FIG. 5 is a diagram schematically showing an orthogonal electromagnetic field formed on the target shown in FIG. 4, and FIG. is a diagram for explaining the state of consumption of the target. In the figure, 1 and 19 are targets, 2 is a recess, 3 and 26 are sputter areas, 4 is a plate-like member, and 5
, 22 is a bucking plate, and 11 is a magnetron sputtering device.
Claims (1)
たは該ターゲツトと同一材料にてなり該裏面に上
面が接する板状部材４の該上面の何れかに、スパ
ツタ領域３の少なくとも一部分に対向する凹所２
を形成してなり、該スパツタ領域３の消耗が該凹
所２に貫通したことの検出手段を具えてなること
を特徴とするマグネトロンスパツタ装置。 A recess 2 facing at least a portion of the sputtering area 3 is provided either on the back surface of the target 1 whose surface is to be sputtered or on the upper surface of the plate member 4 made of the same material as the target and whose top surface is in contact with the back surface.
2. A magnetron sputtering device comprising: a magnetron sputtering device comprising: a detection means for detecting that the wear of the sputtering region 3 has penetrated into the recess 2;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9282385U JPS623571U (en) | 1985-06-19 | 1985-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9282385U JPS623571U (en) | 1985-06-19 | 1985-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS623571U true JPS623571U (en) | 1987-01-10 |
Family
ID=30649961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9282385U Pending JPS623571U (en) | 1985-06-19 | 1985-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS623571U (en) |
-
1985
- 1985-06-19 JP JP9282385U patent/JPS623571U/ja active Pending