JPS623585B2 - - Google Patents
Info
- Publication number
- JPS623585B2 JPS623585B2 JP5677278A JP5677278A JPS623585B2 JP S623585 B2 JPS623585 B2 JP S623585B2 JP 5677278 A JP5677278 A JP 5677278A JP 5677278 A JP5677278 A JP 5677278A JP S623585 B2 JPS623585 B2 JP S623585B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- base
- resin
- ribbon
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明はめつき方法、特に樹脂封止型集積回路
装置（モールドIC）のめつき方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating method, particularly to a method for plating a resin-sealed integrated circuit device (molded IC).
第１図は従来方法によるモールドIC用ベース
リボンの外装めつき（例えば錫めつき、半田めつ
きなど）方法を模式的に説明する図で、ａはベー
スリボンを取り付けためつき液槽の断面図で、ｂ
はその取付け状態を示す部分側面図である。半導
体素子を樹脂封止したベースリボン１は、外部リ
ードフレーム２および樹脂３から成る短冊状のも
のであり、引掛けピン４を有するめつき治具５に
固定される。めつきの際は、めつき治具５を陽極
６と対向させ、めつき液７を満たしためつき液槽
８の中に配置する。ベースリボン１のめつき治具
５への取付け、取外しは１枚ずつ手作業で行なう
のが普通であり、この繁雑さが、めつき工程のな
かで労力的、時間的に大きな比重を占め、又、ベ
ースリボン１を垂直面に並列させて取り付ける方
法のため、バツチ当りのめつき処理可能なベース
リボンの枚数が少なくなり、作業効率が著しく劣
るという欠点があつた。 Figure 1 is a diagram schematically explaining a conventional method for exterior plating (for example, tin plating, solder plating, etc.) of a base ribbon for molded ICs, and a is a cross-sectional view of a plating liquid tank for attaching the base ribbon. So, b
is a partial side view showing the attached state. A base ribbon 1 in which a semiconductor element is sealed with resin is a strip-shaped ribbon made of an external lead frame 2 and a resin 3, and is fixed to a plating jig 5 having hook pins 4. During plating, the plating jig 5 is placed opposite the anode 6 in a plating liquid tank 8 filled with a plating liquid 7. Normally, the attachment and detachment of the base ribbon 1 to the plating jig 5 is done manually one by one, and this complexity accounts for a large amount of labor and time in the plating process. Furthermore, since the base ribbons 1 are mounted in parallel on a vertical plane, the number of base ribbons that can be plated per batch is reduced, resulting in a significant decrease in work efficiency.
本発明は、上記の欠点を解消するためになされ
たもので、作業効率の高いめつき方法を提供せん
とするものである。即ち本発明は、樹脂モールド
部を介在物としてベースリボンを積層させること
によつて、めつき治具への取付け、取外しが簡単
にでき、且つバツチ当りのベースリボンの処理数
を多くし、高効率なめつきを行なうことを可能に
したものである。 The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a plating method with high work efficiency. In other words, the present invention makes it possible to easily attach and detach the base ribbons to and from the plating jig by laminating the base ribbons using the resin molded part as an intervening material. This makes it possible to perform efficient licking.
以下、本発明を実施例により説明する。 The present invention will be explained below using examples.
第２図は、本発明を説明する図で、短冊状のベ
ースリボンを、樹脂モールド面を接して100〜150
枚積み重ね、外部リードフレーム２に予め設けて
あるガイドホールにめつき治具９を差し込み、固
着した状態を模式的に示したものである。第１図
と同様に、ａはベースリボンを取り付けためつき
液槽の断面図、ｂはその取付け状態を示す部分的
側面図である。この方法によつて光沢錫めつきを
行なつたところ、従来方法の際に見られたベース
リボンの周辺部のめつき厚が大きくなるエツジ効
果も極めて少なく、バラツキの小さい均質なめつ
き厚が得られた。又、ベースリボンの取外しも、
ガイドホールを利用しているので個々に取り外す
ことなく一操作で行なうことが可能であり、取付
け、取外しに要する時間が著しく短縮されバツチ
当りに可能な処理枚数も従来法の10〜15倍とな
り、極めて効率の高いことが確認出来た。 Figure 2 is a diagram explaining the present invention, in which a strip-shaped base ribbon is placed in contact with the resin mold surface and
This figure schematically shows a state in which the lead frames are stacked, a plating jig 9 is inserted into a guide hole provided in advance in the external lead frame 2, and they are fixed. Similarly to FIG. 1, a is a cross-sectional view of the fixing liquid tank for attaching the base ribbon, and b is a partial side view showing the attached state. When bright tin plating was performed using this method, the edge effect of increasing the plating thickness around the periphery of the base ribbon, which was observed in the conventional method, was extremely suppressed, and a uniform plating thickness with little variation was obtained. It was done. Also, removing the base ribbon
Since guide holes are used, it is possible to do this in one operation without having to remove each item individually.The time required for installation and removal is significantly shortened, and the number of sheets that can be processed per batch is 10 to 15 times that of conventional methods. It was confirmed that the efficiency was extremely high.
上記実施例は、樹脂モールド済ベースリボンに
錫めつきを行なつたが、樹脂以外の絶縁材を局部
的に設けた短冊状の被めつき材に適用することも
可能である。例えば短冊状被めつき材に部分的に
めつきを施す場合、めつきをしたい部分及びめつ
き治具へ取付けの際に必要な電気的接点部以外
を、不導体塗料や不導体治具によつてマスキング
し、上記実施例で説明したようにそれぞれのマス
キング部を接して被めつき材を積み重ねて取り付
け、めつきを施した後、マスキング材を剥離ある
いは取り外す方法に応用出来る。 In the above embodiment, the resin-molded base ribbon was tin-plated, but it is also possible to apply it to a strip-shaped plated material locally provided with an insulating material other than resin. For example, when partially plating a strip-shaped material to be plated, apply non-conductive paint or non-conductive jig to the parts other than the parts to be plated and the electrical contact points required when attaching to the plating jig. Therefore, it can be applied to a method in which masking is performed, the masking parts are stacked and attached as described in the above embodiments, and plating is applied, and then the masking material is peeled off or removed.
以上、説明したように本発明の方法によれば、
被メツキ材のバツチ当り処理枚数の集積度が上
り、作業効率の高いめつきが可能で、その効果は
著しい。 As explained above, according to the method of the present invention,
The number of sheets to be plated per batch is increased, and plating with high work efficiency is possible, with remarkable effects.
第１図は、従来方法によるベースリボンのめつ
き方法を説明する図で、ａはベースリボンを取り
付けためつき液槽の断面図、ｂはその取付け状態
を示す部分側面図、第２図は本発明方法を説明す
る図で、ａはベースリボンを取り付けためつき液
槽の断面図、ｂはその取付け状態を示す部分側面
図である。
１……ベースリボン、２……外部リードフレー
ム、３……樹脂、４……引掛けピン、５……めつ
き治具、６……陽極、７……めつき液、８……め
つき液槽、９……めつき治具。
Fig. 1 is a diagram explaining a conventional method of plating a base ribbon, in which a is a cross-sectional view of a plating liquid tank for attaching a base ribbon, b is a partial side view showing the attached state, and Fig. 2 is a diagram of the present invention. FIG. 1 is a diagram illustrating the method of the invention, in which a is a cross-sectional view of a pinning liquid tank to which a base ribbon is attached, and b is a partial side view showing the attached state. 1... Base ribbon, 2... External lead frame, 3... Resin, 4... Hook pin, 5... Plating jig, 6... Anode, 7... Plating liquid, 8... Plating Liquid tank, 9...Plating jig.
Claims (1)
スリボンを複数枚同時にめつきする方法におい
て、該ベースリボンの複数枚を、それぞれの樹脂
モールド部を接して積層させ、めつき液槽内に取
り付けることを特徴とする半導体装置用ベースリ
ボンのめつき方法。1. A method for simultaneously plating a plurality of base ribbons each having a series of resin-molded semiconductor devices, characterized in that the plurality of base ribbons are stacked with their respective resin mold parts touching and installed in a plating liquid tank. A method for plating base ribbons for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5677278A JPS54148379A (en) | 1978-05-12 | 1978-05-12 | Plating method of base ribbon for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5677278A JPS54148379A (en) | 1978-05-12 | 1978-05-12 | Plating method of base ribbon for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54148379A JPS54148379A (en) | 1979-11-20 |
| JPS623585B2 true JPS623585B2 (en) | 1987-01-26 |
Family
ID=13036757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5677278A Granted JPS54148379A (en) | 1978-05-12 | 1978-05-12 | Plating method of base ribbon for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54148379A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62108563A (en) * | 1985-11-06 | 1987-05-19 | Mitsubishi Electric Corp | Plating treater |
| US5512780A (en) * | 1994-09-09 | 1996-04-30 | Sun Microsystems, Inc. | Inorganic chip-to-package interconnection circuit |
-
1978
- 1978-05-12 JP JP5677278A patent/JPS54148379A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54148379A (en) | 1979-11-20 |
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