JPS6267193A - Method for plating etching frame - Google Patents

Abstract

PURPOSE:To plate plural etching frames with high work efficiency without causing deformation by fixing a sheet holding the frames connected in series on a jig after positioning and by blowing a plating soln. on the frames through the holes in the jig. CONSTITUTION:Many etching frames 2 are arranged in a frame-shaped sheet 1 formed by etching through bridge parts 3 and the frames 2 are connected in series. A pair of positioning holes 4, 4 are pierced in the sheet 1 at proper peripheral positions. The positioning pins 6, 6 of a jig 5 made of a rubber plate contg. metallic cores 7 are inserted into the holes 4, 4 to fix the sheet 1 on the jig 5 in a close contact state. A plating soln. is then blown on the etching frames 2 from the nozzles 10 of a plating soln. feeding pipe 9 through the holes 8 in the jig 5. The holes 8 correspond to the parts of the frames 2 to be plated. Thus, the frames 2 are spot-plated.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for plating silver, gold, nickel, etc. at desired locations on a frame of an IC component or the like formed by etching.

(Prior Art) Conventionally, in the above-mentioned plating process, as shown in FIG. The plating solution is sprayed from below the jig 5 loaded with a large number of etching frames 2 through the holes 8 formed in the jig 5, and placed at a predetermined location of each etching frame 2, for example, for chip mounting. Silver plating is applied to the island etc.

(Problems to be Solved by the Invention) However, in the above conventional method, each individual etching frame 2 is manually loaded into the jig 5, resulting in poor workability and low productivity. Ta. Furthermore, the inner lead may be deformed during the frame loading process, which may be a cause of wire bonding failure. Furthermore, when etching frames are supplied in a stacked manner, there is a high possibility that two sheets will be loaded one on top of the other.

(Means for Solving the Problems) In order to solve the above-mentioned conventional drawbacks, the present invention positions and loads a notebook material, in which a plurality of etching frames are connected in series, into a plating jig, and then removes the etching frames from the etching frame. The method was to apply plating to the desired locations.

(Function) According to the above method, one sheet material formed by etching processing is generally provided with about 10 to 20 etching frames, and the plating process is performed in units of 60 to 320 parts. will be carried out.

(Example) FIG. 1 shows a frame loading state in the method of the present invention.

A large number (10 to 20) of etching frames 2 are arranged on one sheet material 1 formed by etching and connected in series via bridge portions 3.

A pair of positioning holes 4.4 are provided at appropriate locations around the periphery of the sheet material 1.
This hole 4.4 is aligned with the positioning pin 6.6 of the jig 5 as a mask for spot plating, and the jig is tightly loaded onto the jig.

The jig 5 is constructed as a rubber plate reinforced with a metal core material 7, and has holes 8 corresponding to plated parts of each etching frame 2, for example, a depth mounting island.
is formed.

The jig 5 with the sorting material 1 positioned and loaded in this way is placed on the plating solution supply pipe 9, as shown in FIG.
The plating liquid blown out from the nozzle group 1O is supplied to a desired plating location on the edging flake J2 through the hole 8 of the jig 5. In this case, said locating pin 6.6 acts as a cathode electrode.

In the embodiments, the case where spot plating is applied to the etching frame has been explained as an example, but the present invention is also applicable to the case where the entire surface is plated.

(Effects of the Invention) As explained above, according to the method of the present invention, workability is greatly improved because a sheet material having a large number of etching frames is handled as one unit. Furthermore, since the number of handling operations relative to the number of parts is greatly reduced, the possibility of deforming the frame is also reduced, which is effective in maintaining quality. In addition, since large sorting materials are handled, there is almost no fear of double loading.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a sheet material loading state in the method of the present invention, FIG. 2 is a sectional view of a main part during plating processing, and FIG. 3 is a perspective view showing a frame loading state in a conventional method. l. Sorting material 2...Etching frame 5...Jig

Claims (1)

[Claims] (1) A method for plating an etching frame, which comprises positioning and loading a sheet material in which a plurality of etching frames are connected in series into a plating jig, and plating desired locations on the etching frame.