JPS6236533U - - Google Patents
Info
- Publication number
- JPS6236533U JPS6236533U JP1985126828U JP12682885U JPS6236533U JP S6236533 U JPS6236533 U JP S6236533U JP 1985126828 U JP1985126828 U JP 1985126828U JP 12682885 U JP12682885 U JP 12682885U JP S6236533 U JPS6236533 U JP S6236533U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor device
- cavity
- ceramic
- dip type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/381—Auxiliary members
- H10W72/387—Flow barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の１実施例に係るサーデイツプ
型半導体装置用パツケージの断面図である。第２
図参照は本考案の他の実施例に係るサーデイツプ
型半導体装置用パツケージの断面図である。第３
図は従来技術に係るサーデイツプ型半導体装置用
パツケージの断面図である。
１……本体、２……導電性ペースト、３……キ
ヤビテイ、４……低融点ガラス、５……リード、
６……半導体チツプ、７……溝。
FIG. 1 is a sectional view of a package for a deep dip type semiconductor device according to an embodiment of the present invention. Second
Referring to the figure, there is shown a sectional view of a package for a deep dip type semiconductor device according to another embodiment of the present invention. Third
The figure is a cross-sectional view of a package for a deep dip type semiconductor device according to the prior art. 1... Main body, 2... Conductive paste, 3... Cavity, 4... Low melting point glass, 5... Lead,
6...Semiconductor chip, 7...Groove.
Claims (1)
ツプ搭載用キヤビテイが設けられ、前記本体の上
面にはリードが低融点ガラスをもつて接着されて
なるサーデイツプ型半導体装置用パツケージにお
いて、 前記パツケージのキヤビテイ周辺に溝が設けら
れてなることを特徴とするサーデイツプ型半導体
装置用パツケージ。[Claims for Utility Model Registration] A package for a ceramic semiconductor device, comprising a ceramic body, a cavity for mounting a semiconductor chip in the center, and a lead bonded to the top surface of the body using low-melting glass. A package for a deep dip type semiconductor device, characterized in that a groove is provided around a cavity of the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985126828U JPS6236533U (en) | 1985-08-20 | 1985-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985126828U JPS6236533U (en) | 1985-08-20 | 1985-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6236533U true JPS6236533U (en) | 1987-03-04 |
Family
ID=31021005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985126828U Pending JPS6236533U (en) | 1985-08-20 | 1985-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236533U (en) |
-
1985
- 1985-08-20 JP JP1985126828U patent/JPS6236533U/ja active Pending