JPS6237933U - - Google Patents

Info

Publication number
JPS6237933U
JPS6237933U JP1985130488U JP13048885U JPS6237933U JP S6237933 U JPS6237933 U JP S6237933U JP 1985130488 U JP1985130488 U JP 1985130488U JP 13048885 U JP13048885 U JP 13048885U JP S6237933 U JPS6237933 U JP S6237933U
Authority
JP
Japan
Prior art keywords
semiconductor
bump
blade
semiconductor wafer
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985130488U
Other languages
English (en)
Other versions
JPH0135475Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985130488U priority Critical patent/JPH0135475Y2/ja
Publication of JPS6237933U publication Critical patent/JPS6237933U/ja
Application granted granted Critical
Publication of JPH0135475Y2 publication Critical patent/JPH0135475Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Dicing (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る半導体製造装置であるウ
エーハダイシング用ブレードとバンプ切削手段の
一実施例を示す斜視図、第２図は第１図のブレー
ドによる半導体ウエーハのダイシングとバンプ切
削の動作説明図、第３図と第４図は各左図が第１
図のバンプ切削手段による切削前のバンプ電極の
各側面図で、各右図は切削後のバンプ電極の各側
面図、第５図はＤＨＤ型ダイオードの側断面図、
第６図は半導体ウエーハの平面図、第７図はバン
プ電極を有する半導体ペレツトの側面図、第８図
は噴流式メツキ装置の要部概略側断面図、第９図
はコブ状部の出来たバンプ電極を有する半導体ペ
レツトの側面図である。 ５…半導体ペレツト、６，６ｂ，６ｃ，６ｄ，
６ｅ…バンプ電極、８…半導体ウエーハ、１２…
ブレード、１３…回転軸、１４…バンプ切削手段
。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体ウエーハにバンプ電極を形成した後、ウ
    エーハ表面に平行な軸を回転軸とするブレードを
    所定高さまで回転・下降させ、上記半導体ウエー
    ハをダイシングして各半導体ペレツト毎に分割す
    る半導体製造装置において、 上記ブレードの回転軸に同軸的にバンプ切削手
    段を設けたことを特徴とする半導体製造装置。
JP1985130488U 1985-08-26 1985-08-26 Expired JPH0135475Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985130488U JPH0135475Y2 (ja) 1985-08-26 1985-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985130488U JPH0135475Y2 (ja) 1985-08-26 1985-08-26

Publications (2)

Publication Number Publication Date
JPS6237933U true JPS6237933U (ja) 1987-03-06
JPH0135475Y2 JPH0135475Y2 (ja) 1989-10-30

Family

ID=31028034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985130488U Expired JPH0135475Y2 (ja) 1985-08-26 1985-08-26

Country Status (1)

Country Link
JP (1) JPH0135475Y2 (ja)

Also Published As

Publication number Publication date
JPH0135475Y2 (ja) 1989-10-30

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