JPS6238154U - - Google Patents

Info

Publication number
JPS6238154U
JPS6238154U JP1985129444U JP12944485U JPS6238154U JP S6238154 U JPS6238154 U JP S6238154U JP 1985129444 U JP1985129444 U JP 1985129444U JP 12944485 U JP12944485 U JP 12944485U JP S6238154 U JPS6238154 U JP S6238154U
Authority
JP
Japan
Prior art keywords
chip
heat generating
generating resistor
flip
print head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985129444U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985129444U priority Critical patent/JPS6238154U/ja
Publication of JPS6238154U publication Critical patent/JPS6238154U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electronic Switches (AREA)

Description

【図面の簡単な説明】
第1図は本考案サーマルプリントヘツドの一実
施例を示す部分切欠平面図、第2図は同実施例に
おけるICチツプの拡大裏面図、第3図は第1図
の―線拡大縦断面図、第4図は従来のICチ
ツプの第2図同様図である。 (符号の説明)、1……基板、2……発熱抵抗
体、3……フリツプチツプ型ICチツプ、30…
…側辺部、31……出力端子、4……リード線、
5……外部接続端子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 発熱抵抗体を設けた基板上に、該発熱抵抗体及
    び外部接続端子に接続されるリード線を被着形成
    すると共に該リード線に上記発熱抵抗体を選択的
    に発熱させるためのフリツプチツプ型駆動用IC
    チツプをワイヤレスボンデイングにより接続して
    成るサーマルプリントヘツドに於いて、前記フリ
    ツプチツプ型駆動用ICチツプの出力端子を該I
    Cチツプの一側辺で千鳥状に配列して成ることを
    特徴とするサーマルプリントヘツド。
JP1985129444U 1985-08-23 1985-08-23 Pending JPS6238154U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985129444U JPS6238154U (ja) 1985-08-23 1985-08-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985129444U JPS6238154U (ja) 1985-08-23 1985-08-23

Publications (1)

Publication Number Publication Date
JPS6238154U true JPS6238154U (ja) 1987-03-06

Family

ID=31026018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985129444U Pending JPS6238154U (ja) 1985-08-23 1985-08-23

Country Status (1)

Country Link
JP (1) JPS6238154U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176245A (ja) * 1984-02-23 1985-09-10 Toshiba Corp ワイヤボンデイング方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176245A (ja) * 1984-02-23 1985-09-10 Toshiba Corp ワイヤボンデイング方法

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