JPS61127635U - - Google Patents

Info

Publication number
JPS61127635U
JPS61127635U JP1985009365U JP936585U JPS61127635U JP S61127635 U JPS61127635 U JP S61127635U JP 1985009365 U JP1985009365 U JP 1985009365U JP 936585 U JP936585 U JP 936585U JP S61127635 U JPS61127635 U JP S61127635U
Authority
JP
Japan
Prior art keywords
land portion
leads
lead
wire
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985009365U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985009365U priority Critical patent/JPS61127635U/ja
Publication of JPS61127635U publication Critical patent/JPS61127635U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図乃至第４図は本考案に係る半導体装置の
実施例を説明するためのもので、第１図は本考案
をモノリシツクＩＣに適用した一実施例を示す平
面図、第２図は第１図のＡ―Ａ線に沿う拡大断面
図、第３図は本考案をハイブリツドＩＣに適用し
た実施例を示す平面図、第４図は第３図のＢ―Ｂ
線に沿う断面図である。第５図は従来のモノリシ
ツクＩＣの一例を示す平面図、第６図は第５図の
Ｃ―Ｃ線に沿う断面図である。 ６……半導体ペレツト、８……ボドデイングパ
ツド、１１……リードフレーム、１２……ランド
部、１４……リード、１４ａ……リード先端部、
１６……ワイヤ。

Claims (1)

  1. 【実用新案登録請求の範囲】 リードフレームのランド部上に固着した半導体
    ペレツトのボンデイングパツドと、ランド部の近
    傍まで延びてくる複数のリードの先端部とを、ワ
    イヤで電気的に接続してなる半導体装置において
    、 前記リードのうち、所望のリードの先端部を略
    Ｌ字状に屈曲形成したことを特徴とする半導体装
    置。
JP1985009365U 1985-01-26 1985-01-26 Pending JPS61127635U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985009365U JPS61127635U (ja) 1985-01-26 1985-01-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985009365U JPS61127635U (ja) 1985-01-26 1985-01-26

Publications (1)

Publication Number Publication Date
JPS61127635U true JPS61127635U (ja) 1986-08-11

Family

ID=30489515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985009365U Pending JPS61127635U (ja) 1985-01-26 1985-01-26

Country Status (1)

Country Link
JP (1) JPS61127635U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007059884A (ja) * 2005-07-22 2007-03-08 Marvell World Trade Ltd 高速集積回路用のパッケージング

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007059884A (ja) * 2005-07-22 2007-03-08 Marvell World Trade Ltd 高速集積回路用のパッケージング

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