JPS624231B2 - - Google Patents

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Publication number
JPS624231B2
JPS624231B2 JP56205613A JP20561381A JPS624231B2 JP S624231 B2 JPS624231 B2 JP S624231B2 JP 56205613 A JP56205613 A JP 56205613A JP 20561381 A JP20561381 A JP 20561381A JP S624231 B2 JPS624231 B2 JP S624231B2
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scanning
group
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engraved
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Expired
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JP56205613A
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English (en)
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JPS58107339A (ja
Inventor
Takanobu Yamamoto
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Individual
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Individual
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Publication of JPS58107339A publication Critical patent/JPS58107339A/ja
Publication of JPS624231B2 publication Critical patent/JPS624231B2/ja
Granted legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/02—Engraving; Heads therefor
    • B41C1/04—Engraving; Heads therefor using heads controlled by an electric information signal

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】 この発明は、レーザービームを用いて複数の印
判を同時に彫刻する方法に関する。
本発明者は以前、XYテーブルを用いた印判彫
刻装置を提案した（特開昭55―69458号公報）。か
かる装置は、第１１図のごとく、彫刻すべき形象
に対応した強度のレーザービーム３０をＸ軸方向
に往復動させながら、１回の走査宛て１ピツチだ
けＹ軸方向に進めることにより、印面５を互いに
方向が異なる平行な走査線で彫刻するものであつ
て、彫刻すべき印判１の個数に対応して走査範囲
を限定でき、彫刻所要時間を必要最少限に抑えら
れること、印面は同一速度で走査され、彫刻深さ
が一定となることを特徴とする。ところが、上記
走査速度を上昇させて行くと、ある限界値で、彫
刻すべき形象の読み取り手段および該手段により
制御されるレーザー加工装置の応答が走査速度に
追随しなくなり、彫刻すべき範囲より実際に加工
される範囲が後退する結果、拡大図に示す如く、
加工面３６の境界部分３７が１回の走査毎に左右
にずれ、加工速度をあまり上昇できない問題があ
つた。
上記問題に対し、XYテーブルに代えて回転テ
ーブルを用い、該テーブルを回転させながらＹ軸
方向に低速で移行させることにより、第１２図の
ごとく、印面を渦巻状に走査する装置を提案した
（特開昭55―105598号公報）。かかる装置で走査す
ると、走査線の走査方向が印面の全域に亘り同一
となる結果、加工面３６の境界３７の凹凸がなく
なり、加工面３６が走査速度の上昇に対応して全
体的にずれるだけなので、かかるずれは機械的に
容易に補正でき、走査速度の上昇が図れる。その
反面、走査範囲を彫刻すべき印判の本数に対応し
て変更できず、１本彫刻する場合も複数本彫刻す
る場合も加工時間は同一となる。更に、テーブル
の回転速度が一定の場合、テーブル外周側から内
周側へ走査が進むにつれて走査速度が上昇し、従
つて彫刻深さを一定にしようとすると、走査位置
の移動につれてテーブルの回転速度あるいはレー
ザービームの照射強度を連続的に変更しなければ
ならないなど不都合が多い。
本発明は、上記不都合に着目してなされたもの
であつて、XYテーブルによる直線走査を行なわ
せることにより、走査速度の恒常性および走査範
囲の可変性を維持しながら、走査方向を加工面の
全域にわたつて一定とすることにより、加工装置
の応答性に起因する加工面境界の凹凸を防止でき
る印判彫刻方法を提供することを目的とする。
以下図面に示す実施例に基づき、本発明を具体
的に説明する。
本発明にかかる印鑑彫刻装置は、第１図ないし
第３図に示す如く、多数の印判１を着脱自在に保
持する印判取付部２と、該印判取付部２を支持し
てＸ軸方向（第１図における左右横方向）とＹ軸
方向（第１図における前後縦方向）にそれぞれ水
平姿勢で移動するXYテーブル３を備えた移行部
４と、印判取付部２上に保持された印判１の印面
５に所定の彫刻を施す彫刻部６と、移行部４に制
御信号を送り、XYテーブル３を予め設定してお
いた順序に従つて移動させる制御部７とから構成
される。
印判取付部２は、上面に開口８を有する左右横
長の箱状であつて、該開口８の中央を横断して配
した係止面９で開口８を前後に二等分すると共に
該係止面９と対向する周壁１０・１０にチヤツク
具１１を付設して、印判１を挿嵌保持可能として
いる。図面は、丸形印判１を保持する場合を例示
しており、係止面９に略台形状の保持面１２を等
間隔に凹設すると共に、各保持面１２の対向位置
に、押圧面１３をばね体１４で保持面１２に向け
て付勢したチヤツク具１１を配設することによ
り、各印判１を夫々保持面１２と押圧面１３間で
挾持し、各列に10本ずつ、合計20本の丸形印判１
を、その印面５が上向き状態となる様に垂直姿勢
で保持する。周壁１０の外周には鍔１５が形成さ
れて、移行部４のXYテーブル３に設けた開口８
に印判取付部２を上方から挿脱自在としており、
従つて多数本（本実施例においては20本）の印判
１がひとまとめにして同時に装填される。
移行部４は、基台１６上に可動受台１７をモー
タ１８の回転と連繋してＹ軸方向に往復動自在に
取り付けると共に、可動受台１７上には更に、
XYテーブル３をモータ１９の回転と連繋してＸ
軸方向に往復動自在とすることにより、XYテー
ブル３上に取り付けられた印判取付部２は、後記
する制御部７からの指令によりモータ１８・１９
の駆動時期および回転方向が制御され、XY面内
を自由に移行する。
印判１の印面５上に所定の彫刻を施す彫刻部６
は、印判取付部２の下面２０に備えた原図２１上
の形象を検出する光電装置２２と、該光電装置２
２からの検出信号によりオンオフ制御されるレー
ザー装置２３とから構成される。前記した原図２
１は、印判取付部２に保持される各印判１の印面
５に彫刻すべき文字などの形象を１枚の白紙に黒
字で且つ表字で印判と同一間隔をもつて横一列に
描いたものを２枚用意し、或いは、１枚の白紙宛
て１つの象形を描き、これを印判の数だけ用意し
たものであつて、保持した印判１と形象の位置を
一致、あるいは相関させて原図２１を印判取付部
２の下面２０に配設すると共に、プレート２４で
形象の周囲を覆う。プレート２４は、印面５の外
形よりも僅かに小さい円形の孔２５が印判１と同
一間隔で横一列状に透設された、表面が黒色の横
長板体であつて、該プレートの裏面に原図２１を
各形象が円形孔２５の中心に位置するよう張り合
わせた後、プレート２４を下にして印判取付部下
面２０に装着することにより、原図２１は印判取
付部２に挾着状態で保持される。
光電装置２２は、前記プレート２４および原図
２１上の１点に投光する投光器２７と、反射光線
を受けて電気信号に変換する光電変換器２８とか
ら成る。該光電変換器２８から出力される電気信
号は、制御回路２９を介してレーザー装置２３に
印加され、原図２１上に黒白に応じてレーザー装
置２３をオンオフ、すなわち、投光器２７から出
力される光が原図２１上の白色部分を走査した時
にのみレーザー装置２３をオンし、印面５にレー
ザー光線３０を投射して、象形を裏字で彫刻す
る。
XYテーブル３の移行に規制する制御部７に
は、第３図のごとく例えばマイクロプロセツサ３
１が使用される。該マイクロプロセツサ３１は、
メモリ３２を備えて第４図に示す操作手順を記憶
させておくと共に、インターフエース回路３３を
介して移行部４のモータ１８・１９に接続され
る。インターフエース回路３３には更に、初期値
設定用のキーボードあるいはスイツチ３４が繋が
れており、従つて彫刻動作に先立つて、印判１の
数あるいは走査ピツチなどの条件を入力したあ
と、制御部７を起動すると、メモリ３２内のプロ
グラムに従つてモータ１８・１９に駆動信号が印
加され、XYテーブル３が直線移行される。
本発明は、XYテーブル３の移行順路、すなわ
ち、レーザービームによる印面５の走査順路にそ
の特徴を有する。以下第５図に示すごとく、印判
取付部２の前列および後列に５本ずつ、合計10本
の２組の印判群１ａ・１ｂを装着して彫刻する場
合を例にとつて説明する。Ｘ軸方向の長さを
W1，両印判群１ａ・１ｂの間隔をD1、走査ピツ
チをh1とし、前記側印判群１ａの左側後端縁を走
査開始点３５とすると、該開始点３５からＸ軸方
向にW1進んで前列側の印判群１ａを走査したあ
とＹ軸方向にD1進むと、レーザービームによる
加工点は後列側の印判群１ｂの右側後端縁にくる
ので、今度はＸ軸負方向へW1移行することによ
り、後列側の印判群１ｂが左側に走査される。か
かる走査が終ると、加工点は後列側印判群１ｂの
左側後端縁に移つているので、更にＹ軸負方向へ
D1＋h1進むことにより、前回の走査起点３５よ
り１ピツチだけＹ軸負方向に進んだ地点に達し、
１回の走査サイクルを終了する。かかる走査サイ
クルを、加工点が印判群１ａ・１ｂの前端縁に達
するまで続けることにより、前列側の印判群１ａ
はピツチh1で右方向に平行走査され、後列側の印
判群１ｂは反対に、左方向に印面５が全面に亘つ
て走査されるのである。
なお前列側印判群１ａの後縁は本実施例では保
持面１２で位置規制されており、印判サイズにか
かわらず一定であるため、走査開始点３５として
好適であるがそれに限られず、第６図のごとく前
列印判群１ａの前端縁を走査開始点３５としても
よい。その他、第７図のように、１回の走査サイ
クル毎に渦巻き状にレーザービームで走査しても
同様な動作が期待できる。
更に印判群は２列に限定されるものではなく、
第８図のごとく１列、あるいは、第９図のごとく
偶数列の場合も本発明を実施できる。１列の場
合、１回の走査を終える毎に印判群１ａの外周を
最短距離で移行し、前回の走査開始点より１ビツ
チＹ軸方向に進んだ位置に戻る。印判群が４列の
場合は、２列分を１組とし、２列の場合と略同様
な手順で走査することにより、各印面が全面に亘
り同一方向に走査される。
更に又、第１０図のごとく、両印判群１ａ，１
ｂを離間させ、一方の印判群１ａから他方の印判
群１ｂへ移行する区間にも印判１ｃを配設するこ
とが可能である。この場合、Ｙ軸方向に走査線を
１ビツチずつずらせると共に、Ｘ軸方向にも１ビ
ツチずつずらせて走査して行く必要がある。
なお上記実施例では、印判の個数あるいは直径
などに応じて走査範囲をキーボード３４により数
値でセツトする様に構成したが、印判取付部２の
保持面１２などに印判検出用のマイクロスイツチ
を配し、印判のセツトと同時に印判の取り付け範
囲を検出し、自動的にレーザービームによる走査
範囲を設定するようにできる。その他、角形の印
判を彫刻する場合も同様である。
本発明は上記のごとく、XYテーブルを用いて
直線走査させると共に、該走査方向を印面５の全
域に亘り同一方向となるようにしたので、直線走
査の場合の特長、すなわち、走査範囲を容易に変
更できること及び走査速度が全域に亘り同一であ
ることを維持しながら、渦巻き走査の場合の特長
である、走査速度を上昇させても加工境界線が凹
凸状になることはなく、加工速度の上昇が図れる
ことを兼ね備えるという優れた効果を有する。
【図面の簡単な説明】
第１図は本発明を実施する装置の平面図、第２
図は一部を破断した正面図、第３図は制御部の概
略を示すブロツク図、第４図は走査手順の一例を
示す流れ図、第５図は走査方法を示す説明図、第
６図ないし第１０図は本発明にかかる走査方法の
他の実施例を示す説明図である。第１１図および
第１２図は従来例を示す説明図である。 １…印判、１ａ・１ｂ…印判群、２…印判取付
部、３…XYテーブル、４…移行部、５…印面、
６…彫刻部、７…制御部、３０…レーザービー
ム、３５…走査開始点、３６…加工面。

Claims (1)

  1. 【特許請求の範囲】 １ 複数個の印判１を列状配置した印判群を一体
    とし、該印判群の印面５を、彫刻すべき対象に対
    応する強度のレーザービーム３０で列方向に等速
    で直線走査したあと、該印判群を横切ることなく
    前回の走査開始点より１ピツチだけ走査方向と直
    交する方向に進んだ位置に戻る動作を、彫刻すべ
    き印判群の全面が走査されるまで繰り返すことに
    より、各印面が全面に亘り同一方向で且つ平行に
    彫刻されることを特徴とするレーザービームによ
    る印判彫刻方法。 ２ 前記印判群は、Ｘ軸方向に複数個の印判を配
    置したものがＹ軸方向に偶数列あつて、Ｙ軸方向
    に２組に分けられており、一方の組の印判群をＸ
    軸方向に走査したあとの戻り期間を利用して、他
    方の組の印判群の印面が全面に亘り同一方向で且
    つ平行に彫刻される特許請求の範囲第１項記載の
    印判彫刻方法。
JP56205613A 1981-12-19 1981-12-19 レ−ザ−ビ−ムによる印判彫刻方法 Granted JPS58107339A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56205613A JPS58107339A (ja) 1981-12-19 1981-12-19 レ−ザ−ビ−ムによる印判彫刻方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56205613A JPS58107339A (ja) 1981-12-19 1981-12-19 レ−ザ−ビ−ムによる印判彫刻方法

Publications (2)

Publication Number Publication Date
JPS58107339A JPS58107339A (ja) 1983-06-27
JPS624231B2 true JPS624231B2 (ja) 1987-01-29

Family

ID=16509770

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Country Status (1)

Country Link
JP (1) JPS58107339A (ja)

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