JPS6242523Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention mainly relates to a series of electronic components in which an electronic component having an internal electrode structure is held between lead wire clips, and the lead wire clips are held on a taping member.

Electronic components with internal electrode structures include multilayer ceramic capacitors in which a large number of internal electrodes are buried in layers, and single-layer capacitive ceramic capacitors in which one or both of the electrodes are buried inside a dielectric ceramic substrate. The electronic parts with these internal electrode structures generally have a monolithic moisture-proof structure, so they can be used without an exterior and are highly reliable.In the case of ceramic capacitors, they are small, large capacity, have high insulation properties, and have excellent performance even in a high frequency range. It has characteristics such as exhibiting frequency characteristics, and is becoming widely used in various electronic devices such as electronic computers, communication devices, television receivers, electronic watches, and calculators. The electronic component 1 with these internal electrode structures is
As illustrated in FIGS. 1A and B, internal electrodes 2 and 3 are embedded in layers inside a substrate made of porcelain or the like, and these electrodes 2 and 3 are led out to opposite ends of the substrate, respectively. , each end is electrically connected to end electrodes 4 and 5 which are coated and baked, respectively.

In this way, the electronic component 1 with the internal electrode structure has the end electrodes 4 and 5 at opposite ends, so when used as a chip component for thick film IC or circuit module. This has the advantage that the end electrodes 4, 5 can be bonded directly to a planar conductor pattern.

However, when lead wire clips are continuously held on a taping member at appropriate intervals and electronic components are successively sandwiched between the lead wire clips to obtain a series of soldered electronic components, conventionally, for example, a second As shown in the figure, since both sides 6 and 7 of the lead wire clip were connected and fixed to the end electrodes 4 and 5 by sandwiching them from both ends of the electronic component 1, the support stability of the electronic component 1 deteriorated and a slight There was a problem in that the electronic component 1 easily fell off due to impact such as vibration, resulting in extremely poor work efficiency.

The present invention eliminates the above-mentioned drawbacks, and provides an electronic component series in which the work of clamping and connecting electronic components to lead wire clips is very easy, the support stability is high, and the automation of the production line is very easy. With the goal.

In order to achieve the above object, the present invention provides a rectangular flat electronic component in which end electrodes are formed at intervals along both inner ends and are substantially parallel to each other; An electronic component series comprising a lead wire clip that is sandwiched from the side and fixed to each of the end electrodes by soldering, and a band-shaped taping member that holds the lead wire clip, the lead wire clip being a single piece of lead wire clip. Both sides obtained by bending a wire into a U shape are bent inward so as to be substantially parallel to the longitudinal edge of the electronic component, and the thickness of the electronic component is increased at the lower edge side of the electronic component. a horizontal side portion facing each of both sides of the direction, and a horizontal side portion that is continuous with the horizontal side portion and is bent so as to extend in the length direction along one of the end electrodes, and is fixed to the end electrode by soldering, respectively. It is characterized by being formed by bending the vertical sides.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The content of the present invention will be specifically described below with reference to the accompanying drawings, which are examples. FIG. 3 is a front view of a part of the electronic component series according to the present invention, in which a lead wire clip 8 obtained by bending a single wire into a U shape is attached to a band-shaped taping member 9 made of adhesive tape and a retaining band.
The lead wire clips 8 are held continuously at appropriate intervals, and the electronic components 1 are successively sandwiched and soldered between the leading ends of the lead wire clips 8.

FIG. 4 is an enlarged view showing the connection structure between the electronic component 1 and the lead wire clip ₈ . End electrodes 4 and 5 are formed respectively. The lead wire clip 8 has both sides 6 and 7 obtained by bending a single wire into a U shape with an interval W ₂ in parallel with the longitudinal edge of the electronic component 1. Horizontal side portions 6a, 7a are bent inward so that the horizontal side portions 6a, 7a are bent inward, and vertical side portions are bent so as to extend in the length direction along the end electrode 4 or 5 continuously from the horizontal side portions 6a, 7a. 6b, 7b, the horizontal sides 6a, 7a are in contact with both sides of the electronic component 1 in the thickness direction on the lower edge side of the electronic component 1, and the vertical sides 6b, 7b are connected to the end electrodes. 5 and 4 are fixed by soldering, respectively. A gap _G2 is provided between the side 6 and the end electrode 4 and between the side 7 and the end electrode 5, respectively, so that the side 6 or 7 is electrically insulated from the end electrode 4 or 5. .

As mentioned above, since the lead wire clip 8 is formed by bending a single wire into a U shape, the electronic component 1 can be clipped using the spring action of the lead wire clip 8. This makes the pinching work much easier. Furthermore, after the electronic component 1 is sandwiched between the lead wire clips 8, it can be elastically supported from both sides of the electronic component 1 by the spring action of the lead wire clips 8.

Further, the lead wire clip 8 has horizontal side portions 6a, 7a that are bent inward so as to be substantially parallel to the longitudinal edges of the electronic component 1. are brought into contact with the surfaces in the thickness direction of the electronic component 1 on the lower edge side of the electronic component 1. Therefore, on the lower edge side where the load of the electronic component 1 is greatest, the lateral direction (width direction) of the electronic component 1 is As the support distance becomes longer, the spring pressure by the spring action becomes stronger, and the electronic component 1 that is about to fall due to its own weight can be reliably supported from below, and the lateral support stability can be improved.

Further, an end electrode 4 is provided continuously to the horizontal sides 6a and 7a.
Alternatively, since the electronic component 1 has the vertical sides 6b and 7b bent to extend in the length direction along the
A spring action that is stronger toward the bottom and weaker toward the top is obtained, which reliably supports the electronic component 1 in the vertical direction over a long distance when it is about to fall due to its own weight, and improves the support stability in the vertical direction. The electronic component 1 can be easily clamped by using the weak upper spring pressure. Moreover, the vertical sides 6b, 7
b are soldered and fixed to the end electrodes 5, 4, respectively, so it is possible to increase the soldering distance between the end electrodes 5, 4 and the vertical sides 6b, 7b and increase the soldering strength. can. For this reason, the horizontal side 6
In addition to the effect of improving the lateral support stability by the vertical sides 6b and 7b, the support stability of the electronic component 1 by the lead wire clip 8 is improved as a whole. The electronic component 1 can be stably held between the lead wire clips 8 and will not fall off even if shocks, vibrations, etc. can be reliably prevented.

Next, in the case shown in FIG. 5, the sides 6 and 7 are bent into a ladle shape, and the opposing horizontal sides 6a ₁ , 6a ₂ , 7a ₁ ,
7a ₂ supports the board surface, and the horizontal side 6a ₁
and 6a ₂ and the vertical side 6b between 7a ₁ and 7a ₂ ,
7b are connected and fixed to the end electrodes 5 and 4, respectively.

In this embodiment, the portions that come into contact with the electronic component 1 are horizontal sides 6a ₁ and 6a ₂ , 7a ₁ ,
_7a2 , the support stability in the lateral and vertical directions is even more excellent.

As described above, according to the present invention, the following effects can be obtained.

(a) The lead wire clip is made by bending a single wire into a U-shape, so you can use its spring action to clip electronic components, making the work of clipping electronic components easier. becomes very easy. In addition, after the electronic component is inserted into the lead wire clip, the spring action of the lead wire clip will release the electronic component from both sides.
This can be supported elastically.

(b) The lead wire clip has a horizontal side that is bent inward so as to be approximately parallel to the longitudinal edge of the electronic component, and this horizontal side is connected to the bottom edge of the electronic component. Since the electronic components are placed in contact with the surfaces in the thickness direction of the electronic components, the lateral support distance of the electronic components becomes longer and the spring pressure due to the spring action is reduced at the lower edge side where the load of the electronic components is greatest. This makes it possible to reliably support electronic components from below that are about to fall due to their own weight, and improve lateral support stability.

(c) Since the vertical side is continuous with the horizontal side and is bent so as to extend in the length direction along the end electrode, the spring actuator is stronger toward the bottom of the electronic component and weaker toward the top. The electronic components that are about to fall due to their own weight can be reliably supported vertically over a long distance, improving the vertical support stability and making use of the weak upper spring pressure.
Electronic components can be easily inserted.

(d) Since the vertical sides are fixed to the end electrodes by soldering, it is possible to increase the soldering distance between the end electrodes and the vertical sides, thereby increasing the soldering strength.

(e) As a comprehensive effect of the above, the support stability of electronic components by lead wire clips is very good, and the process from clamping to soldering,
Furthermore, it is possible to provide an electronic component series that can stably hold electronic components between the lead wire clips and reliably prevent them from falling off even if shock, vibration, etc. are applied after soldering.

[Brief explanation of the drawing]

Figure 1A is a plan view of an electronic component with an internal electrode structure;
FIG. 1B is a front sectional view taken along line B ₁ -B ₁ in FIG. 1A, and FIG. 2 is a diagram illustrating problems when connecting electronic components using the electronic components shown in FIG.
FIG. 3 is a front view of a part of the electronic component chain according to the present invention, FIG. 4 is an enlarged view showing the connection structure between electronic components and lead wire clips in the electronic component chain according to the present invention, and FIG. FIG. 4 is an enlarged view showing the connection structure between the electronic component and the lead wire clip. 1...Electronic component, 4, 5... End electrode, 6a,
7a... horizontal side part, 6b, 7b... vertical side part, 8...
Lead wire clip, 9...Taping member.

Claims (1)

[Scope of utility model registration request] A rectangular flat electronic component in which end electrodes are formed at intervals and substantially parallel to each other along both ends in the width direction, and the electronic component is sandwiched from both sides in the thickness direction so that each of the end electrodes An electronic component series comprising a lead wire clip fixed by soldering and a band-shaped taping member for holding the lead wire clip, the lead wire clip being obtained by bending a single wire into a U shape. horizontal sides that are bent inward so as to be substantially parallel to the edges in the length direction of the electronic component and that are in contact with both sides of the electronic component in the thickness direction at the lower edge side of the electronic component; and a vertical side portion that is continuous with the horizontal side portion and is bent so as to extend in the length direction along one of the end electrodes and is fixed to the end electrode by soldering. A series of electronic components featuring: