JPS62189Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an insulator-coated electronic component including a substrate having relatively low strength, such as a piezoelectric ceramic filter.

Conventional piezoelectric ceramic filters, for example,
As shown in the figure, three lead terminals 2, 3, and 4 are fixed with conductive paint to a dielectric ceramic substrate 1 provided with piezoelectric vibrator electrodes, capacitor electrodes, and connection electrodes, and molded with synthetic resin 5. It was made by. However, if the thickness of the synthetic resin 5 is made thinner in order to reduce the size and cost, the strength when the lead terminal 2 is pulled in the direction of the arrow 6 and the strength when the lead terminal 4 is pulled in the direction of the arrow 7 is reduced. strength decreased. That is, even if the lead terminals 2 and 4 are pulled in the directions of arrows 6 and 7 with a relatively weak force,
Cracks occurred near the positions indicated by chain lines 8 and 9. This kind of problem can be solved by making the synthetic resin 5 thicker or by using a stem, but it becomes difficult to reduce the size and cost.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an insulation-coated electronic component that can be miniaturized while preventing a decrease in strength.

To achieve the above object, the present invention will be described with reference to the reference numerals in the drawings showing the embodiments.
For example, a piezoelectric vibrator and/or
Or electrode 1 for forming electronic circuit elements such as capacitors
2, 13, a first connection electrode 15 provided near one end surface of the substrate 11, and the substrate 1
A second connection electrode 16 is provided in the vicinity of the other end surface opposite to one end surface of the substrate 11, one end of which is fixed to the first connection electrode 15, and the other end is fixed to the first connection electrode 15 of the substrate 11. A protrusion 2 that is guided along an extended plane of the main surface and extends parallel to an end surface between the one end surface and the other end surface of the substrate 11.
2, one end thereof is fixed to the second connection electrode 16, and the other end is led out along an extended plane of the main surface of the substrate 11, A second lead terminal 18 having a protrusion 23 extending parallel to the end face between the one end face and the other end face and facing the first lead terminal 17; surrounding the first and second lead terminals 17,1
and an insulator coating 25 provided to surround the one end of the 8 and the protrusions 22 and 23 and to fill the space between the protrusions 22 and 23 and the substrate 11. This is related to.

In the present invention, the protrusions 22 and 23 extend along one side of the rectangular main surface, and since the insulating material coating 25 is also present between the protrusions 22 and 23 and the substrate 11, the protrusions The parts 22 and 23 are the substrate 1
1, and it is possible to provide a ceramic electronic component that has great strength despite being plate-shaped and small.

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 2, 3, and 4 show the voltage filter before resin molding, and FIGS. 5 and 6 show the voltage filter after resin molding. A piezoelectric ceramic substrate 11 made of lead zirconate-lead titanate ceramic (PZT ceramic) is formed into a rectangular shape, and electrodes 12 for forming a vibrator,
12a, 13, 13a, electrodes 14, 14a for forming a capacitor, and connection electrodes 15, 16
etc.

A first lead terminal 17 is fixed with conductive paint to a first connection electrode 15 provided to extend vertically at the left end of the board 11, and a first lead terminal 17 is provided to extend vertically to the right end of the board 11. A second lead terminal 18 is fixed to the second connecting electrode 16 with conductive paint. Furthermore, a third lead terminal 19 is fixed to the capacitor electrode 14a on the back surface as a common lead terminal. These lead terminals 17, 18, 1
9 is a plate-shaped lead member separated from the lead frame.

The first and second lead terminals 17 and 18 are provided with a stepped portion 20 that serves as a stopper when attached to a circuit board.
21, respectively, and also have protrusions 22 and 23 that protrude in the surface direction of the substrate 11, respectively. The third lead terminal 19 at the center also has a pair of protrusions 24 that protrude in the plane direction of the substrate 11. Note that the respective protrusions 22, 23, 24 are connected to the respective lead terminals 1.
7, 18, and 19 at a substantially right angle, and are arranged parallel to the lower end 11a of the substrate 11.
Then, the respective protrusions 22, 23, 24 are arranged so that the mutual spacing between the protrusions 22, 23, 24 is as small as possible.
23 and 24 are formed.

When molding the substrate 11, paraffin, for example, is attached to the piezoelectric vibrator area, covered with a porous synthetic resin, and the paraffin is absorbed into the synthetic resin by heat treatment to create a space in the piezoelectric vibrator area. .

The synthetic resin insulation coating 25 covers not only the substrate 11 but also the first to third lead terminals 1 as shown in FIG.
It is formed to include protrusions 22, 23, and 24 of 7, 18, and 19. As a result, lead wires 17, 18
The synthetic resin insulation coating 25 and the substrate 11 are less likely to be damaged by being pulled in the directions of arrows 26 and 27. That is, as in this embodiment, the protrusions 22, 23, 2
4 and embedding it in the synthetic resin insulation coating 25 greatly increases the strength, and the strength in the direction of arrows 26 and 27 becomes 2.0 kg or more. On the other hand, when the element shown in FIG. 1 is coated with resin 5 to the same thickness as that shown in FIG. 5, the strength in the direction of arrows 6 and 7 is 0.8
~1.2Kg. Therefore, according to this embodiment, the desired strength can be obtained without making the coating 25 very thick.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments, and can be further modified. For example, it is of course applicable to a structure in which the stepped portion 20 is not provided. Further, in the embodiment, both the vibrator and the capacitor are formed on the substrate 11, but the present invention is also applicable to the case where only one of them is formed. Also, lead terminals 17, 18, 1
There is no problem even if 9 is made into a bar shape. Further, in the embodiment, the lead terminals 17, 18 are provided with one protrusion 22, 23, but a plurality of protrusions may be provided. Further, a plurality of protrusions 22, 23, and 24 may be provided, and one of them may be positioned on the substrate 11.
In addition, the protrusions 22 and 23 of the left and right lead terminals 17 and 18 and the protrusion 2 of the center lead terminal 19 in FIG.
4, the protrusions 24 may be made longer and overlapped with each other with a predetermined interval. Further, in the embodiment, the present invention is applied to an element having three lead terminals 17, 18, and 19, but it is of course applicable to an element having two lead terminals or an element having four or more lead terminals. It is. Further, instead of synthetic resin, it may be covered with an insulating material such as glass. Furthermore, by bending the bendable lead wire, the protrusions 22, 23,
24 may be provided.

[Brief explanation of the drawing]

FIG. 1 is a front view of a conventional piezoelectric filter.
2 is a front view showing the piezoelectric filter according to the embodiment of the present invention before molding, FIG. 3 is a rear view of the piezoelectric filter of FIG. 2, and FIG. 4 is a right side view of the piezoelectric filter of FIG. 5 is a front view showing the state of the piezoelectric filter of FIG. 2 after molding, and FIG. 6 is a right side view of FIG. 5. In the symbols used in the drawings, 11 is the ceramic substrate, 17 is the first lead terminal, and 18 is the ceramic substrate.
is the second lead terminal, 19 is the third lead terminal,
22, 23, and 24 are protrusions, and 25 is a synthetic resin insulation coating.

Claims (1)

[Claims for Utility Model Registration] A ceramic substrate 11 having a rectangular main surface;
electronic circuit element forming electrodes 12 and 13 provided on the main surface of the substrate 11; a first connection electrode 15 provided near one end surface of the substrate 11; a second connection electrode 16 provided near the other end face opposite to the end face, one end of which is fixed to the first connection electrode 15 and the other end an extension of the main surface of the substrate 11; a first lead terminal 17 that is led out along a plane and has a protrusion 22 extending parallel to an end surface between the one end surface and the other end surface of the substrate 11; It is fixed to the second connection electrode 16, the other end is led out along the extension plane of the main surface of the substrate 11, and extends parallel to the end surface between the one end surface and the other end surface. Projection part 2
3 and is arranged substantially opposite to the first lead terminal 17; and the one end of the first and second lead terminals 17, 18 surrounding the substrate 11; and the protrusion parts 22 and 23, respectively, and the protrusion part 2
2 and 23 and an insulator coating 25 provided to fill the space between the substrate 1 and the substrate 1.