JPS6255341U - - Google Patents

Info

Publication number
JPS6255341U
JPS6255341U JP1985147607U JP14760785U JPS6255341U JP S6255341 U JPS6255341 U JP S6255341U JP 1985147607 U JP1985147607 U JP 1985147607U JP 14760785 U JP14760785 U JP 14760785U JP S6255341 U JPS6255341 U JP S6255341U
Authority
JP
Japan
Prior art keywords
hot plate
photoresist
coated
semiconductor substrate
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985147607U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985147607U priority Critical patent/JPS6255341U/ja
Publication of JPS6255341U publication Critical patent/JPS6255341U/ja
Pending legal-status Critical Current

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  • Coating Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は、本考案のホツトプレート部の説明図
である。 １……均熱プレート、２……加熱ヒーター、３
……半導体ウエーハ、４……冷却パイプ、５……
冷却水供給口、６……冷却水排水口。 第２図は、塗布機におけるオーブン部の概略構
造図である。 ７……均熱プレート、８……半導体ウエーハ、
９……搬送ベルト、１０……搬送用モーター、１
１……保温カバー。 第３図は、降温特性曲線を示し、ａは自然放熱
、ｂは強制冷却時でありそれぞれの所要時間がｔ
１，ｔ２である。第４図は、温度変更時のモデル
例であり、傾斜はそれぞれ昇降温速度を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ウコーハ上にフオトレジストを塗布され
    た後に、高温焼き締めを行うホツトプレートオー
    ブンにおいて、冷却機構を設けたことを特徴とす
    る塗布装置。
JP1985147607U 1985-09-26 1985-09-26 Pending JPS6255341U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985147607U JPS6255341U (ja) 1985-09-26 1985-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985147607U JPS6255341U (ja) 1985-09-26 1985-09-26

Publications (1)

Publication Number Publication Date
JPS6255341U true JPS6255341U (ja) 1987-04-06

Family

ID=31061121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985147607U Pending JPS6255341U (ja) 1985-09-26 1985-09-26

Country Status (1)

Country Link
JP (1) JPS6255341U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01168026A (ja) * 1987-12-23 1989-07-03 Teru Kyushu Kk ベーキング装置
JPH07161632A (ja) * 1993-07-16 1995-06-23 Semiconductor Syst Inc 基板コーティング／現像システム用熱処理モジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01168026A (ja) * 1987-12-23 1989-07-03 Teru Kyushu Kk ベーキング装置
JPH07161632A (ja) * 1993-07-16 1995-06-23 Semiconductor Syst Inc 基板コーティング／現像システム用熱処理モジュール

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