JPS625640U - - Google Patents

Info

Publication number
JPS625640U
JPS625640U JP1985098151U JP9815185U JPS625640U JP S625640 U JPS625640 U JP S625640U JP 1985098151 U JP1985098151 U JP 1985098151U JP 9815185 U JP9815185 U JP 9815185U JP S625640 U JPS625640 U JP S625640U
Authority
JP
Japan
Prior art keywords
opening
thin film
film conductor
wire
connection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985098151U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985098151U priority Critical patent/JPS625640U/ja
Publication of JPS625640U publication Critical patent/JPS625640U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07552—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/527—Multiple bond wires having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例に係る薄膜導体の
接続構造を示す平面図、第２図はこの考案の変形
例を示す平面図、第３図はサーマルプリンテイン
グヘツドを示す斜視図、第４図は従来の薄膜導体
の接続構造を示す平面図、第５図は第４図のＡ―
Ａ′線に沿つて切断し矢印方向に見た断面図、第
６図はキヤピラリーを拡大して示す断面図である
。 ３……個別リード電極（薄膜導体）、５……ワ
イヤボンデイングランド、８ａ……ボンデイング
ワイヤ、１３……開口部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) アルミニウムあるいはアルミニウムを主成
    分とする合金からなり、端部にワイヤボンデイン
    グランドを有する薄膜導体の上記ワイヤボンデイ
    ングランドに、ボンデイングワイヤをボンデイン
    グにより接続する薄膜導体の接続構造において、 上記ワイヤボンデイングランドに開口部を形成
    し、この開口部に先端が接するように上記ボンデ
    イングワイヤを接続することを特徴とする薄膜導
    体の接続構造。 (2) 上記開口部は四角形開口部である実用新案
    登録請求の範囲第(1)項記載の薄膜導体の接続構
    造。 (3) 上記開口部は切欠き状開口部である実用新
    案登録請求の範囲第(1)項記載の薄膜導体の接続
    構造。
JP1985098151U 1985-06-27 1985-06-27 Pending JPS625640U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985098151U JPS625640U (ja) 1985-06-27 1985-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985098151U JPS625640U (ja) 1985-06-27 1985-06-27

Publications (1)

Publication Number Publication Date
JPS625640U true JPS625640U (ja) 1987-01-14

Family

ID=30965823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985098151U Pending JPS625640U (ja) 1985-06-27 1985-06-27

Country Status (1)

Country Link
JP (1) JPS625640U (ja)

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