JPS625642U - - Google Patents

Info

Publication number
JPS625642U
JPS625642U JP1985097928U JP9792885U JPS625642U JP S625642 U JPS625642 U JP S625642U JP 1985097928 U JP1985097928 U JP 1985097928U JP 9792885 U JP9792885 U JP 9792885U JP S625642 U JPS625642 U JP S625642U
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor package
edge
back surface
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985097928U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985097928U priority Critical patent/JPS625642U/ja
Publication of JPS625642U publication Critical patent/JPS625642U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の半導体デバイスの底面図、
第２図は同じく要部を示す部分断面図、第３図ａ
，ｂは半導体デバイスの底面図および要部部分断
面図である。 １０……半導体デバイス、１２……半導体パツ
ケージ、１４……リードピン、１６……凹部。
補正 昭６０．７．２４ 実用新案登録請求の範囲を次のように補正する
。
【実用新案登録請求の範囲】 半導体パツケージから延出するリードピンを該
半導体パツケージの裏面内方向に折曲した半導体
デバイスにおいて、 前記半導体パツケージ裏面の縁部を平らに形成
するとともに、この縁部にリードピンの先端部分
を各別に入れる凹部を形成したことを特徴とする
半導体デバイス。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体パツケージから延出するリードピンを外
    半導体パツケージの裏面内方向に折曲した半導体
    デバイスにおいて、 前記半導体パツケージ裏面の縁部を平らに形成
    するとともに、この縁部にリードピンの先端部分
    を各別に入れる凹部を形成したことを特徴とする
    半導体デバイス。
JP1985097928U 1985-06-27 1985-06-27 Pending JPS625642U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985097928U JPS625642U (ja) 1985-06-27 1985-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985097928U JPS625642U (ja) 1985-06-27 1985-06-27

Publications (1)

Publication Number Publication Date
JPS625642U true JPS625642U (ja) 1987-01-14

Family

ID=30965385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985097928U Pending JPS625642U (ja) 1985-06-27 1985-06-27

Country Status (1)

Country Link
JP (1) JPS625642U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634535A (ja) * 1992-07-14 1994-02-08 Hiroo Tarumi 結露測定方法および結露計

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169948A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 樹脂封止型半導体装置
JPS6053066A (ja) * 1983-09-02 1985-03-26 Hitachi Ltd 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169948A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 樹脂封止型半導体装置
JPS6053066A (ja) * 1983-09-02 1985-03-26 Hitachi Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634535A (ja) * 1992-07-14 1994-02-08 Hiroo Tarumi 結露測定方法および結露計

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