JPS6259414B2 - - Google Patents

Info

Publication number: JPS6259414B2
Authority: JP; Japan
Prior art keywords: metal; layer; conductive layer; adhesion; parallel plate
Prior art date: 1983-07-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP12182383A

Other languages

English (en)

Japanese (ja)

Other versions

JPS6014787A (ja

Inventor

Masayuki Terakado

Takeshi Nagai

Nobuyuki Hirai

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Panasonic Holdings Corp

Original Assignee

Matsushita Electric Industrial Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-07-04

Filing date

1983-07-04

Publication date

1987-12-10

1983-07-04 Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd

1983-07-04 Priority to JP58121823A priority Critical patent/JPS6014787A/ja

1985-01-25 Publication of JPS6014787A publication Critical patent/JPS6014787A/ja

1987-12-10 Publication of JPS6259414B2 publication Critical patent/JPS6259414B2/ja

Status Granted legal-status Critical Current

Links

239000002184 metal Substances 0.000 claims description 28
229910052751 metal Inorganic materials 0.000 claims description 28
239000000843 powder Substances 0.000 claims description 4
150000002739 metals Chemical class 0.000 claims description 3
229920000642 polymer Polymers 0.000 claims description 2
239000000203 mixture Substances 0.000 claims 1
239000004698 Polyethylene Substances 0.000 description 5
-1 polyethylene Polymers 0.000 description 5
229920000573 polyethylene Polymers 0.000 description 5
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
239000011889 copper foil Substances 0.000 description 4
239000000463 material Substances 0.000 description 4
239000000853 adhesive Substances 0.000 description 3
230000001070 adhesive effect Effects 0.000 description 3
238000005452 bending Methods 0.000 description 3
239000006229 carbon black Substances 0.000 description 3
230000000694 effects Effects 0.000 description 2
239000005038 ethylene vinyl acetate Substances 0.000 description 2
239000011888 foil Substances 0.000 description 2
238000000034 method Methods 0.000 description 2
229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
229920005989 resin Polymers 0.000 description 2
239000011347 resin Substances 0.000 description 2
229920000181 Ethylene propylene rubber Polymers 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
239000004020 conductor Substances 0.000 description 1
239000013078 crystal Substances 0.000 description 1
230000007423 decrease Effects 0.000 description 1
238000011161 development Methods 0.000 description 1
230000018109 developmental process Effects 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
238000000605 extraction Methods 0.000 description 1
230000020169 heat generation Effects 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
230000007935 neutral effect Effects 0.000 description 1
239000011368 organic material Substances 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
230000037303 wrinkles Effects 0.000 description 1

Landscapes

Surface Heating Bodies (AREA)

JP58121823A 1983-07-04 1983-07-04 ヒ−タ Granted JPS6014787A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP58121823A JPS6014787A (ja)	1983-07-04	1983-07-04	ヒ−タ

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP58121823A JPS6014787A (ja)	1983-07-04	1983-07-04	ヒ−タ

Publications (2)

Publication Number	Publication Date
JPS6014787A JPS6014787A (ja)	1985-01-25
JPS6259414B2 true JPS6259414B2 (de)	1987-12-10

Family

ID=14820811

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP58121823A Granted JPS6014787A (ja)	1983-07-04	1983-07-04	ヒ−タ

Country Status (1)

Country	Link
JP (1)	JPS6014787A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4904371A (en) *	1988-10-13	1990-02-27	Conoco Inc.	Process for the production of mesophase pitch
JP2006261095A (ja) *	2005-02-15	2006-09-28	Ngk Insulators Ltd	面状ヒータ装置
JP6347651B2 (ja) *	2014-04-10	2018-06-27	日本電産サンキョー株式会社	ダンパ装置およびヒータ

1983
- 1983-07-04 JP JP58121823A patent/JPS6014787A/ja active Granted

Also Published As

Publication number	Publication date
JPS6014787A (ja)	1985-01-25

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