JPS6260073U - - Google Patents
Info
- Publication number
- JPS6260073U JPS6260073U JP15002285U JP15002285U JPS6260073U JP S6260073 U JPS6260073 U JP S6260073U JP 15002285 U JP15002285 U JP 15002285U JP 15002285 U JP15002285 U JP 15002285U JP S6260073 U JPS6260073 U JP S6260073U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- flow
- reflow soldering
- reflow
- flow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001012 protector Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 6
- 230000000630 rising effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図、第２図は本考案方法の斜視図、第３図
、第４図は従来方法の斜視図。
１：ＩＣのパツケージ、２：ＩＣの端子、３：
プリント基板、４：従来方法のマスキング樹脂や
テープ、５，６：ＩＣフロープロテクタ、７：脱
落防止構造。
1 and 2 are perspective views of the method of the present invention, and FIGS. 3 and 4 are perspective views of the conventional method. 1: IC package, 2: IC terminal, 3:
Printed circuit board, 4: Conventional masking resin or tape, 5, 6: IC flow protector, 7: Fall-off prevention structure.
Claims (1)
ーはんだ付け、フローはんだ付け等による実装方
法を単用、又は混用してプリント基板等に実装す
る場合に、リフローはんだ付けによる輻射熱と、
フローはんだ付けによる、はんだ温度から、ＩＣ
の内部温度上昇を防止し、またリフローはんだ付
けにより実装したＩＣをさらにフローはんだ槽を
通すことを可能にする等を図るためＩＣのパツケ
ージ表面の一部、または全体をカバーできる構造
を具備させたことを特徴とするＩＣフロープロテ
クター。 When mounting a semiconductor integrated circuit (hereinafter referred to as IC) on a printed circuit board, etc. by using reflow soldering, flow soldering, etc. alone or in combination, radiant heat due to reflow soldering,
IC from the solder temperature by flow soldering
In order to prevent the internal temperature from rising, and also to allow the IC mounted by reflow soldering to pass through the flow soldering bath, the IC is equipped with a structure that can cover part or the entire surface of the IC package. An IC flow protector characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15002285U JPS6260073U (en) | 1985-10-02 | 1985-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15002285U JPS6260073U (en) | 1985-10-02 | 1985-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6260073U true JPS6260073U (en) | 1987-04-14 |
Family
ID=31065773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15002285U Pending JPS6260073U (en) | 1985-10-02 | 1985-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6260073U (en) |
-
1985
- 1985-10-02 JP JP15002285U patent/JPS6260073U/ja active Pending
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