JPS6263692A - 表面処理液中の４価の錫イオンの除去方法 - Google Patents

表面処理液中の４価の錫イオンの除去方法

Info

Publication number
JPS6263692A
JPS6263692A JP28900385A JP28900385A JPS6263692A JP S6263692 A JPS6263692 A JP S6263692A JP 28900385 A JP28900385 A JP 28900385A JP 28900385 A JP28900385 A JP 28900385A JP S6263692 A JPS6263692 A JP S6263692A
Authority
JP
Japan
Prior art keywords
electrode
soluble metal
solution
plating
reducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28900385A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0576555B2 (de
Inventor
Hiroki Uchida
廣記 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura & Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura & Co Ltd filed Critical Uemera Kogyo Co Ltd
Publication of JPS6263692A publication Critical patent/JPS6263692A/ja
Publication of JPH0576555B2 publication Critical patent/JPH0576555B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Chemically Coating (AREA)
  • Manufacture And Refinement Of Metals (AREA)
JP28900385A 1985-05-10 1985-12-20 表面処理液中の４価の錫イオンの除去方法 Granted JPS6263692A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-99374 1985-05-10
JP9937485 1985-05-10

Publications (2)

Publication Number Publication Date
JPS6263692A true JPS6263692A (ja) 1987-03-20
JPH0576555B2 JPH0576555B2 (de) 1993-10-22

Family

ID=14245756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28900385A Granted JPS6263692A (ja) 1985-05-10 1985-12-20 表面処理液中の４価の錫イオンの除去方法

Country Status (1)

Country Link
JP (1) JPS6263692A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002129359A (ja) * 2000-10-26 2002-05-09 Mec Kk 金属スズまたはスズ合金をエッチングする方法ならびに金属スズまたはスズ合金のエッチング液
JP2004190042A (ja) * 2002-03-05 2004-07-08 Daiwa Fine Chemicals Co Ltd (Laboratory) 無電解めっきの触媒付与のための前処理液、該液を使用する前処理方法、該方法を使用して製造した無電解めっき皮膜及び（又は）めっき被覆体
CN116288292A (zh) * 2023-03-20 2023-06-23 聂柱根 一种化学锡药水锡还原再生除铜装置
WO2024117086A1 (ja) * 2022-11-28 2024-06-06 株式会社村田製作所 めっき方法および電子部品の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002129359A (ja) * 2000-10-26 2002-05-09 Mec Kk 金属スズまたはスズ合金をエッチングする方法ならびに金属スズまたはスズ合金のエッチング液
JP2004190042A (ja) * 2002-03-05 2004-07-08 Daiwa Fine Chemicals Co Ltd (Laboratory) 無電解めっきの触媒付与のための前処理液、該液を使用する前処理方法、該方法を使用して製造した無電解めっき皮膜及び（又は）めっき被覆体
WO2024117086A1 (ja) * 2022-11-28 2024-06-06 株式会社村田製作所 めっき方法および電子部品の製造方法
JPWO2024117086A1 (de) * 2022-11-28 2024-06-06
JPWO2024116456A1 (de) * 2022-11-28 2024-06-06
WO2024116456A1 (ja) * 2022-11-28 2024-06-06 株式会社村田製作所 めっき組成物の再生方法および再生装置
CN116288292A (zh) * 2023-03-20 2023-06-23 聂柱根 一种化学锡药水锡还原再生除铜装置

Also Published As

Publication number Publication date
JPH0576555B2 (de) 1993-10-22

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