JPS6265835U - - Google Patents
Info
- Publication number
- JPS6265835U JPS6265835U JP1985157530U JP15753085U JPS6265835U JP S6265835 U JPS6265835 U JP S6265835U JP 1985157530 U JP1985157530 U JP 1985157530U JP 15753085 U JP15753085 U JP 15753085U JP S6265835 U JPS6265835 U JP S6265835U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- substrate
- locations
- flip
- secure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/241—Dispositions, e.g. layouts
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案の一実施例の平面図、第２図
は、同上の工程説明図、第３図ａ〜ｅは、それぞ
れ従来例の工程説明図、第４図は、同上の平面図
である。 １…基板、２…ボンデイングパターン、３，３
ａ，３ｂ，３ｃ…ＬＳＩ、４，４ａ，４ｂ，４ｃ
…バンプ部、５…残留物、２１…ボンデイング部
。
は、同上の工程説明図、第３図ａ〜ｅは、それぞ
れ従来例の工程説明図、第４図は、同上の平面図
である。 １…基板、２…ボンデイングパターン、３，３
ａ，３ｂ，３ｃ…ＬＳＩ、４，４ａ，４ｂ，４ｃ
…バンプ部、５…残留物、２１…ボンデイング部
。
Claims (1)
- 基板上に形成される各ボンデイングパターンを
それぞれ複数のボンデイング箇所を確保できる面
積を有するものとし、これらの各ボンデイング部
をすべて同一方向に向けて揃えて形成してなるフ
リツプチツプＬＳＩボンデイング用基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985157530U JPS6265835U (ja) | 1985-10-14 | 1985-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985157530U JPS6265835U (ja) | 1985-10-14 | 1985-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6265835U true JPS6265835U (ja) | 1987-04-23 |
Family
ID=31080163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985157530U Pending JPS6265835U (ja) | 1985-10-14 | 1985-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6265835U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010611A (ja) * | 2008-06-30 | 2010-01-14 | Toshiba Corp | プリント回路板及び電子機器 |
-
1985
- 1985-10-14 JP JP1985157530U patent/JPS6265835U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010010611A (ja) * | 2008-06-30 | 2010-01-14 | Toshiba Corp | プリント回路板及び電子機器 |