JPS6270435U - - Google Patents

Info

Publication number
JPS6270435U
JPS6270435U JP1985161688U JP16168885U JPS6270435U JP S6270435 U JPS6270435 U JP S6270435U JP 1985161688 U JP1985161688 U JP 1985161688U JP 16168885 U JP16168885 U JP 16168885U JP S6270435 U JPS6270435 U JP S6270435U
Authority
JP
Japan
Prior art keywords
wire
tip
capillary
laser light
reflect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985161688U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985161688U priority Critical patent/JPS6270435U/ja
Publication of JPS6270435U publication Critical patent/JPS6270435U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るワイヤボンデイング装置
の一実施例を示す概略構成図、第２図はワイヤ先
端部へのレーザ光の照射状態を示す概略正面図、
第３図は第２図に対する平面図である。第４図は
電気トーチを利用したワイヤボンデイング装置の
具体例を示す概略構成図、第５図乃至第８図はキ
ヤピラリを使用したワイヤボンデイング要領を説
明するための各工程図、第９図は水素トーチを利
用したワイヤボンデイング装置の具体例を示す概
略構成図である。 ４……ワイヤ、４ａ……先端部、５……キヤピ
ラリ、７……ワイヤ供給部、１０……発光部、１
３……可動ミラー、１４……受光部、Ｃ……ワイ
ヤボンデイング装置、Ｌ……レーザ光。

Claims (1)

  1. 【実用新案登録請求の範囲】 ワイヤ供給部から送出されたワイヤをキヤピラ
    リに挿通し、該キヤピラリ先端から導出されたワ
    イヤ先端部を、溶融させてボール状に成形する装
    置において、 上記ワイヤ先端部の両側方に、発光部から発せ
    られるレーザ光をワイヤ先端部に向けて反射する
    角度調整可能な可動ミラーと、該可動ミラーから
    ワイヤ先端部に照射されて通過したレーザ光を検
    出する受光部とを対設したことを特徴とするワイ
    ヤボンデイング装置。
JP1985161688U 1985-10-21 1985-10-21 Pending JPS6270435U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985161688U JPS6270435U (ja) 1985-10-21 1985-10-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985161688U JPS6270435U (ja) 1985-10-21 1985-10-21

Publications (1)

Publication Number Publication Date
JPS6270435U true JPS6270435U (ja) 1987-05-02

Family

ID=31088234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985161688U Pending JPS6270435U (ja) 1985-10-21 1985-10-21

Country Status (1)

Country Link
JP (1) JPS6270435U (ja)

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