JPS6270445U - - Google Patents
Info
- Publication number
- JPS6270445U JPS6270445U JP1985162182U JP16218285U JPS6270445U JP S6270445 U JPS6270445 U JP S6270445U JP 1985162182 U JP1985162182 U JP 1985162182U JP 16218285 U JP16218285 U JP 16218285U JP S6270445 U JPS6270445 U JP S6270445U
- Authority
- JP
- Japan
- Prior art keywords
- back surface
- external lead
- lead terminals
- board
- extended
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来例の断面図である。 １，１′……配線基板、２……金属パターン（
裏面）、３，３′……外部リード端子、４……半
田、５……ペレツトコート樹脂、６……ＩＣペレ
ツト、７……端子、８，８′……基板裏面取付部
分。
従来例の断面図である。 １，１′……配線基板、２……金属パターン（
裏面）、３，３′……外部リード端子、４……半
田、５……ペレツトコート樹脂、６……ＩＣペレ
ツト、７……端子、８，８′……基板裏面取付部
分。
Claims (1)
- 配線基板裏面に、外部リード端子にそれぞれ対
応した分離領域を有する金属パターンを設け、前
記外部リード端子の基板裏面取付部分を延長して
、前記金属パターンにそれぞれ連結していること
を特徴とする混成集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985162182U JPS6270445U (ja) | 1985-10-22 | 1985-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985162182U JPS6270445U (ja) | 1985-10-22 | 1985-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6270445U true JPS6270445U (ja) | 1987-05-02 |
Family
ID=31089201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985162182U Pending JPS6270445U (ja) | 1985-10-22 | 1985-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6270445U (ja) |
-
1985
- 1985-10-22 JP JP1985162182U patent/JPS6270445U/ja active Pending