JPS6284970U - - Google Patents
Info
- Publication number
- JPS6284970U JPS6284970U JP1985176360U JP17636085U JPS6284970U JP S6284970 U JPS6284970 U JP S6284970U JP 1985176360 U JP1985176360 U JP 1985176360U JP 17636085 U JP17636085 U JP 17636085U JP S6284970 U JPS6284970 U JP S6284970U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- wiring
- wiring conductor
- resin film
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図ａは本考案の一実施例の平面図、第１図
ｂは第１図ａに示す実施例のＡ―Ａ′線断面図、
第２図ａは従来の混成集積回路の一例の平面図、
第２図ｂは第２図ａに示す混成集積回路のＢ―Ｂ
′線断面図である。 １，１′……回路基板、２……半導体チツプ、
３……導体ペースト、４，４′……配線導体、５
……ボンデイングワイヤ、６……樹脂膜、７……
チツプ部品、８……外部端子、９……はんだ、１
０……配線導体、１１……絶縁ガラス。
ｂは第１図ａに示す実施例のＡ―Ａ′線断面図、
第２図ａは従来の混成集積回路の一例の平面図、
第２図ｂは第２図ａに示す混成集積回路のＢ―Ｂ
′線断面図である。 １，１′……回路基板、２……半導体チツプ、
３……導体ペースト、４，４′……配線導体、５
……ボンデイングワイヤ、６……樹脂膜、７……
チツプ部品、８……外部端子、９……はんだ、１
０……配線導体、１１……絶縁ガラス。
Claims (1)
- 回路基板に塔載された半導体チツプと、該半導
体チツプの配線用パツドに接続される前記回路基
板に設けられた配線導体と、前記半導体チツプ及
び配線導体を覆つて形成される樹脂膜とを備える
混成集積回路において、前記樹脂膜に覆われた前
記配線導体の少くとも１部を多層配線としたこと
を特徴とする混成集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985176360U JPS6284970U (ja) | 1985-11-15 | 1985-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985176360U JPS6284970U (ja) | 1985-11-15 | 1985-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284970U true JPS6284970U (ja) | 1987-05-30 |
Family
ID=31116530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985176360U Pending JPS6284970U (ja) | 1985-11-15 | 1985-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284970U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01119047A (ja) * | 1987-10-30 | 1989-05-11 | Nec Corp | 集積回路装置 |
-
1985
- 1985-11-15 JP JP1985176360U patent/JPS6284970U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01119047A (ja) * | 1987-10-30 | 1989-05-11 | Nec Corp | 集積回路装置 |