JPS6274366U - - Google Patents
Info
- Publication number
- JPS6274366U JPS6274366U JP16723085U JP16723085U JPS6274366U JP S6274366 U JPS6274366 U JP S6274366U JP 16723085 U JP16723085 U JP 16723085U JP 16723085 U JP16723085 U JP 16723085U JP S6274366 U JPS6274366 U JP S6274366U
- Authority
- JP
- Japan
- Prior art keywords
- conductors
- ceramic sheets
- sheets
- ceramic
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 11
- 239000011229 interlayer Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 229910000510 noble metal Inorganic materials 0.000 claims 2
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図は、この考案の実施例を示すセラミツク
多層配線基板の縦断面概念図、第２図は、セラミ
ツク多層配線基板の従来例を示す縦断面概念図で
ある。
１１ａ……中間層のセラミツクシート、１１ｂ
……最外層のセラミツクシート、１２……層間導
体、１４……外部導体、１６ａ……中間層のスル
ーホール導体、１６ｂ……最外層のスルーホール
導体。
FIG. 1 is a conceptual vertical cross-sectional view of a ceramic multilayer wiring board showing an embodiment of this invention, and FIG. 2 is a conceptual vertical cross-sectional view showing a conventional example of a ceramic multilayer wiring board. 11a... intermediate layer ceramic sheet, 11b
. . . Outermost layer ceramic sheet, 12 . . . Interlayer conductor, 14 . . . Outer conductor, 16a .
Claims (1)
が、多層に積層されたセラミツク多層配線基板に
おいて、セラミツクシート１１ａ，１１ａ……，
１１ｂ，１１ｂ間の層間導体１２，１２……及び
中間層のセラミツクシート１１ａ，１１ａ……の
スルーホール導体１６ａ，１６ａ……がＣｕ系導
体で形成され、少なくとも最外層のセラミツクシ
ート１１ｂ，１１ｂのスルーホール導体１６ｂ，
１６ｂ……がＮｉ系導体で形成され、最外層のセ
ラミツクシート１１ｂ，１１ｂの表面に設けられ
た外部導体１４，１４……が貴金属系導体で形成
され、同シート１１ｂ，１１ｂのスルーホール導
体１６ｂ，１６ｂ……が上記外部導体１４，１４
……で覆われていることを特徴とするセラミツク
多層配線基板。 In a ceramic multilayer wiring board in which ceramic sheets on which conductors, resistors, etc. are printed are laminated in multiple layers, ceramic sheets 11a, 11a...,
The interlayer conductors 12, 12... between the interlayer conductors 11b, 11b, and the through-hole conductors 16a, 16a... of the intermediate layer ceramic sheets 11a, 11a... are formed of Cu-based conductors, and at least the outermost ceramic sheets 11b, 11b are made of Cu-based conductors. Through-hole conductor 16b,
16b... are formed of a Ni-based conductor, the outer conductors 14, 14... provided on the surfaces of the outermost ceramic sheets 11b, 11b are formed of a noble metal-based conductor, and the through-hole conductors 16b of the same sheets 11b, 11b are formed of a noble metal-based conductor. , 16b... are the outer conductors 14, 14
A ceramic multilayer wiring board characterized by being covered with...
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16723085U JPH0231798Y2 (en) | 1985-10-30 | 1985-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16723085U JPH0231798Y2 (en) | 1985-10-30 | 1985-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6274366U true JPS6274366U (en) | 1987-05-13 |
| JPH0231798Y2 JPH0231798Y2 (en) | 1990-08-28 |
Family
ID=31098967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16723085U Expired JPH0231798Y2 (en) | 1985-10-30 | 1985-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231798Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021061335A (en) * | 2019-10-08 | 2021-04-15 | Tdk株式会社 | Multilayer electronic component and manufacturing method thereof |
-
1985
- 1985-10-30 JP JP16723085U patent/JPH0231798Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021061335A (en) * | 2019-10-08 | 2021-04-15 | Tdk株式会社 | Multilayer electronic component and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231798Y2 (en) | 1990-08-28 |