JPS627697B2 - - Google Patents
Info
- Publication number
- JPS627697B2 JPS627697B2 JP55164997A JP16499780A JPS627697B2 JP S627697 B2 JPS627697 B2 JP S627697B2 JP 55164997 A JP55164997 A JP 55164997A JP 16499780 A JP16499780 A JP 16499780A JP S627697 B2 JPS627697 B2 JP S627697B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- vertical
- frame
- positioning
- heat column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16499780A JPS5788743A (en) | 1980-11-21 | 1980-11-21 | Positioning device for vertical-type lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16499780A JPS5788743A (en) | 1980-11-21 | 1980-11-21 | Positioning device for vertical-type lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5788743A JPS5788743A (en) | 1982-06-02 |
| JPS627697B2 true JPS627697B2 (mo) | 1987-02-18 |
Family
ID=15803875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16499780A Granted JPS5788743A (en) | 1980-11-21 | 1980-11-21 | Positioning device for vertical-type lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5788743A (mo) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4628530B2 (ja) * | 2000-08-25 | 2011-02-09 | 株式会社ライト製作所 | 搬送容器の蓋着脱装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5596647A (en) * | 1979-01-18 | 1980-07-23 | Toshiba Corp | Apparatus for positioning lead frame |
| JPS55102250A (en) * | 1979-01-30 | 1980-08-05 | Matsushita Electronics Corp | Method of aligning position of lead frame |
| JPS5933978B2 (ja) * | 1979-07-30 | 1984-08-20 | 株式会社日立製作所 | ボンディング方法 |
-
1980
- 1980-11-21 JP JP16499780A patent/JPS5788743A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5788743A (en) | 1982-06-02 |
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