JPS6281797A - electronic equipment - Google Patents
electronic equipmentInfo
- Publication number
- JPS6281797A JPS6281797A JP22183485A JP22183485A JPS6281797A JP S6281797 A JPS6281797 A JP S6281797A JP 22183485 A JP22183485 A JP 22183485A JP 22183485 A JP22183485 A JP 22183485A JP S6281797 A JPS6281797 A JP S6281797A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- electronic
- electronic component
- electronic device
- chip capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電子装置、特に配線基板に外力が加わっても配
線基板に実装された電子部品の損傷が起き難い構造の電
子装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electronic device, and particularly to an electronic device having a structure in which electronic components mounted on a wiring board are unlikely to be damaged even if an external force is applied to the wiring board.
電子機器は、機能面から高密度実装化が、実装面から軽
量化、小型化、薄型化が要請されている。Electronic devices are required to be more densely packaged from a functional standpoint, and to be lighter, smaller, and thinner from a packaging standpoint.
このため、電子機器に組み込まれる電子部品の多くは、
面実装が可能な構造に移行してきている。For this reason, many of the electronic components incorporated into electronic devices are
There is a shift towards structures that allow surface mounting.
また、多くの電子部品は同一の配線基板（マザー基板）
に実装され、このマザー基板の各種機器への取り付けに
よって各種機器への組み込みが成されるようになってい
る。Also, many electronic components are on the same wiring board (mother board).
The motherboard is mounted on the motherboard and can be integrated into various devices by attaching it to the device.
ところで、配線基板の主面に実装される電子部品は、た
とえば、工業調査会発行「電子材料」１９８５年２月号
、昭和６０年２月１日発行、Ｐ３９〜Ｐ４３にも記載さ
れているように、電子部品はその長手方向を配線基板の
長手方向に沿うようにして実装されることが多い。By the way, electronic components mounted on the main surface of a wiring board are described in, for example, the February 1985 issue of "Electronic Materials" published by Kogyo Kenkyukai, February 1, 1985, pages 39 to 43. In addition, electronic components are often mounted with their longitudinal direction along the longitudinal direction of the wiring board.
しかし、このような実装形態は、配線基板に外力が加わ
って、配線基板が反り返ったりした場合、電子部品の本
体、換言すれば、パッケージ部分くたとえば、チップ型
コンデンサーの本体部分等）にクランク等が入り、電子
装置の信頼性が低くなることが本発明者によってあきら
かとされた。すなわち、電子部品の各電極部分はハンダ
等の接合体で配線基板に固定され、たとえば、接合部を
形成するが、この２つの接合部は電子部品の長手の両端
側に設けられることが多い。この結果、一つの電子部品
の各接合部は配線基板の長手方向に沿って並ぶような配
置になる。一方、配線基板に外力が加わると、配線基板
は短い幅員側ではなく、その長手側で反り返りが起き易
くなる。特に、配線基板の反りは厚さ１ｍｍ以下の配線
基板において発生しやすい。このため、配線基板が反る
と、単一の電子部品の２つの接合部はそれぞれ配線基板
の長手方向に沿って離れた位置にあることから、各接合
部が強固に接着していると、電子部品の電極と電極間の
本体（パンケージ）部分に応力が働き、電子部品本体に
クラックが発生することになる。However, in such a mounting form, if an external force is applied to the wiring board and the wiring board warps, the main body of the electronic component (in other words, the package part, for example, the main body part of a chip capacitor, etc.) may be damaged by a crank, etc. The inventor has found that the reliability of electronic devices decreases due to That is, each electrode portion of an electronic component is fixed to a wiring board with a bonding material such as solder to form, for example, a joint, and these two joints are often provided at both longitudinal ends of the electronic component. As a result, the respective joint portions of one electronic component are arranged so as to be lined up along the longitudinal direction of the wiring board. On the other hand, when an external force is applied to the wiring board, the wiring board tends to warp not on the short width side but on its long side. In particular, warping of wiring boards is likely to occur in wiring boards with a thickness of 1 mm or less. For this reason, when the wiring board warps, the two joints of a single electronic component are located at separate positions along the length of the wiring board, so if each joint is firmly adhered, Stress acts on the body (pancage) of the electronic component between the electrodes, causing cracks to occur in the electronic component body.
本発明の目的は配線基板に外力が加わっても配線基板の
主面に実装された電子部品が損傷し難い構造の電子装置
を提供することにある。An object of the present invention is to provide an electronic device having a structure in which electronic components mounted on the main surface of a wiring board are not easily damaged even if an external force is applied to the wiring board.
本発明の他の目的は信頬性の高い電子装置を提供するこ
とにある。Another object of the present invention is to provide an electronic device with high reliability.
本発明の前記ならびにそのほかの目的と新規な特徴は、
本明細書の記述および添付図面からあきらかになるであ
ろう。The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.
本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、下記のとおりである。A brief overview of typical inventions disclosed in this application is as follows.
すなわち、本発明によれば、配線基板の主面に実装され
る電子部品は、単一の電子部品の一方向における接合域
、すなわち、単一の接合部の長さく接合域）あるいは電
極と電極およびこれら電極間を加えた長さく接合域）の
長い方の部分が、配線基板の長手方向に直交する方向に
沿うように実装されているため、配線基板に外力が加わ
って反っても、その反り返りと直交する方向に沿って電
子部品の長い側の接合域が存在していることから、電子
部品の本体には大きな応力が加わらず、電子部品の損傷
が防止できる。That is, according to the present invention, the electronic component mounted on the main surface of the wiring board has a bonding area in one direction of a single electronic component (i.e., a long bonding area of a single bonding part) or an electrode and an electrode. Since the longer part of the bonding area (including the length between these electrodes) is mounted along the direction perpendicular to the longitudinal direction of the wiring board, even if an external force is applied to the wiring board and it warps, it will not bend. Since the bonding region on the long side of the electronic component exists along the direction perpendicular to the warpage, no large stress is applied to the main body of the electronic component, and damage to the electronic component can be prevented.
第１図は本発明の一実施例による電子装置の平面図、第
２図は同じく正面図、第３図は同じく配線基板が反った
状態の電子装置の正面図である。FIG. 1 is a plan view of an electronic device according to an embodiment of the present invention, FIG. 2 is a front view of the electronic device, and FIG. 3 is a front view of the electronic device with a warped wiring board.
この実施例では、第１図、第２図に示されるように、ガ
ラスエポキシ樹脂製の配線基板１の主面に電子部品とし
て、たとえば、チップコンデンサー２が並列に４個実装
された構造の電子装置について説明する。In this embodiment, as shown in FIGS. 1 and 2, an electronic component having a structure in which, for example, four chip capacitors 2 are mounted in parallel on the main surface of a wiring board 1 made of glass epoxy resin is used. The device will be explained.
ガラスエポキシ樹脂製の配線基板１は、たとえば、長さ
Ｐ９が７８ｍｍ程度、幅ＲＰＬが１６ｍｍ程度、厚さが
ｉ、２ｍｍ程度の矩形板となっている。なお、この実施
例では配線基板１の主面に設けられている導体層等は一
部省略しである。チップコンデンサー２は、本体（パッ
ケージ）３と、このパッケージ３の両端に配列された電
極４．４′とからなっている。そして、チップコンデン
サー２は、両端の電極４．４′部分がハンダ５，５′で
矩形状導体層のハンダ付パッド６．６′に固定されるこ
とによって配線基板１仝こ固定されている。また、この
実施例では、単一のチップコンデンサー２を取り付ける
ためのハンダ付パッド６゜６′の配列方向は、配線基板
１の長手方向と直交する幅員方向に沿って設けられてい
る。したがって、単一のチップコンデンサー２における
配線基板Ｉへの接合は、一対のハンダ付パッド６．６′
が利用されて行われている。また、単一のハンダ付パッ
ド６の配線基板の長手方向の長さくパッドの長手方向の
長さ）、すなわち、第１の接合域Ｗに比較して、一対の
ハンダ付パッド６．６′の個々の配線基板の幅員方向の
長さａ （バンドの短手方向の長さ）およびこれら一対
のハンダ付パッド６．６′間の配線基板の幅員方向の長
さｂの和、すなわち、第２の接合域旦は長くなっている
。すなわち、配線基板１は外力が加わった場合、その長
手方向における反りが、配線基板１の幅員方向の反りに
対して小さい。したがって、第３図にも示されるように
、この反りの小さい方向に沿ってチップコンデンサー２
の長い接合域旦を配しておけば、チップコンデンサー２
の本体３に大きな応力は加わらなくなり、本体３にクラ
ックが発生し難くなる。The wiring board 1 made of glass epoxy resin is, for example, a rectangular board with a length P9 of about 78 mm, a width RPL of about 16 mm, and a thickness i of about 2 mm. Note that in this embodiment, some of the conductor layers and the like provided on the main surface of the wiring board 1 are omitted. The chip capacitor 2 consists of a main body (package) 3 and electrodes 4 and 4' arranged at both ends of the package 3. The chip capacitor 2 is fixed to the wiring board 1 by fixing the electrodes 4.4' at both ends to the soldering pads 6.6' of the rectangular conductor layer with solders 5, 5'. Further, in this embodiment, the soldering pads 6° 6' for attaching a single chip capacitor 2 are arranged along the width direction orthogonal to the longitudinal direction of the wiring board 1. Therefore, a single chip capacitor 2 is connected to the wiring board I by a pair of soldering pads 6.6'
is being used and carried out. In addition, compared to the length of the single soldering pad 6 in the longitudinal direction of the wiring board (the length of the single soldering pad 6 in the longitudinal direction of the pad), that is, the length of the pair of soldering pads 6.6' The sum of the length a in the width direction of each wiring board (the length in the width direction of the band) and the length b in the width direction of the wiring board between the pair of soldering pads 6 and 6', that is, the second The junction area of the body is longer. That is, when an external force is applied to the wiring board 1, the warpage in the longitudinal direction is smaller than the warp in the width direction of the wiring board 1. Therefore, as shown in FIG. 3, the chip capacitor 2
If a long junction area is arranged, the chip capacitor 2
No large stress is applied to the main body 3, and cracks are less likely to occur in the main body 3.
なお、実際には、第２図に一点鎖線に示される如くに他
の電子部品、たとえば、半導体メモリ装置Ｍが実装され
る。チップコンデンサー２は半導体メモリＭへ供給され
る電源の電位変動防止として使用される。Note that, in reality, other electronic components, such as a semiconductor memory device M, are mounted as shown by the dashed line in FIG. The chip capacitor 2 is used to prevent fluctuations in the potential of the power supply supplied to the semiconductor memory M.
（１）本発明によれば、配線基板の主面に固定されるチ
ップコンデンサーの長手の接合域は、矩形の配線基板の
長手方向に直交する短い幅員方向に沿って延在している
ため、配線基板に外力が加わって反り返っても、チップ
コンデンサーの本体部分に大きな応力が発生せず、チッ
プコンデンサーの損傷が起こらないという効果が得られ
る。(1) According to the present invention, since the longitudinal bonding area of the chip capacitor fixed to the main surface of the wiring board extends along the short width direction orthogonal to the longitudinal direction of the rectangular wiring board, Even if an external force is applied to the wiring board and it warps, large stress will not be generated in the main body of the chip capacitor, resulting in the effect that the chip capacitor will not be damaged.
（２）上記（１）により、本発明の電子装置は、製造工
程内における配線基板の反り、温度サイクル・熱衝撃試
験における配線基板の反り、ユーザー側取扱時における
配線基板の反り等によっても、チップコンデンサーの本
体にクラックが発生する等の損傷は生じ難くなり、信鎖
度向上が達成できるという効果が得られる。(2) According to (1) above, the electronic device of the present invention can be prevented from warping due to warping of the wiring board during the manufacturing process, warping of the wiring board during temperature cycle/thermal shock tests, warping of the wiring board during handling by the user, etc. Damage such as cracks on the main body of the chip capacitor is less likely to occur, and an effect of improving the degree of reliability can be obtained.
（３）上記（２）により、本発明によれば、電子装置の
製造の歩留り向上が達成できるという効果が得られる。(3) According to the above (2), according to the present invention, it is possible to achieve the effect of improving the yield in manufacturing electronic devices.
（４）上記（１）〜（３）により、本発明によれば信鎖
度の高い電子装置を安価に提供することができるという
相乗効果が得られる。(4) According to the above (1) to (3), according to the present invention, a synergistic effect is obtained in that an electronic device with a high degree of signal chain can be provided at a low cost.
以上本発明者によってなされた発明を実施例に基づき具
体的に説明したが、本発明は上記実施例に限定されるも
のではなく、その要旨を逸脱しない範囲で種々変更可能
であることはいうまでもない、すなわち、前記実施例で
は、配線基板にチップコンデンサーのみを実装した例に
ついて説明したが、チップ型抵抗２メルフ部品。Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. In other words, in the above embodiment, only a chip capacitor was mounted on the wiring board, but there are two chip type resistors.
超小型トランジスタ、ＩＣ等の他の電子部品を実装して
も前記実施例同様な効果が得られる。Even if other electronic components such as ultra-small transistors and ICs are mounted, the same effects as in the above embodiment can be obtained.
以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野であるガラスエポキシ樹脂
からなる配線基板に電子部品を実装した技術に適用した
場合について説明したが、それに限定されるものではな
く、たとえば、セラミック板、プリント板等他の配線基
板に電子部品を実装する技術にも適用することができる
。The above explanation has mainly been about the application of the invention made by the present inventor to the technology in which electronic components are mounted on a wiring board made of glass epoxy resin, which is the background field of application of the invention, but the invention is not limited thereto. Instead, it can also be applied to techniques for mounting electronic components on other wiring boards, such as ceramic boards and printed boards.
本発明は少なくとも矩形板に物品を固定する技術に適用
できる。The present invention can be applied to at least a technique for fixing an article to a rectangular plate.
第１図は本発明の一実施例による電子装置の平面図、
第２図は同じく正面図、
第３図は同じく配線基板が反った状態の電子装置の正面
図である。
１・・・配線基板、２・・・チップコンデンサー、３・
・・本体（パッケージ）、４．４’・・・電極、５．５
′ ・・・ハンダ、６．６′・・・ハンダ付パッド。
第 １ 図
第 ２ 図
第 ３ 図FIG. 1 is a plan view of an electronic device according to an embodiment of the present invention, FIG. 2 is a front view of the electronic device, and FIG. 3 is a front view of the electronic device with a warped wiring board. 1... Wiring board, 2... Chip capacitor, 3...
...Main body (package), 4.4'...Electrode, 5.5
'...Solder, 6.6'...Solder pad. Figure 1 Figure 2 Figure 3
Claims (1)
極部を固定してなる電子装置であって、前記電子部品の
接合体を有する接合部は接合域の長い部分が前記配線基
板の長手方向と直交する方向に沿うように延在している
ことを特徴とする電子装置。1. An electronic device in which each electrode portion of each electronic component is fixed to the main surface of a wiring board via a bonded body, and in the bonded portion having the bonded body of the electronic component, a long part of the bonding area is connected to the wiring. An electronic device characterized by extending along a direction perpendicular to the longitudinal direction of a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22183485A JPS6281797A (en) | 1985-10-07 | 1985-10-07 | electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22183485A JPS6281797A (en) | 1985-10-07 | 1985-10-07 | electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6281797A true JPS6281797A (en) | 1987-04-15 |
Family
ID=16772923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22183485A Pending JPS6281797A (en) | 1985-10-07 | 1985-10-07 | electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6281797A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6429872U (en) * | 1987-08-18 | 1989-02-22 | ||
| WO2015087498A1 (en) * | 2013-12-11 | 2015-06-18 | パナソニック株式会社 | Display device |
-
1985
- 1985-10-07 JP JP22183485A patent/JPS6281797A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6429872U (en) * | 1987-08-18 | 1989-02-22 | ||
| WO2015087498A1 (en) * | 2013-12-11 | 2015-06-18 | パナソニック株式会社 | Display device |
| JPWO2015087498A1 (en) * | 2013-12-11 | 2017-03-16 | 株式会社Ｊｏｌｅｄ | Display device |
| US10159155B2 (en) | 2013-12-11 | 2018-12-18 | Joled Inc. | Display device |
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