JPS6282091A - IC card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to an IC card.

[Technical background of the invention and its problems]

Conventionally, for credit cards and bank cards, the owner code and owner name are displayed in embossed letters, and information such as the owner code and other specific encrypted information are printed on a magnetic stripe. So-called magnetic cards with recorded information have been widely used, but since the recorded information on these magnetic cards can be easily read, there is a risk that a third party other than the owner may read the recorded information on the magnetic card and misuse it. . Therefore, recently, IC cards have been used which have ten chips built into the card body that operate in response to input signals from the outside and output pre-installed identification information.

In conventional IC cards, the IC chip stored inside is only covered by the upper and lower exterior fillers, so the IC chip is easily damaged when pressed with a ballpoint pen or the like.

Therefore, various structures for protecting IC chips have been studied. However, if the IC chip is simply protected, there is a problem in that the IC card body warps, and the structure becomes complicated, making mass production difficult.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned prior art, and its purpose is to prevent the built-in IC chip from being damaged even when pressed with a ballpoint pen, etc., to prevent warping, and to prevent the structure of the IC chip from being damaged or warped. To provide an IC card that is simple and satisfies mass production.

[Summary of the invention]

The present invention has been made to achieve the above object, and includes an upper sheet member and a lower sheet member, each of which has a hard protective layer covering an IC chip on each of the upper and lower surfaces of a central sheet member on which an IC module is mounted. It is made by polymerizing and bonding parts.

That is, the IC card of the present invention has a hard protective layer on both the upper and lower surfaces of the IC chip, so that the IC card can withstand pressure from a ballpoint pen or the like.
In addition, the upper and lower sheet members are polymerized and bonded to each of the upper and lower surfaces of the central sheet member to balance the shrinkage force of the adhesive and prevent the occurrence of warping. , it is possible to simply polymerize and bond the upper and lower sheet members provided with the above-mentioned hard protective layer to the central sheet member, thereby providing a protection structure for preventing IC chip damage while also ensuring sufficient productivity. .

[Embodiments of the invention]

An embodiment of the present invention will be described using an IC card as an example, which has both of the functions required when transitioning from a magnetic card with a magnetic stripe to an IC card.

FIG. 3 is an overall perspective view showing an example of an IC card to which the present invention is applied.

The IC card 1 has a thickness that complies with ISO standards and is rectangular in shape. On the upper surface of the IC card 1, a striped magnetic stripe 2 is provided near one long side of the IC card 1. The IC card 1 has an IC module 3 housed therein at a position facing the magnetic stripe 2 and in the vicinity thereof. The IC module 3 is composed of a wiring board 4, a CPU chip 5 and a memory chip 6 mounted on the wiring board 4 while avoiding the center of the IC card 1, and a plurality of external terminals 7 provided on the wiring board 4. has been done. The memory chip 6 is, for example, a non-volatile EP-ROM.
Or it is formed by EEP-ROM. C
The PU chip 5 has a function of comparing the personal identification number input from the external terminal 7 side with the personal identification information stored in the memory chip 6, and outputting the result of the comparison.

At this time, it is desirable that the personal identification information stored in the memory chip 6 is not transmitted to the terminal side. In addition to personal identification information, the memory chip 6 also stores and maintains personal credit and transaction history.

FIG. 1 is an enlarged sectional view taken along line mm in FIG. 3, and FIG. 2 is an exploded perspective view of the IC card 1, showing that the IC card 1 has a five-layer structure.

The wiring board 4 constituting the IC module 3 is made of a flexible L-shaped hard vinyl chloride resin with a thickness of 200 μm, and the circle is slightly shorter than the long side of the IC card 1, and the width is the same as that of the CPU chip 5 and the memory chip. It is larger than 6. The wiring board 4 is provided with an opening 43 for the CPU chip 5 at the intersection of the dish part 41 and the neck part 42, and an opening 44 for the memory chip 6 near the edge of the dish part 41. Further, the wiring board 4 is provided with two rows of external terminals 7, four each, for a total of eight external terminals 7 along the upper edge of the top portion 42. CPU chip 5
A predetermined adhesive tape 8 is formed between the external terminal 7 and the memory chip 6. The lead pattern 8 and the external terminal 7 are formed by laminating copper foil on the wiring board 4 and etching it, and the external terminal 7 is further raised to a predetermined thickness with copper plating. and a joint 81 with the memory chip 6
The back side is finished with tin plating. The CPU chip 5 and the memory chip 6 each have an opening 4 for the CPU chip 5.
3 and the opening 44 for the memory chip 6, and the electrode terminal 51, which is a gold bump, is connected to the joint portion 81 of the heat exchanger 8.

This connection is made by welding gold and tin using pulse heating. In addition, the CPU chip 5 and the memory chip 6 have a sealing resin 52 formed by partially molding the joint portion 81 of the upper electrode terminal 51 and the lead pattern 8.
The lower part is fixed to the wiring board 4.
It protrudes slightly from the bottom surface.

The center sheet 10 is made of hard vinyl chloride resin and has a thickness of about 200 μm, which is thinner than the CPU chip 5 and the memory chip 6, and has an L-shaped opening 10a into which the IC module 3 is inserted.

In this L-shaped opening 10a, the plate portion 10b is located at a position facing the magnetic stripe 2 of the IC card 1, and the neck portion 10c is located at a position corresponding to the external terminal 7.

The top sheet 13 and the bottom sheet 14 respectively cover the top and bottom surfaces of the IC module 3 and the center sheet 10, are polymerized and bonded with adhesive, and are made of hard vinyl chloride resin with a thickness of 160 μm. A rectangular opening 13a at a position corresponding to the chip 5 and the memory chip 6 and having an area facing at least both chips.
, 14a are formed, and a rectangular upper metal body 17 and a rectangular lower metal body 18 are fitted into the openings 13a and 14a, respectively, to protect the chips located between these metal bodies. Lower metal body 17 and lower metal body 18
are both made of thin stainless steel plates, and are thinner than the top sheet 13 and the bottom sheet 14, and due to this difference in thickness, the CPU chip 5 and the memory chip 6
The protrusion from the wiring board 4 in the thickness direction is absorbed and dealt with. Further, the upper sheet 13 has eight small holes 13b arranged in parallel at positions corresponding to the external terminals 7, through which the external terminals 7 pass.

The upper exterior sheet 15 and the lower exterior sheet 16 cover the upper surface of the upper sheet 13 and the lower surface of the lower sheet 14, respectively, are polymerized and bonded with adhesive 19, and have a thickness of 100 mm.
Made of μm hard vinyl chloride resin. The upper exterior sheet 15 has a plurality of small holes 15a arranged in parallel at positions corresponding to the external terminals 7, through which the external terminals 7 pass, and a magnetic stripe 2 is formed on the top surface along the long sides, avoiding the center in the width direction. It is formed by applying fine powder such as iron oxide.

Further, the space between the upper exterior sheet 15 and the lower exterior sheet 16 at the positions corresponding to the opening 43 for the CPU chip 5 and the opening 44 for the memory chip 6 of the wiring board 4 is made of a two-component mixed type, for example, an epoxy resin. A filler 9 is filled to fix the CPU chip 5 and the memory chip 6.

That is, the upper sheet 13 and the lower metal body 17 are polymerized and adhered to the inner surface of the upper exterior sheet 15, and the upper sheet 2
0, and the lower sheet 14 and the lower metal body I8 are polymerized and bonded to the inner surface of the lower exterior sheet 16 to form the lower sheet 30. As mentioned above, each of the upper sheet 20 and the lower sheet 30 is composed of the same number of sheets having the same thickness, and therefore, the adhesive 19 for polymerizing and bonding each sheet is applied to the center sheet 10 at the center in the thickness direction. are formed in symmetrical positions.

Adhesive shrinks when drying, and if the shrinkage force of the adhesive is not balanced in an IC card with an extremely thin overall thickness, the entire card will warp. As mentioned above, it is very important to provide the adhesive 19 symmetrically with respect to the thickness direction of the central sheet IO in order to prevent warping.

Next, a method for manufacturing the IC card 1 according to the above embodiment of the present invention will be described. Above the center sheet 10 is the upper surface I.
・13 and the upper exterior sheet 15, and the central seam 1-
10, there is a lower sheet 14 and a lower exterior sheet 1.
6 are arranged one on top of the other in this order, and these are all wound into rolls after pre-processing predetermined openings 10a, 13a, etc., small holes 11a, 13b, etc. In FIGS. 1 and 2, ■ The lower exterior sheet 16 and the lower sheet 14 are bonded with adhesive 19.
The upper metal body 18 is inserted into the opening 14a of the lower sheet 14, and is adhered to the upper surface of the lower exterior sheet 16 with an adhesive 19 to form the lower sheet 30. In parallel with this, the upper exterior sheet 15 and the top sheet 13 are polymerized and bonded with the adhesive 19, and the top sheet 13. The upper metal body 17 is fitted into the opening 13a and adhered to the lower surface of the upper exterior sheet 15 with adhesive 19 to form the upper sheet 20.

■ Place the center sheet 10 on top of the bottom sheet 14 with adhesive 19
Glue with.

(2) The IC module 3 manufactured separately in advance is inserted into the L-shaped opening 10a of the central sheet 10, and its lower surface is adhered to the lower sheet 14 constituting the lower sheet 30 with an adhesive 19.

(2) Fill the area around the CPU chip 5 and memory chip 6 of the IC module 3 with the filler 9.

(2) The upper sheet 20 formed in (2) above is adhered to the upper surface of the center sheet 10 and the IC module 3 with adhesive 19 to integrate the whole. At this time, the external terminal 7 is connected to the small hole 1.
3b and 15a, the upper surface of the upper exterior sheet 15 is exposed to the outside as a road surface.

■ Cut the outer periphery to the specified size of the IC card.

(2) A magnetic stripe 2 is formed on the upper surface of the upper exterior sheet 15.

The thickness of the adhesive layer between each sheet is about 20 μm, and thus the IC card 1 has an average thickness of about 800 II m.
is completed.

According to the above embodiment of the present invention, the adhesive layers for polymerizing the top sheet 13, the bottom sheet 14, the upper exterior sheet 15, and the lower exterior sheet 16 are arranged symmetrically in the thickness direction with respect to the center sheet 10. Therefore, the IC card 1 can be prevented from being deformed due to warping. Furthermore, since the IC module 3 is housed avoiding the central part of the IC card 1, even if a bending moment is applied to the IC card 1 due to an external force, the C'PU chip 5 or memory chip 6 may be damaged, or the lead pattern 8 may be damaged. can prevent cutting. In addition, external terminal 7
Since the top surface of the upper exterior sheet 15 is flush, it is possible to prevent dust from accumulating on the external terminals 7 and causing poor contact. Furthermore, since the IC module 3 is fitted into the L-shaped opening 10a provided in the center sheet 10, the IC
When manufacturing the card 1, the positioning of the IC module 3 can be performed accurately and efficiently.

In the above embodiment, the upper sheet 20 and the lower sheet 30 are each formed of two sheet members, but they may be formed by polymerizing and bonding a larger number of sheet members. In this case, the upper metal body 17
Alternatively, a sheet covering the upper metal body 18 may be bonded by polymerization so that the upper metal body 17 and the upper metal body 18 are buried inside the upper sheet 20 and the lower sheet 30, respectively.

Alternatively, it may be simply a single sheet member. Similarly,
The center sheet 10 is also not limited to just one sheet, but can be made up of a plurality of sheets. Further, the upper part and the upper metal body may be formed by printing, and furthermore, a hard synthetic resin may be used as the material. Furthermore, although the upper sheet 20 and the lower sheet 30 are made to have exactly the same thickness, since the number of adhesive layers is the most important factor in warping the card, they do not necessarily have to be exactly the same thickness. good.

Furthermore, when manufacturing the IC card of the present invention, filler 9
can be provided on the IC chip in advance (or it can also be used as a hard protective layer such as the metal body mentioned above. By doing this, the IC module 3 can be mounted on the center sheet 10 and the It is possible to laminate the bottom sheet 30 at the same time.This manufacturing method makes the operation of the main assembly line more efficient.In addition, the CP
It goes without saying that the IC cart of the present invention can be modified in various ways based on the gist of the invention described above, such as that the U chip and the memory chip can be made into an integrated IC chip.

〔Effect of the invention〕

As is clear from the above explanation, the IC card of the present invention has an I.
Since the upper and lower surfaces of the C chip are covered with hard protective layers, it is possible to protect the IC chip from external forces.Moreover, the hard protective layers are provided on the upper and lower sheet members, and are attached to the central sheet. Since the card is glued to the top and bottom surfaces of one member, it is possible to prevent the entire card from warping, and even though it has this kind of IC chip protection structure, it is able to ensure sufficient productivity. effective.

[Brief explanation of drawings]

The drawings all relate to embodiments of the present invention, and FIG. 1 is an enlarged longitudinal sectional view taken along line mm in FIG. 3, FIG. 2 is an exploded perspective view, and FIG. 3 is an overall perspective view. 1... IC card, 2... Magnetic stripe, 3... IC module, 4... Wiring board, 5... CPU chip, 6... Memory chip, 7... External terminal, 8 ... Lead pattern, 9... Filler, 10... Center sheet, 10a... Opening, 13... Top sheet, 13a... Opening, 14... Bottom sheet, 14a... Opening, 15... Upper exterior sheet, 16... Lower exterior sheet, 17... Upper metal body, 18... Upper metal body, 20... Upper sheet, 30... Lower sheet,

Claims (1)

Scope of Claims: (1) A central sheet member having an IC module including at least one IC chip, a mounting portion for mounting the IC module, and at least the IC chip on an inner surface facing the central sheet member. 1. An IC card comprising an upper sheet member and a lower sheet member, each of which is provided with a hard protective layer having an area covering the central sheet member, and which are superimposed on the lower and upper surfaces of the central sheet member. (2) The IC card according to claim 1, wherein the thickness of the central sheet member is thinner than the thickness of the IC chip. (3) The IC card according to claim 1, wherein the hard protective layer is a metal layer. (4) The IC card according to claim 1, wherein the upper sheet member and the lower sheet member are each made of the same number of sheets that are polymerized and adhered. (5) The sheets constituting the upper and lower sheet members have adhesive layers at approximately symmetrical positions with the central sheet member as the center in the thickness direction. IC card.