JPS6282096A - IC card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to an IC card.

[Technical background of the invention and its problems]

Conventionally, the owner code and the owner's old machine were displayed in embossed letters as a credit card, bank card, etc., and information such as the owner code and other specific encrypted information were displayed in striped magnetic stripes. So-called magnetic cards with magnetic recording on the recording section were widely used, but because the recorded information on these magnetic cards can be easily read, third parties other than the owner can read and misuse the recorded information on the magnetic cards. There is a risk of Therefore, recently, IC cards have been used which have a built-in IC chip that operates in response to external input signals and outputs pre-installed identification information.

However, IC cards require external terminals connected to each electrode of the IC chip, and these external terminals must be approximately flush with the outer film of the IC card to prevent poor contact due to adhesion of dust, etc. Moreover, since the IC chip is easily damaged when pressed with a ballpoint pen or the like, it is also required to protect the IC chip by covering it with a metal body or the like. Satisfying the above two requirements has been one of the important issues, but conventionally there has been no product that satisfies these two requirements.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned prior art, and its purpose is to prevent contact failure due to adhesion of dust to external terminals connected to each electrode of an IC chip housed inside. To provide an IC card in which the IC chip is not damaged even when pressed with a ballpoint pen or the like.

[Summary of the invention]

In order to achieve the above-mentioned object, the present invention has an external terminal connected to each electrode of an IC chip housed inside by a conductor so as to protrude from the conductor and arranged in an opening provided in an exterior film. At the same time, the IC card is configured such that a metal body covering the IC chip is disposed between the IC chip and the exterior film, and a sheet member is superposed on the inner surface of the exterior film.

[Embodiments of the Invention] Embodiments of the present invention will be described using as an example an IC card that has both of the functions required when transitioning from a magnetic card with a magnetic stripe to an IC card.

FIG. 3 is an overall perspective view showing an example of an IC card to which the present invention is applied.

The IC card 1 has a thickness that conforms to the Is○ standard and is rectangular in shape. On the top surface of the IC card 1, a striped magnetic stripe 2 is provided near one long side of the IC card 1. The IC card 1 has an IC module 3 housed therein at a position facing the magnetic stripe 2 and in the vicinity thereof. The IC module 3 is composed of a wiring board 4, a CPU chip 5 and a memory chip 6 mounted on the wiring board 4 while avoiding the center of the IC card 1, and a plurality of external terminals 7 provided on the wiring board 4. has been done. The memory chip 6 is, for example, a non-volatile EP-ROM.
Or it is formed by EEP-ROM. C
The PU chip 5 has a function of comparing the personal identification number input from the external terminal 7 side with the personal identification information stored in the memory chip 6, and outputting the result of the comparison.

At this time, it is desirable that the personal identification information stored in the memory chip 6 is not sent to the terminal side.In addition to the personal identification information, the memory chip 6 also contains personal credit and transaction history. memorized and retained.

Figure 1 is an enlarged sectional view of Figure 3 on the [-I[[ line, Figure 2 is I
It is an exploded perspective view of the C card 1, and this IC card 1 is 7
Indicates a layered structure.

The wiring board 4 constituting the IC module 3 is made of flexible L-shaped hard vinyl chloride resin with a thickness of 200 μm, and has a length slightly shorter than the long side of the IC card 1 and a width of C.
It is larger than the PtJ chip 5 and the memory chip 6. The wiring board 4 has an opening 43 for the CPU chip 5 at the intersection of the receiving part 41 and the rough part 42, and an opening 44 for the memory chip 6 near the edge of the receiving part 41. Further, the wiring board 4 is provided with a total of eight external terminals 7, four in two rows, along the upper surface edge of the rough portion 42. CPU chip 5
A predetermined lead pattern 8 is formed between the external terminal 7 and the memory chip 6 using a conductor. The lead pattern 8 and the external terminal 7 are formed by laminating a copper foil on the wiring board 4, etching the copper foil to form the lead pattern 8, and further copper plating the external terminal 7 to a predetermined thickness. Formed by mounds. Alternatively, a copper foil having the same thickness as the height of the external terminal 7 is laminated on the wiring board 4, this copper foil is etched to temporarily form the lead pattern 8 to the same thickness as the external terminal 7, and then the lead pattern 8 is formed to have the same thickness as the external terminal 7. It can also be formed by half-etching the portion of the lead pattern 8 excluding the portion. Also CPU chip 5
The back side of the joint portion 81 with the memory chip 6 is finished by tin plating. CPU chip 5 and memory chip 6
are fitted into the opening 43 for the CPU chip 5 and the opening 44 for the memory chip 6, respectively, and the electrode terminal 51, which is a gold bump, is bonded to the joint portion 81 of the lead pattern 8. This connection is made by welding gold and tin using pulse heating. Further, the CPU chip 5 and the memory chip 6 are attached to the wiring board 4 by hardening the joint part 81 of the upper electrode terminal 51 and the lead pattern 8 with a sealing resin 52 by partial molding, and the lower part is from the bottom surface of the wiring board 4. It sticks out a little.

The center sea 1-10 is made of hard vinyl chloride resin with a thickness of 200 μm, and has an L-shaped opening 10a into which the IC module 3 is inserted. This L-shaped opening 1
0a is located at a position opposite to the magnetic stripe 2 of the C card 1, and the rough part 10c is located at a position corresponding to the external terminal 7.

The upper sheet 11 and the lower sheet 12 cover the upper and lower surfaces of the center sheet 10, respectively, are polymerized and adhered with an adhesive, and are made of hard vinyl chloride resin with a thickness of 40 μm. A CPU chip 5 is mounted on the upper surface of the lower sheet 12.
The lower surface of the memory chip 6 is in contact with the lower surface of the memory chip 6. Opening 43 for CPU chip 5 of wiring board 4 and memory chip 6
The space between the upper sheet 11 and the lower sheet 12 at the position corresponding to the opening 44 for the CPU chip 5 is filled with a two-component mixture type filler 9, such as an epoxy resin type filler 9.
and the memory chip 6 is fixed. Upper seal l-
The external terminal 7 provided on the wiring board 4 is inserted through the opening 11a.

The upper sheet and the lower sheet 14 cover the upper surface of the upper sheet 11 and the lower surface of the lower sheet 12, respectively, are polymerized and bonded with adhesive, and are made of hard vinyl chloride resin with a thickness of 100 cm. Also, a rectangular opening 13 having an area facing at least the CPU chip 5 and the memory chip 6 is located at a position corresponding to the CPU chip 5 and the memory chip 6.
a, 14a are formed, and a rectangular upper metal body 17 and a rectangular lower metal body 18 are formed in the openings 13a, 14a, respectively.
is inserted to protect both chips. The upper gold mud body 17 and the lower metal body 18 are both made of thin stainless steel plates, and are thinner than the upper sheet 13 and the lower sheet 14, and this difference in thickness allows the CPU to
The protrusion of the chip 5 and memory chip 6 from the wiring board 4 in the thickness direction is absorbed and dealt with. Further, the top sheet 13 is provided with the external terminal 7 at a position corresponding to the external terminal 7.
There are eight openings 13b arranged in parallel.

The upper exterior film 15 and the lower exterior film 16 are polymerized to cover the upper surface of the upper sheet 13 and the lower surface of the lower sheet 14, respectively, and are bonded with an adhesive 19, and have a thickness of 1.
Made of 00μm hard vinyl chloride resin. The upper exterior film 15 has a plurality of openings 15a arranged in parallel at positions corresponding to the external terminals 7, through which the external terminals 7 pass, and a magnetic stripe 2 is formed on the top surface along the long sides, avoiding the center in the width direction. It is formed by applying fine powder such as iron oxide.

Next, a method for manufacturing the rc card 1 according to the above embodiment of the present invention will be described. Upper sheet 11. above the center sheet IO. A top sheet 13 and an upper exterior film 15, and a lower sheet 12 below the center sheet 10.
The lower sheet 14 and the lower exterior film 16 are stacked and arranged in this order, and both have predetermined openings 10a,
13a, etc., small holes 11a, 13b, etc. are processed in advance and wound into a roll shape. 1 and 2, ■ The lower exterior film 16 and the lower sheet 14 are bonded with adhesive 1.
9, fit the lower metal body 18 into the opening 14a of the lower sheet 14, and apply adhesive 1 to the upper surface of the lower exterior film 16.
Glue in step 9. The upper exterior film 15 and the top sheet 13 are bonded together with an adhesive 19 in a hemodynamic manner, and the top sheet 13
The lower metal body 17 is fitted into the opening 13a and adhered to the lower surface of the upper exterior film 15 with an adhesive 19.

(2) Glue the lower sheet 12 onto the lower sheet 14 and the center sheet 10 onto the lower sheet 12 using adhesive 19.

■ Insert the IC module 3, which has been separately prepared in advance, into the L-shaped opening 10a of the center sheet 10, and adhere the lower surface to the lower sheet 12 with adhesive 19.

(2) Fill the area around the CPU chip 5 and memory chip 6 of the IC module 3 with the filler 9.

(2) The upper sheet 11 is adhered to the upper surface of the center sheet 10 and the IC module 3, and the lower surface of the upper sheet 13 is adhered to the upper surface of the upper sheet 11 using an adhesive 19 to integrate the whole. At this time, the upper surface of the external terminal 7 and the upper surface of the upper exterior film 15 are flush with each other.

■ Cut the outer periphery to the specified size of the IC card.

(2) A magnetic stripe 2 is formed on the upper surface of the upper exterior film 15.

The thickness of the adhesive layer between each sheet is approximately 20 μm, and thus an IC card 1 having an average thickness of approximately 800 μm is completed.

According to the above embodiment of the present invention, centering on the center sheet 10, the upper sheet 11, the lower sheet 12, and the upper sheet 1
3 and the lower sheet 14, the upper exterior film 15, and the lower exterior film 16 are arranged symmetrically in the vertical direction, so that the IC card 1 can be prevented from being deformed due to warping, and the module 3 can avoid the central part of the IC card 1. Therefore, even if a bending moment due to an external force is applied to the IC card 1, the CPU chip 5 and memory chip 6 are unlikely to be damaged or the lead pattern 8 is cut. Since the upper surface of the exterior film 15 is flush, it is possible to prevent dust from accumulating on the external terminals 7 and causing poor contact. Furthermore, since the IC module 3 is fitted into the L-shaped opening 10a provided in the center sheet 10, the positioning of the IC module 3 can be performed correctly and efficiently when manufacturing the IC card l, and the sheet is wound into a roll. Since it uses a magnetic card or a film, it is easy to continuously display the process, and since it is equipped with an IC chip and a magnetic stripe 2, it can also meet the demands during the transition period when switching from magnetic cards to IC cards.

Although the above embodiment shows the case where the CPU chip 5 and the memory chip 6 are separated, it is of course possible to integrate both chips and put them in one place. In this case, it is desirable that the IC chip be placed near the external terminal 7. Further, the magnetic stripe 2 can be omitted, and in this case, the manufacturing process can be further simplified. Further I
Since the C card 1 is vertically symmetrical with respect to the center sheet 10, it may be manufactured with the vertical order reversed with respect to the above embodiment.

〔Effect of the invention〕

According to the present invention, each external terminal connected to each electrode of an IC chip housed inside via a conductor is disposed in an opening provided in the exterior film so as to protrude from the conductor. The top surface of the external terminal and the top surface of the exterior film can be made flush with each other to prevent dust from adhering to the external terminal and causing poor contact, and there is at least one layer between the IC chip and the exterior film. Since a metal body having an area facing the IC chip is disposed and a sheet member is properly aligned with the inner surface of the exterior film, the IC chip will not be damaged even if pressed with a ballpoint pen or the like. Accordingly, it is possible to provide an IC cart that can reliably prevent short circuits between the electrodes of the IC chip and the metal body by the sheet member.

[Brief explanation of drawings]

The drawings all relate to embodiments of the present invention, and FIG. 1 is an enlarged vertical sectional view taken along the line III-III of FIG.
The figure is an exploded perspective view, and Figure 3 is an overall perspective view. 1... IC card, 2... Magnetic stripe, 3... IC module, 4... Wiring board, 5... CPU chip, 6... Memory chip, 7... External terminal, 8 ... Lead pattern, 9... Filled FX agent, 10... Center sheet, 10a... Opening, 11... Upper sheet, 11a... Opening, 12... Lower sheet, 13. ... Top sheet, 13a... Opening, 13b... Opening, 14... Bottom sheet, 14a... Opening, 15... Upper exterior film, 15a... Opening, 16... Lower exterior film, 17... Lower metal body, 18... Lower metal body, 51... Electrode terminal. Patent Applicant Casio Computer Co., Ltd. 5cpu Naso 70 Figure 3

Claims (1)

[Scope of Claims] An IC card in which external terminals are provided on the outer surface of the card body and are connected to electrodes of an IC chip housed inside through conductors, wherein each of the external terminals is connected to the electrodes of an IC chip housed inside the card body through a conductor. A metal body is disposed protrudingly in an opening provided in the exterior film, and has an area facing at least the IC chip between the IC chip and the exterior film; An IC card characterized by having a polymerized sheet member on the inner surface.