JPS6282745U - - Google Patents
Info
- Publication number
- JPS6282745U JPS6282745U JP1985173351U JP17335185U JPS6282745U JP S6282745 U JPS6282745 U JP S6282745U JP 1985173351 U JP1985173351 U JP 1985173351U JP 17335185 U JP17335185 U JP 17335185U JP S6282745 U JPS6282745 U JP S6282745U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor element
- recess
- die attach
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の実施例を示す半導体装置の平
面図、第２図は従来の半導体装置の部分平面図、
第３図は第２図のＡ―Ａ線断面図、第４図は第１
図のＢ―Ｂ線断面図、第５図は第１図の要部平面
図、第６図は第５図の縦断面図、第７図、第８図
、第９図は本考案の他の実施例を示す半導体装置
の要部平面図である。
２０……パツケージ本体、２０―２ａ……段部
、２０―２ｂ……切欠き部、２１……蓋体、２２
……凹部、２３……ダイアタツチ部、２４……ボ
ンデイングポスト部、２５……リード、２６……
ダイスボンド材、２７……半導体素子、２８……
ワイヤ。
FIG. 1 is a plan view of a semiconductor device showing an embodiment of the present invention, FIG. 2 is a partial plan view of a conventional semiconductor device,
Figure 3 is a sectional view taken along line A-A in Figure 2, and Figure 4 is a cross-sectional view of Figure 1.
5 is a plan view of the main part of FIG. 1, FIG. 6 is a vertical sectional view of FIG. 5, and FIGS. FIG. 2 is a plan view of main parts of a semiconductor device showing an example. 20...Package main body, 20-2a...Step part, 20-2b...Notch part, 21...Lid body, 22
...Recessed part, 23...Die attachment part, 24...Bonding post part, 25...Lead, 26...
Dice bond material, 27... Semiconductor element, 28...
wire.
Claims (1)
が形成され、かつその凹部周縁の段部に複数本の
ボンデイングポスト部が形成されたパツケージと
、 前記ダイアタツチ部に固着されると共に前記ボ
ンデイングポスト部に接続され、前記パツケージ
内に封止される半導体素子とを備えた半導体装置
において、 前記段部の壁面に切欠き部を設けたことを特徴
とする半導体装置。[Claims for Utility Model Registration] A package in which a die attach portion is formed on the bottom surface of a recess for storing a semiconductor element, and a plurality of bonding post portions are formed in a stepped portion on the periphery of the recess, and the package is fixed to the die attach portion. and a semiconductor element connected to the bonding post portion and sealed within the package, wherein a notch portion is provided in a wall surface of the step portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985173351U JPS6282745U (en) | 1985-11-11 | 1985-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985173351U JPS6282745U (en) | 1985-11-11 | 1985-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282745U true JPS6282745U (en) | 1987-05-27 |
Family
ID=31110731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985173351U Pending JPS6282745U (en) | 1985-11-11 | 1985-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282745U (en) |
-
1985
- 1985-11-11 JP JP1985173351U patent/JPS6282745U/ja active Pending