JPS6284969U - - Google Patents
Info
- Publication number
- JPS6284969U JPS6284969U JP17715585U JP17715585U JPS6284969U JP S6284969 U JPS6284969 U JP S6284969U JP 17715585 U JP17715585 U JP 17715585U JP 17715585 U JP17715585 U JP 17715585U JP S6284969 U JPS6284969 U JP S6284969U
- Authority
- JP
- Japan
- Prior art keywords
- circle
- solder joint
- center
- land shape
- chip components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例の構成図、第２図は
第１図図示実施例に用いられるマスクの一例を示
す図、第３図と第４図は本考案の作用を説明する
図、第５図と第６図は比較のための角型ランドと
半円形ランドの形状を示す図、第７図は本考案の
作用を説明する図、第８図は本考案の効果を説明
するためのランド形状と接合後のチツプ部品の傾
きとの比較データを示す図である。
２０……チツプ抵抗、２２，２２ａ，２２ｂ…
…はんだ接合面、２４，２４ａ，２４ｂ……ラン
ド。
Fig. 1 is a block diagram of an embodiment of the present invention, Fig. 2 is a diagram showing an example of a mask used in the embodiment shown in Fig. 1, and Figs. 3 and 4 are diagrams explaining the operation of the present invention. , Figures 5 and 6 are diagrams showing the shapes of a square land and a semicircular land for comparison, Figure 7 is a diagram explaining the action of the present invention, and Figure 8 is a diagram explaining the effect of the present invention. FIG. 4 is a diagram showing comparison data between the land shape for bonding and the inclination of the chip component after bonding. 20... Chip resistance, 22, 22a, 22b...
...Solder joint surface, 24, 24a, 24b...Land.
Claims (1)
ンド形状が、チツプ部品のはんだ接合面をそれぞ
れ内包する径の円形とされ、その円形中心は前記
はんだ接合面の中心に一致させて形成配置された
ことを特徴とするチツプ部品用のはんだ付けラン
ド形状。 The land shape on the wiring board to which the chip components are soldered is formed into a circle with a diameter that includes each of the solder joint surfaces of the chip components, and the center of the circle is formed and arranged to coincide with the center of the solder joint surface. A soldering land shape for chip parts featuring
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17715585U JPS6284969U (en) | 1985-11-18 | 1985-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17715585U JPS6284969U (en) | 1985-11-18 | 1985-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284969U true JPS6284969U (en) | 1987-05-30 |
Family
ID=31118090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17715585U Pending JPS6284969U (en) | 1985-11-18 | 1985-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284969U (en) |
-
1985
- 1985-11-18 JP JP17715585U patent/JPS6284969U/ja active Pending
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