JPS628598A - Mounting construction of circuit unit - Google Patents
Mounting construction of circuit unitInfo
- Publication number
- JPS628598A JPS628598A JP14792485A JP14792485A JPS628598A JP S628598 A JPS628598 A JP S628598A JP 14792485 A JP14792485 A JP 14792485A JP 14792485 A JP14792485 A JP 14792485A JP S628598 A JPS628598 A JP S628598A
- Authority
- JP
- Japan
- Prior art keywords
- circuit unit
- circuit board
- hole
- pin
- grounding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
回路ユニットの実装構造であって、集積回路のチップに
対してアースを最短かつ確実にして、特に高速、広帯域
、高利得の高周波回路の動作の安定化を得る。[Detailed Description of the Invention] [Summary] This is a mounting structure for a circuit unit, which provides the shortest and most reliable ground connection to an integrated circuit chip, thereby stabilizing the operation of high-speed, broadband, and high-gain high-frequency circuits in particular. obtain.
本発明は、光海底中継器等に用いられる高周波回路ユニ
ットの実装構造に係り、とくに集積回路のチップに対し
て高周波アースを最短かつ確実にした高周波回路ユニッ
トの実装構造に関する。The present invention relates to a mounting structure for a high frequency circuit unit used in an optical submarine repeater or the like, and more particularly to a mounting structure for a high frequency circuit unit that ensures the shortest and most reliable high frequency grounding to an integrated circuit chip.
近年、光ファイバの驚異的な進展によって実用段階に入
り、光海底ケーブル等にも使用されるようになった。し
たがって光海底中継器等に用いられる高周波回路ユニッ
トは、高速、広帯域、高利得で安定した動作が要求され
る。ところが、これら光海底中継器等の高周波回路のア
ース構造は比較的に長く、しかも複雑な構造で安定した
動作が得られず信頼性に難点があるので、アース構造を
改善し、動作を安定化して信頼性の向上を図った高周波
回路ユニットの実装構造の改善が強く要望されている。In recent years, with the amazing progress of optical fibers, they have entered the practical stage and are now being used in optical submarine cables, etc. Therefore, high-frequency circuit units used in optical submarine repeaters and the like are required to operate stably at high speed, wide band, and high gain. However, the ground structures of these high-frequency circuits such as optical submarine repeaters are relatively long and complex, making it difficult to achieve stable operation and have reliability issues. There is a strong demand for improvements in the mounting structure of high-frequency circuit units to improve reliability.
第2図は、従来の高周波回路ユニットの実装構造を説明
する図で、同図(alは側断面図、 (b)はブリント
板のある場合のアース部拡大図、(C)はプリント板の
ない場合のアース部拡大図である。Figure 2 is a diagram explaining the mounting structure of a conventional high-frequency circuit unit. It is an enlarged view of a grounding part when there is no grounding part.
図において、高周波回路ユニットを搭載するための孔を
穿設してなるプリント板1の、孔部の対応するケース5
に熱伝導の良好な金属たとえば銅等からなるブロック4
を取着し、このブロック4に、集積回路等の実装部品2
を実装してなる回路基板3を、ゴム等からなる緩衝部材
8と、押え金具9を介して締付ねじ10で螺着したるの
ち、第2図(b)に示すように、プリント板1のアース
パターンとブロック4をアース接続線6で接続する。そ
して回路基板3のアースを要する位置とアース接続線6
を、導電性の良好な金属たとえば金等の接続リボン7で
接続するか、または、第2図(C)に示すように、プリ
ント板1のない場合はブロック4にアース接続線6を接
続したるのち、回路基板3のアースを要する位置とアー
ス接続線6を、導電性の良好な金属たとえば金等の接続
リボン7で接続する構造となっている。In the figure, a case 5 corresponding to the hole of a printed board 1 having a hole for mounting a high frequency circuit unit is shown.
Block 4 made of a metal with good thermal conductivity, such as copper, etc.
Mounted parts 2 such as integrated circuits are attached to this block 4.
The printed circuit board 3 is mounted on a buffer member 8 made of rubber or the like, and is screwed with a tightening screw 10 via a presser fitting 9, as shown in FIG. 2(b). The ground pattern and the block 4 are connected by a ground connection line 6. Then, the position of the circuit board 3 where grounding is required and the grounding connection wire 6
are connected with a connecting ribbon 7 made of a metal with good conductivity, such as gold, or if there is no printed circuit board 1, a ground connecting wire 6 is connected to the block 4, as shown in FIG. After that, a position on the circuit board 3 that requires grounding is connected to a grounding line 6 using a connecting ribbon 7 made of a metal with good conductivity, such as gold.
上記従来の回路ユニットの実装構造にあっては、回路ユ
ニットを実装する周囲にプリント板lのある場合もない
場合も、アース接続線および接続リボンを用いてアース
する構造となっているので、実装部品(集積回路)のチ
ップに対してアースが長く、かつ複雑なため高周波回路
の動作の安定化が得られず、信頼性に難点があるという
問題点があった。In the conventional circuit unit mounting structure described above, whether there is a printed board l around the circuit unit or not, the ground connection wire and connection ribbon are used to ground the circuit unit. Since the ground for the chip of the component (integrated circuit) is long and complex, it is difficult to stabilize the operation of the high frequency circuit, and there are problems with reliability.
本発明は、上記の問題点を解決して、高周波回路の動作
の安定と、信頼性の向上を図った回路ユニットの実装構
造を提供するものである。The present invention solves the above-mentioned problems and provides a circuit unit mounting structure that stabilizes the operation of a high-frequency circuit and improves its reliability.
すなわち、回路ユニットの実装構造において、部品2を
実装してなる回路基板3のアースを必要とする部分の近
傍に孔31を設け、この回路基板3を搭載するブロック
4に、回路基板3に形成した孔31に対応する位置に、
ピン13を植設して、ピン13を介してアースを行なう
ようにしたことにょうて解決される。That is, in the mounting structure of the circuit unit, a hole 31 is provided near a portion of the circuit board 3 on which the component 2 is mounted that requires grounding, and a hole 31 is provided in the block 4 on which the circuit board 3 is mounted. At the position corresponding to the hole 31,
This problem is solved by installing the pin 13 and performing grounding through the pin 13.
上記回路ユニットの実装構造は、回路基板に孔を形成し
、この孔に対応する放熱ブロックの位置にピンを植設し
て、回路基板のアース位置とピンとを金具で接続して、
集積回路のチップに対してアースを最短かつ確実とした
ものである。The mounting structure of the circuit unit is as follows: A hole is formed in the circuit board, a pin is implanted in the position of the heat dissipation block corresponding to the hole, and the ground position of the circuit board and the pin are connected with a metal fitting.
This provides the shortest and most reliable grounding for integrated circuit chips.
第1図は、本発明の一実施例を説明する図で、同図(a
lは側断面図、(b)は要部拡大断面図で、第2図と同
等の部分については同一符号を付している。FIG. 1 is a diagram illustrating an embodiment of the present invention.
1 is a side sectional view, and (b) is an enlarged sectional view of main parts, in which the same parts as in FIG. 2 are given the same reference numerals.
図において、回路ユニットを搭載するための孔を穿設し
てなるプリント板1の、孔部の対応するケース5に熱伝
導の良好な金属たとえば銅等からなり、ピン13を植設
する座ぐり41を形成して導電性の良好な金属たとえば
銅等からなるピン13を植設したブロック4を取着し、
このブロック4に、集積回路等の実装部品2゛′を実装
し、ブロブり4に植設したピン13の挿通する孔31を
設けた回路基板3を、ゴム等からなる緩衝部材8と、押
え金具9を介して締付ねじ10で螺着したるのち、アー
ス接続する導電性の良好な金属たとえば銅等からなる金
具4をブロック4に植設したピン13に嵌入し、金具4
の他の端部を回路基板3のアース位置に接着した状態で
、ピン13に嵌入した金具14を圧接した構造である。In the figure, a case 5 corresponding to the hole of a printed circuit board 1 having a hole for mounting a circuit unit is made of a metal with good heat conduction, such as copper, and has a counterbore in which a pin 13 is implanted. 41 and a block 4 having pins 13 made of a metal with good conductivity, such as copper, is attached.
Mounted parts 2'' such as integrated circuits are mounted on this block 4, and a circuit board 3 having a hole 31 through which a pin 13 implanted in the blob 4 is inserted is placed between a buffer member 8 made of rubber or the like and a presser. After screwing the clamping screw 10 through the metal fitting 9, the metal fitting 4 made of a metal with good conductivity, such as copper, for ground connection is inserted into the pin 13 implanted in the block 4.
It has a structure in which a metal fitting 14 fitted into a pin 13 is pressed into contact with the other end of the pin 13 being bonded to the ground position of the circuit board 3.
なお、本実施例ではピン13および金具14を銅につい
て説明したが、銅に限らず導電性の良好で高周波抵抗の
小さい金あるいは金メッキを施した黄銅その他であって
も構わない。In this embodiment, the pin 13 and the metal fittings 14 are made of copper, but they are not limited to copper, and may be made of gold, gold-plated brass, or other materials that have good conductivity and low high-frequency resistance.
以上の説明から明らかなように、本発明によれば集積回
路のチップに対してアースが最短かつ確実に行なえ、動
作の安定化が図れるとともに、信頼性の向上に極めて有
効である。As is clear from the above description, according to the present invention, the integrated circuit chip can be grounded as quickly and reliably as possible, stabilizing the operation, and being extremely effective in improving reliability.
第1図は、本発明の一実施例を説明する図で、同図(a
)は側断面図、(b)は要部拡大断面図、第2図は、従
来の回路ユニットの実装構造を説明する図で、同図(a
lは側断面図、 (b)はプリント板のある場合のアー
ス部拡大図、(C)はプリント板のない場合のアース部
拡大図である。
図において、1はプリント板、2は実装部品、3は回路
基板、4はブロック、5はケース、6は7−ス専属線、
7は接続リボン、8は緩衝部材、9は押え金具、10は
締付ねし、11は取付金具、12は止めねじ、13はビ
イ、14は金具、31は孔、41は1o呼Hi−も”
イσすjずrdb七σ
416雌馬FI5芝イ目fi]ニント偽ス4くL1名虹
第1図FIG. 1 is a diagram illustrating an embodiment of the present invention.
) is a side sectional view, (b) is an enlarged sectional view of the main part, and FIG. 2 is a diagram explaining the mounting structure of a conventional circuit unit.
1 is a side sectional view, (b) is an enlarged view of the ground portion with a printed board, and (C) is an enlarged view of the ground portion without the printed board. In the figure, 1 is a printed board, 2 is a mounted component, 3 is a circuit board, 4 is a block, 5 is a case, 6 is a 7-seat exclusive line,
7 is a connecting ribbon, 8 is a buffer member, 9 is a holding metal fitting, 10 is a tightening screw, 11 is a mounting metal fitting, 12 is a set screw, 13 is a bead, 14 is a metal fitting, 31 is a hole, 41 is a 1 o call Hi- Mo” Iσsujzurdb7σ 416 mare FI5 Shibaimefi] Ninto False 4kuL1 Name Rainbow Figure 1
Claims (1)
必要とする部分の近傍に孔(31)を設け、 前記回路基板(3)を搭載するブロック(4)に、前記
回路基板(3)に形成した孔(31)に対応する位置に
、ピン(13)を植設して、 前記ブロック(4)に植設したピン13を介してアース
するようにしたことを特徴とする回路ユニットの実装構
造。[Claims] A block (4) on which a hole (31) is provided near a portion of a circuit board (3) on which the component (2) is mounted that requires grounding, and the circuit board (3) is mounted thereon. A pin (13) is installed at a position corresponding to the hole (31) formed in the circuit board (3), and grounding is achieved through the pin 13 installed in the block (4). A circuit unit mounting structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14792485A JPS628598A (en) | 1985-07-04 | 1985-07-04 | Mounting construction of circuit unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14792485A JPS628598A (en) | 1985-07-04 | 1985-07-04 | Mounting construction of circuit unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS628598A true JPS628598A (en) | 1987-01-16 |
Family
ID=15441163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14792485A Pending JPS628598A (en) | 1985-07-04 | 1985-07-04 | Mounting construction of circuit unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS628598A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146487U (en) * | 1989-05-15 | 1990-12-12 |
-
1985
- 1985-07-04 JP JP14792485A patent/JPS628598A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146487U (en) * | 1989-05-15 | 1990-12-12 |
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