JPS6286821A - Semiconductor manufacturing equipment - Google Patents

Abstract

PURPOSE:To form several kinds of pellets on one wafer by using plural masks and by selecting a combination of the selection of a mask the driving method of the wafer. CONSTITUTION:A mask controller 21 selects specific one mask among plural masks 11-14 supported by a susceptor 61 and switches to an optical system for copying and exposure. For the exposure, a required mask is selected among the masks installed on the susceptor 61 by rotating the susceptor 61 a required angle with the controller 21. By selecting a combination of selecting the masks and the driving method of a wafer, the arrangement of pellets on the wafer can be changed. This enables forming several kinds of the pellets on one wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to semiconductor manufacturing equipment, and particularly to exposure equipment.

[Conventional technology]

Conventionally, this type of exposure apparatus has the following steps, as shown in FIG. 4(a):
Using one mask 11 on which one type of mask pattern 15 is formed or one mask 21 on which several types of mask patterns 15 to 18 are formed as shown in FIG. As shown in FIG. 5, several types of masks/mother turns 15 to 18 are transferred and exposed on the same wafer 41, or one type of mask/mother turns 15 is exposed as shown in FIG.
Multiple transfer exposures were performed. A ret is formed in each of the mask pattern portions transferred onto the wafer 41 and exposed.

[Problem that the invention seeks to solve]

The production method using one type of bereno)n+ shown in Figure 5 is as follows:
It was a very efficient production method for producing large quantities of small varieties. However, high-mix, low-volume production is not necessarily a good idea.

In the wafer pretreatment process for forming the diffusion layer and wiring layer, the production efficiency improves as the number of wafers of the same type increases. Therefore, the production method using wafers composed of an array of one type of pellets has a problem that, in the case of high-mix, low-volume production, the number of wafers of the same type decreases, resulting in a decrease in production efficiency.

One possible method for increasing the number of wafers of the same type in high-mix, low-volume production is a production method using wafers arranged in several types of wafers (n1 to n4) as shown in FIG.

Conventionally, the mask used in this case had several types of masks and turns formed on one mask as shown in Figure 4(b), so the combination of each mask and mother turns was fixed and could not be changed arbitrarily. was impossible.

The present invention solves the above-mentioned problems and provides a semiconductor manufacturing apparatus that allows flexibility in the combination of masks and patterns and transfers and exposes mask patterns of this combination onto the same wafer.

[Failure to solve the problem]

The present invention provides a semiconductor manufacturing apparatus that repeatedly transfers and exposes a plurality of mask patterns onto the same wafer, which includes a plurality of masks each having one type of mask pattern formed thereon, and a mask support stand that supports the plurality of masks. , a mask control unit that selects a specific mask from among the plurality of masks supported on the mask support base, and switches and installs the specific mask in an optical system for transfer exposure using the mask support base; This is a semiconductor manufacturing apparatus characterized by having the following.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, this embodiment includes a light source 19, an optical system 20, a wafer drive mechanism 60, and a plurality of masks 1 each having four turns 15 to 18 of one type of mask.
A mask support stand 61 that supports 1 to 14 on the same circumference;
A specific mask is selected by rotating the mask support base 61 by a required angle, and the specific mask is transferred to the optical system 20.
It has a mask control section 21 that is switched and installed between the two. Here, a mask pattern is formed on each mask so that the external shape and dimensions are unified. Each of the masks 11 to 14 mounted on the mask support stand 61 is subjected to baseline offset from the wafer by the baseline offset mechanism 62 before proceeding to the exposure operation. In the exposure operation, the mask control unit 21 rotates the mask support 61 by a necessary angle, thereby selecting a necessary mask from among the masks mounted on the mask support 61. By selecting a combination of mask selection and wafer driving method, the arrangement of the pellets on the wafer can be changed, for example, as shown in FIGS. 2 and 3. Figure 2 shows nl, n
2. A case is shown in which four types of bellets n3 and n4 are repeatedly arranged, and FIG. 3 shows a case in which three types of bellets J, n2 and n3 are repeated in each row.

〔Effect of the invention〕

As explained above, the present invention uses a plurality of masks and selects combinations of masks, wafers, and driving methods to form several types of wavelets on one wafer, and to arbitrarily create the combinations. Therefore, it is very effective in high-mix, low-volume production where several types of pellets are arranged on one wafer.

Furthermore, by selecting only one type of mask from among the masks mounted on the mask support stand, only one type of pellet can be used on one wafer, making it possible to cope with high-volume production of small numbers of products.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an exposure apparatus of the present invention, FIGS. 2, 3, and 5 are plan views of a wafer showing an arrangement of Nilets;
FIG. 4 is a plan view of a conventional mask. 11.12, 13.14... Mask, 15.16, 1
7.18...Masukutsu mother turn, 19...Light source, 2
0... Optical system, 21... Mask control section, 41...
Wafer, 60... Wafer drive mechanism, 61... Mask support stand, 62... Baseline offset mechanism. Patent applicant NEC Corporation%1 Figure 2 Figure 3 (α) (b) Figure 4

Claims (1)

[Claims] (1) In a semiconductor manufacturing apparatus that repeatedly transfers and exposes multiple mask patterns onto the same wafer, a plurality of masks each having one type of mask pattern formed thereon, and a mask support stand that supports the multiple masks are used. , a specific one from among the plurality of masks supported on the mask support stand.
1. A semiconductor manufacturing apparatus, comprising: a mask control unit that selects one mask and switches and installs the specific mask in an optical system for transfer exposure using the mask support.