JPS62876A - Test equipment for semiconductor integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a test device for BAFi semiconductor integrated circuits.

[Conventional technology]

Figure 3 shows a conventional test equipment for semiconductor integrated circuits.
1 (apply test signal to 21, signal line +21 K M
The main body of the test equipment measures the current and signal line (1M flowing from 2 tubes) and compares the measured value with a pre-programmed standard value to determine whether the device under test is good or defective. One end of (3) is connected to the signal line (21), and the test equipment is turned on and off based on the program of the main body (υ).
A peripheral circuit having a switch means (4) consisting of a relay ρ which is turned off, (5) a contact probe connected to the other end of the switch means (4), and (6) a contact probe connected to the test apparatus main body tl+. Provided between the signal line (2) and the signal line (2).

The test equipment main body (one monitor point to monitor the current or voltage applied to the device under test from υ, (7) is the semiconductor integrated circuit which is the device under test, P-type semiconductor It has a type of diffusion layer audience.

Next, a semiconductor integrated circuit test apparatus K configured in this manner will be described.
This section describes a method for testing semiconductor integrated circuits. First, contact probe (5)? Wave number (7L) Contact with layer cutting, trial Ii1. Device body 11? When operated, the switch means (4) is turned on based on the program of test device main body (11), and the signal line +27 IC
The predetermined voltage is #]. As a result, the semiconductor integrated circuit (force diffusion layer (RB) and the semiconductor substrate (
ra) K current flows or the semiconductor integrated circuit (7
) from the semiconductor substrate (ra) and diffusion layer (1b) to the contact probe (5), switch means +41 and signal II
A current flows through +21 Y and is measured by these tiv test equipment body il+, and the measured value and the pre-programmed standard value? Comparison of semiconductor integrated circuits (7)
Good or defective products? It depends on what you decide.

In addition, a semiconductor integrated circuit (7) different from the semiconductor integrated circuit (7)
When testing a semiconductor integrated circuit (7) (not shown),
At the end of the shadow 11', the switch means +41 is turned off based on the program of the test equipment main body tll, and another semiconductor integrated circuit? A switch connected between a contact probe (not shown) for measurement and a signal line (21!
R (not shown) will be turned on and tested in the same manner as above.

[Problem that the invention seeks to solve]

Therefore, in the semiconductor integrated circuit testing device IC configured as described above, the switching means (4) the round a signal,
If a disconnection or short circuit occurs in vilf21 etc. for some reason, normal measurement conditions cannot be obtained and the semiconductor integrated circuit (7), which should have been a good product, will not be able to obtain normal measurement conditions. There is a high risk of erroneously determining that a semiconductor integrated circuit is a defective product or a semiconductor integrated circuit that should be a defective product.
)￥There is also a risk that the product will be defective.b
It was. In particular, there are many signal lines +21, D switch means and contact probes? This becomes a very big problem when connecting and testing a large number of devices.

This invention was made in view of the above-mentioned points, and it is a test for semiconductor integrated circuits that allows the switching means to be checked before testing the semiconductor integrated circuit, and allows the test to be performed under normal atmospheric pressure measurement conditions. The purpose is to obtain equipment.

c Problem? Means to solve] A test device for semiconductor integrated circuits according to the present invention is a test device for semiconductor integrated circuits.

A diode is connected between one end of the switch means to which a signal line is connected and the other end of the switch means and a check signal line to which a check signal of the switch means is applied.

[Effect]

In this invention, the diode can transmit a check signal to the switch means before testing the semiconductor integrated circuit, and acts so as not to have any influence when testing the semiconductor integrated circuit.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 shows an off-check state of the switch means (4) before testing a semiconductor integrated circuit, and FIG. 2 shows an on-check state. As shown in Figure 2, (8) is a diode whose cand is connected to the other end of the switch means +41, (91Fi) is connected to the anode of this diode, and a check signal is applied from the test equipment main body (1) based on the program. The check signal line αG is the test equipment main body (
1] and the signal line (2) and monitors the current or voltage appearing on the check signal line +91K. The switch means (the current checking method will be described below. First, the contact probe (5) is brought into contact with the diffusion layer (3) K, and the test device main body (1) is operated for a temporary test. Based on the program of the test!1tcz main body TL), .

The switch means +41 is turned off, resulting in the state shown in FIG. At this time, the test device main body (1) applies a forward voltage to the diode +9. For example, conditions are set so that Ov is output to one monitor point (6) on the signal line (2) and 1v is output to one point OG of the second monitor on the check signal line +91. Then, the switch means (4
) is normal and in the off state.

The semiconductor integrated circuit (power diffusion layer (RB) and substrate (7a)
A K current flows, but this current is only a small leakage current because the diffusion layer (1b) and the substrate (ra) have a junction relationship in opposite directions. Therefore, one monitor (6
No current is detected at point 1, and a slight leakage current is detected at one point H of the second monitor. On the other hand, if the switch means is short-circuited for some reason and is in an abnormal state, a signal Jlt2+ is transmitted from the check signal line +91 via the diode (8) and the short-circuited switch means (4).
A current will flow through. The value of this voltage depends on the resistance value at one point of the second monitor (aσρ) and one point of the monitor (61i).
I! i! Since the f angle is larger, the second monitor has one point Q.
By measuring the current value at 2, it is possible to check whether the switch means +41 is off.

Next, the switch means (4) is turned on based on the program in the main body of the test device (see Figure 2). Then, the switch means (4) is normal and in the b-on state. If so, the check (FF4+41191ρ・'KR flows through the diode (8) and the switch means 14' to the signal 51+21, and the resistance value at the second monitor point 0 (IK is from the second monitor point 8a to the monitor point (61t) On the other hand, if the switch means +41 is turned off due to some reason, the trlL value appears.
The enemy expansion layer (γb) of the semiconductor integrated circuit (7) and the substrate (ra) K1! Current E flows, and a minute leakage current value appears at one point aa on the second monitor. Therefore, it is necessary to measure the current value at one point 111#c on the second monitor. - allows on-checking of the switch means (4).

Then, the test device main body III switches the switch means +4 to either the above-mentioned off-check or on-check.
The program is programmed to stop the primary test of the semiconductor integrated circuit (7) when it is determined that the semiconductor integrated circuit (7) is abnormal, causing damage to the semiconductor integrated circuit (7). It's something that's being prevented. On the other hand, in both off-check and on-check, the switch means (41
If it is determined that the is normal, the semiconductor device main body i17
FiSemiconductor integrated circuit (similar to that shown in Figure 3 above)
])) ◎At this time, the diode (
8) Switch means +41 and contact probe (5)
Since the KfM connection is made in the opposite direction to the connection point with
There are some things that do not affect. If you want even more accuracy, you can use @2 monitors (4 kg per point) to ensure that a voltage in the opposite direction is always applied to the diode (8) during the test of the semiconductor integrated circuit (7). ).〇 [Effect of the Invention] As described above, this invention provides a check signal between the other end of the switch means to which the signal line is connected to -@ and the check signal of the switch means. A diode Yl! is connected between the check signal line and the check signal line to which Yl! is applied.
Since the continuation is also set as D, it is possible to check the switching means before testing the semiconductor integrated circuit, reduce false judgments of the semiconductor integrated circuit, and prevent damage to the semiconductor integrated circuit.
It has the effect of being able to suppress giving.

[Brief explanation of drawings]

Figures 1 and 2 show an embodiment of Jin's invention. Figure 1 is a circuit diagram of the main part in an off-check state, Figure 2 is a circuit diagram of the main part in an on-check state, and Figure 3 is a conventional semiconductor. Test equipment for integrated circuits [tl: Ij1 part time-diagram]. In the figure, (2: is a signal line, (4J is a switch means, (
5) is a contact probe, (7) is a semiconductor integrated circuit,
(8) is a diode, t9) is a check signal line.
The same reference numerals in each figure indicate the same or equivalent parts. Figure 1 1g2 Figure 3 rM Procedural amendment (voluntary) Showa Ting 1% 2081, case indication Patent application No. 60-140767 2
, Name of the invention Relationship with the case of a person making amendments to test equipment for semiconductor 'JS VT circuits Patent applicant address 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name (601) Mitsubishi Electric Corporation Representative Ambition Gi
Moriya 4, agent address 2-2-3-5 Marunouchi, Chiyoda-ku, Tokyo
, Target of amendment 6, Contents of amendment (1) In the 6th line of page 3 of the specification, "these currents flow into" was corrected to "these currents flow into the test device body (1)" do. (2) r F! on page 6, line 2 of the specification. j (3) Correct J to 1st layer (7b) J. (3) "Diode (9)" on page 6, lines 5-6 of the specification
Correct the text to read "diode (8)." (4) Amend the drawing as shown in the attached sheet. that's all

Claims (1)

[Claims] A switch means having one end connected to a signal line to which a test signal of the semiconductor integrated circuit is applied, a contact probe connected to the other end of the switch means, and a check signal of the switch means being applied to the other end of the switch means. Test equipment for semiconductor integrated circuits equipped with a diode connected between the check signal line and the check signal line.