JPS63111696A - 配線基板およびその製造方法 - Google Patents

配線基板およびその製造方法

Info

Publication number
JPS63111696A
JPS63111696A JP61259164A JP25916486A JPS63111696A JP S63111696 A JPS63111696 A JP S63111696A JP 61259164 A JP61259164 A JP 61259164A JP 25916486 A JP25916486 A JP 25916486A JP S63111696 A JPS63111696 A JP S63111696A
Authority
JP
Japan
Prior art keywords
pattern
conductor
wiring board
layer
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61259164A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365033B2 (mo
Inventor
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP61259164A priority Critical patent/JPS63111696A/ja
Priority to EP87309593A priority patent/EP0266210B1/en
Priority to DE8787309593T priority patent/DE3784213T2/de
Publication of JPS63111696A publication Critical patent/JPS63111696A/ja
Publication of JPH0365033B2 publication Critical patent/JPH0365033B2/ja
Priority to US07/817,996 priority patent/US5153709A/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP61259164A 1986-10-29 1986-10-30 配線基板およびその製造方法 Granted JPS63111696A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP61259164A JPS63111696A (ja) 1986-10-30 1986-10-30 配線基板およびその製造方法
EP87309593A EP0266210B1 (en) 1986-10-29 1987-10-29 Electronic apparatus comprising a ceramic substrate
DE8787309593T DE3784213T2 (de) 1986-10-29 1987-10-29 Elektronischer apparat mit einem keramischen substrat.
US07/817,996 US5153709A (en) 1986-10-29 1992-01-09 Electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61259164A JPS63111696A (ja) 1986-10-30 1986-10-30 配線基板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS63111696A true JPS63111696A (ja) 1988-05-16
JPH0365033B2 JPH0365033B2 (mo) 1991-10-09

Family

ID=17330236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61259164A Granted JPS63111696A (ja) 1986-10-29 1986-10-30 配線基板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS63111696A (mo)

Also Published As

Publication number Publication date
JPH0365033B2 (mo) 1991-10-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term