JPS6311733Y2 - - Google Patents

Info

Publication number
JPS6311733Y2
JPS6311733Y2 JP1983050472U JP5047283U JPS6311733Y2 JP S6311733 Y2 JPS6311733 Y2 JP S6311733Y2 JP 1983050472 U JP1983050472 U JP 1983050472U JP 5047283 U JP5047283 U JP 5047283U JP S6311733 Y2 JPS6311733 Y2 JP S6311733Y2
Authority
JP
Japan
Prior art keywords
resin
integrated circuit
filling frame
filled
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983050472U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59155741U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983050472U priority Critical patent/JPS59155741U/ja
Publication of JPS59155741U publication Critical patent/JPS59155741U/ja
Application granted granted Critical
Publication of JPS6311733Y2 publication Critical patent/JPS6311733Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1983050472U 1983-04-04 1983-04-04 混成集積回路の封止構造 Granted JPS59155741U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983050472U JPS59155741U (ja) 1983-04-04 1983-04-04 混成集積回路の封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983050472U JPS59155741U (ja) 1983-04-04 1983-04-04 混成集積回路の封止構造

Publications (2)

Publication Number Publication Date
JPS59155741U JPS59155741U (ja) 1984-10-19
JPS6311733Y2 true JPS6311733Y2 (it) 1988-04-05

Family

ID=30180930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983050472U Granted JPS59155741U (ja) 1983-04-04 1983-04-04 混成集積回路の封止構造

Country Status (1)

Country Link
JP (1) JPS59155741U (it)

Also Published As

Publication number Publication date
JPS59155741U (ja) 1984-10-19

Similar Documents

Publication Publication Date Title
US5747875A (en) Semiconductor power module with high speed operation and miniaturization
JP3919398B2 (ja) 半導体モジュール
JPS6227750B2 (it)
JP2781329B2 (ja) 半導体パワーモジュールおよびその製造方法
JPH07263618A (ja) 混成集積回路装置
JP2579222Y2 (ja) 樹脂封止型回路装置
JPS611042A (ja) 半導体装置
JPH0726844Y2 (ja) 混成集積回路
JPS6311735Y2 (it)
JPH0561780B2 (it)
JPS629730Y2 (it)
JP7783513B2 (ja) 半導体モジュール
JPH046860A (ja) 半導体装置
JP2561470Y2 (ja) 絶縁封止電子部品
JPS622776Y2 (it)
JP2743157B2 (ja) 樹脂封止型半導体装置
JPS6223096Y2 (it)
JP2906635B2 (ja) 混成集積回路装置
JP2568752B2 (ja) 半導体装置
JP2552887Y2 (ja) 絶縁物被覆電子部品
JPS5812455Y2 (ja) 半導体装置用リ−ドフレ−ム
JPS5835377B2 (ja) 電子機器の製造方法
JPH0412677Y2 (it)
JP2585890B2 (ja) 半導体装置
JPH0351299B2 (it)