JPS6311742Y2 - - Google Patents

Info

Publication number
JPS6311742Y2
JPS6311742Y2 JP1981092723U JP9272381U JPS6311742Y2 JP S6311742 Y2 JPS6311742 Y2 JP S6311742Y2 JP 1981092723 U JP1981092723 U JP 1981092723U JP 9272381 U JP9272381 U JP 9272381U JP S6311742 Y2 JPS6311742 Y2 JP S6311742Y2
Authority
JP
Japan
Prior art keywords
lead frame
pellets
inner peripheral
peripheral edge
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981092723U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57203562U (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981092723U priority Critical patent/JPS6311742Y2/ja
Publication of JPS57203562U publication Critical patent/JPS57203562U/ja
Application granted granted Critical
Publication of JPS6311742Y2 publication Critical patent/JPS6311742Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP1981092723U 1981-06-22 1981-06-22 Expired JPS6311742Y2 (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981092723U JPS6311742Y2 (2) 1981-06-22 1981-06-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981092723U JPS6311742Y2 (2) 1981-06-22 1981-06-22

Publications (2)

Publication Number Publication Date
JPS57203562U JPS57203562U (2) 1982-12-24
JPS6311742Y2 true JPS6311742Y2 (2) 1988-04-05

Family

ID=29887738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981092723U Expired JPS6311742Y2 (2) 1981-06-22 1981-06-22

Country Status (1)

Country Link
JP (1) JPS6311742Y2 (2)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5324780A (en) * 1976-08-20 1978-03-07 Hitachi Ltd Lead frame
JPS5399962U (2) * 1977-01-14 1978-08-12
JPS5426359U (2) * 1977-07-25 1979-02-21

Also Published As

Publication number Publication date
JPS57203562U (2) 1982-12-24

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