JPS63133527A - 露光プリアライメント装置 - Google Patents
露光プリアライメント装置Info
- Publication number
- JPS63133527A JPS63133527A JP28110986A JP28110986A JPS63133527A JP S63133527 A JPS63133527 A JP S63133527A JP 28110986 A JP28110986 A JP 28110986A JP 28110986 A JP28110986 A JP 28110986A JP S63133527 A JPS63133527 A JP S63133527A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resist
- laser
- exposure
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 239000004065 semiconductor Substances 0.000 claims abstract description 12
- 238000001259 photo etching Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 abstract description 14
- 239000002904 solvent Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 238000005530 etching Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000013307 optical fiber Substances 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000007921 spray Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000013480 data collection Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28110986A JPS63133527A (ja) | 1986-11-25 | 1986-11-25 | 露光プリアライメント装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28110986A JPS63133527A (ja) | 1986-11-25 | 1986-11-25 | 露光プリアライメント装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63133527A true JPS63133527A (ja) | 1988-06-06 |
| JPH0569291B2 JPH0569291B2 (2) | 1993-09-30 |
Family
ID=17634477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28110986A Granted JPS63133527A (ja) | 1986-11-25 | 1986-11-25 | 露光プリアライメント装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63133527A (2) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02114628A (ja) * | 1988-10-25 | 1990-04-26 | Ushio Inc | ウエハ周辺露光装置 |
| JP2022118376A (ja) * | 2021-02-02 | 2022-08-15 | 東京エレクトロン株式会社 | 基板処理装置、基板処理システム、基板処理方法及びコンピュータ記憶媒体 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5218175A (en) * | 1975-08-01 | 1977-02-10 | Hitachi Ltd | Circuit pattern formation method and its device |
| JPS59138335A (ja) * | 1983-01-28 | 1984-08-08 | Toshiba Corp | ウエハ端部のレジスト露光装置 |
| JPS59158520A (ja) * | 1983-02-28 | 1984-09-08 | Toshiba Corp | 照射装置 |
| JPS6060724A (ja) * | 1983-09-14 | 1985-04-08 | Toshiba Corp | 半導体露光装置 |
| JPS61137320A (ja) * | 1984-12-10 | 1986-06-25 | Hitachi Ltd | ウエハ処理装置 |
-
1986
- 1986-11-25 JP JP28110986A patent/JPS63133527A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5218175A (en) * | 1975-08-01 | 1977-02-10 | Hitachi Ltd | Circuit pattern formation method and its device |
| JPS59138335A (ja) * | 1983-01-28 | 1984-08-08 | Toshiba Corp | ウエハ端部のレジスト露光装置 |
| JPS59158520A (ja) * | 1983-02-28 | 1984-09-08 | Toshiba Corp | 照射装置 |
| JPS6060724A (ja) * | 1983-09-14 | 1985-04-08 | Toshiba Corp | 半導体露光装置 |
| JPS61137320A (ja) * | 1984-12-10 | 1986-06-25 | Hitachi Ltd | ウエハ処理装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02114628A (ja) * | 1988-10-25 | 1990-04-26 | Ushio Inc | ウエハ周辺露光装置 |
| JP2022118376A (ja) * | 2021-02-02 | 2022-08-15 | 東京エレクトロン株式会社 | 基板処理装置、基板処理システム、基板処理方法及びコンピュータ記憶媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0569291B2 (2) | 1993-09-30 |
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